Discussion Zen 5 Speculation (EPYC Turin and Strix Point/Granite Ridge - Ryzen 9000)

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LightningZ71

Golden Member
Mar 10, 2017
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Maybe Zen6 looks like N3 E cc'd with 16 MB L3, stacked on 64 MB N4C cache die connected to an N4P RDNA4 IODie with either 2 wgp and no cache, or 10 wgp stacked on 32 MB of N4C cache die.
 

Hitman928

Diamond Member
Apr 15, 2012
6,391
11,392
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Aaaaannd we're back to +40% for Zen5. On server looks like the new SKUs did gain about 40% with the same number of cores.

Efficiency is way up too:

The consistent ~1.4x uplift from the EPYC 9654 to EPYC 9655 was all the more impressive when finding that the average CPU power use only increased by about ~5% on average and only an 11% increase to the default/peak TDP.
 

Jan Olšan

Senior member
Jan 12, 2017
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Uh wow, based on statements made by AMD per GN, the 9950X3D might have similar clocks to the vanilla part. The cache wasn’t the limit, the cores were because of lack of cooling. Cache is now under the cores, so no more limit.
Spoiler alert: ... the clocks statement was about the CCD without the cache die.

Wouldn't be the first time people misread too much into statement that were meant to say something else.
 

Gideon

Golden Member
Nov 27, 2007
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Spoiler alert: ... the clocks statement was about the CCD without the cache die.

Wouldn't be the first time people misread too much into statement that were meant to say something else.
Considering what we got from the leaker and the strong hints for 2x X3D dies, I still think the most probable outcome is

5.3 Ghz boost clock for the 9900X3D
5.4 Ghz boost clock for the 9950X3D

Two dies would also make 9900X3D an actually viable product (in gaming)
 

Hitman928

Diamond Member
Apr 15, 2012
6,391
11,392
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Very interesting info about the stacking changes on the new X3D chips:





Yes, AMD should have known that thinning a die to that degree drastically increases the hotspotting effect. When you have a "thick" silicon bulk on the die, the heat has room to spread away from the hotspots before hitting the next thermal resistance at the die barrier. Thinning the die removes that ability for the heat to spread out and in any cooling situation, the interface between materials is always the highest point of resistance. I'm actually kind of amazed the V-cache dies worked as well as they did before.

With that said, I do wonder about the chip being flip chip or not though. It can be flip chip and connect through a bond pad via, but then the TSVs in the CCD make no sense. If it's not flip chip, I hope they talk about getting the heat out in that orientation.
 

CouncilorIrissa

Senior member
Jul 28, 2023
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Yeah I wasn't like lying or something. Just no idea how it translated to badly to client parts even in raw nT zoomzooms.
Well at least we do know now how it happened. Some PPC gains combined with massively better v/f curve in the 2-4 GHz region allowing Turin to maintain higher clocks/boost higher than the predecessor, it's just that it's irrelevant at the very top end of it where the client parts live.

Not the most obvious thing for a massively wider core to clock higher at the same power admittedly.
 

gdansk

Diamond Member
Feb 8, 2011
3,276
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Well at least we do know now how it happened. Some PPC gains combined with massively better v/f curve in the 2-4 GHz region allowing Turin to maintain higher clocks/boost higher than the predecessor, it's just that it's irrelevant at the very top end of it where the client parts live.
And many people repeatedly warned that one should not extrapolate from Turin. But the hypers did anyway.
 

adroc_thurston

Diamond Member
Jul 2, 2023
3,794
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Some PPC gains combined with massively better v/f curve in the 2-4 GHz region allowing Turin to maintain higher clocks/boost higher than the predecessor, it's just that it's irrelevant at the very top end of it where the client parts live.
Better, some F SKUs are 5G allcore. It's nifty.
Not the most obvious thing for a massively wider core to clock higher at the same power admittedly.
On the same-ish node no less.
 

Hans Gruber

Platinum Member
Dec 23, 2006
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Yes, TSMC's performance statements aren't regarding designs already at the very edge of their process. Shrink a 5GHz design and you are not getting 5.5GHz. If you look into it TSMC are comparing a ~3GHz test chip.

But it won't stop Hans "It's all process" Gruber.
Nobody is talking about a process shrink. N4P is still made on the 5nm process. Going from N5 to N4P is a big generational jump in both performance and efficiency. If the 9800x3D is only 7-8% better than the 7800x3D. That would fall outside (11% performance increase) if AMD made a 7800x3D on N4P. There is a difference between real world and paper statistics. At the same time, TSMC cannot publish performance and power efficiency numbers that are not accurate. Customers would not buy their silicon if the numbers were not accurate.

Forum members should stop reading reviews or watching youtube vidoes on how silicon process works. You either get efficiency or performance increase, not both is BS. It depends on the node and the variant TSMC offers. The N3 3nm silicon only gives a significant efficiency increase over 5nm. There are clock regressions with N3 and no performance uplift. You cannot choose I want performance over efficiency. You have to wait for a N3P to get performance and efficiency gains. When they say it's customized for AMD. That simply means they give them an option to lean towards power or efficiency or a mix of both depending on the process.

When AMD was set to use N3 with Zen 5 they mentioned clock regressions and suddenly that changed when they had to use N4P. No clock regressions but clock increases. People attribute increased clocks to the Zen 5 design. I attribute it to N4P. Zen 4 was originally supposed to be on N5P but they could not get N5P. They settled for the base N5 silicon. A 7800x3D on N4P would yield very good efficiency and performance gains based on the N4P silicon.

Sometimes core density matters more than anything. Take Nvidia's Blackwell. That chip is so advanced they really needed to be on TSMC 3nm but Apple bought all the N3 silicon. Instead, Blackwell is on N4P which provides increased silicon density over all other 5nm processes.
 

Thunder 57

Diamond Member
Aug 19, 2007
3,079
4,873
136
Nobody is talking about a process shrink. N4P is still made on the 5nm process. Going from N5 to N4P is a big generational jump in both performance and efficiency. If the 9800x3D is only 7-8% better than the 7800x3D. That would fall outside (11% performance increase) if AMD made a 7800x3D on N4P. There is a difference between real world and paper statistics. At the same time, TSMC cannot publish performance and power efficiency numbers that are not accurate. Customers would not buy their silicon if the numbers were not accurate.

Forum members should stop reading reviews or watching youtube vidoes on how silicon process works. You either get efficiency or performance increase, not both is BS. It depends on the node and the variant TSMC offers. The N3 3nm silicon only gives a significant efficiency increase over 5nm. There are clock regressions with N3 and no performance uplift. You cannot choose I want performance over efficiency. You have to wait for a N3P to get performance and efficiency gains. When they say it's customized for AMD. That simply means they give them an option to lean towards power or efficiency or a mix of both depending on the process.

When AMD was set to use N3 with Zen 5 they mentioned clock regressions and suddenly that changed when they had to use N4P. No clock regressions but clock increases. People attribute increased clocks to the Zen 5 design. I attribute it to N4P. Zen 4 was originally supposed to be on N5P but they could not get N5P. They settled for the base N5 silicon. A 7800x3D on N4P would yield very good efficiency and performance gains based on the N4P silicon.

Sometimes core density matters more than anything. Take Nvidia's Blackwell. That chip is so advanced they really needed to be on TSMC 3nm but Apple bought all the N3 silicon. Instead, Blackwell is on N4P which provides increased silicon density over all other 5nm processes.

So again you are pushing this myth that 7800X3D on N4P would be faster than 9800X3D.
 
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