Discussion Intel Meteor, Arrow, Lunar & Panther Lakes Discussion Threads

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Tigerick

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Apr 1, 2022
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As Hot Chips 34 starting this week, Intel will unveil technical information of upcoming Meteor Lake (MTL) and Arrow Lake (ARL), new generation platform after Raptor Lake. Both MTL and ARL represent new direction which Intel will move to multiple chiplets and combine as one SoC platform.

MTL also represents new compute tile that based on Intel 4 process which is based on EUV lithography, a first from Intel. Intel expects to ship MTL mobile SoC in 2023.

ARL will come after MTL so Intel should be shipping it in 2024, that is what Intel roadmap is telling us. ARL compute tile will be manufactured by Intel 20A process, a first from Intel to use GAA transistors called RibbonFET.



Comparison of upcoming Intel's U-series CPU: Core Ultra 100U, Lunar Lake and Panther Lake

ModelCode-NameDateTDPNodeTilesMain TileCPULP E-CoreLLCGPUXe-cores
Core Ultra 100UMeteor LakeQ4 202315 - 57 WIntel 4 + N5 + N64tCPU2P + 8E212 MBIntel Graphics4
?Lunar LakeQ4 202417 - 30 WN3B + N62CPU + GPU & IMC4P + 4E012 MBArc8
?Panther LakeQ1 2026 ??Intel 18A + N3E3CPU + MC4P + 8E4?Arc12



Comparison of die size of Each Tile of Meteor Lake, Arrow Lake, Lunar Lake and Panther Lake

Meteor LakeArrow Lake (N3B)Lunar LakePanther Lake
PlatformMobile H/U OnlyDesktop & Mobile H&HXMobile U OnlyMobile H
Process NodeIntel 4TSMC N3BTSMC N3BIntel 18A
DateQ4 2023Desktop-Q4-2024
H&HX-Q1-2025
Q4 2024Q1 2026 ?
Full Die6P + 8P8P + 16E4P + 4E4P + 8E
LLC24 MB36 MB ?12 MB?
tCPU66.48
tGPU44.45
SoC96.77
IOE44.45
Total252.15



Intel Core Ultra 100 - Meteor Lake



As mentioned by Tomshardware, TSMC will manufacture the I/O, SoC, and GPU tiles. That means Intel will manufacture only the CPU and Foveros tiles. (Notably, Intel calls the I/O tile an 'I/O Expander,' hence the IOE moniker.)



 

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cannedlake240

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Jul 4, 2024
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Has TSMC talked about receiving large pre-payments? I haven't dug into TSMC's financials so maybe they have but when looking at Intel's, I don't see anywhere there is an additional $1B in pre-payment. If I understand correctly, it should show up within their liabilities until products are shipped, but I don't see anything like that amount appearing in the time frame they say this pre-payment was received.

If it takes 2 years for customers to go from tapeout to production orders, that's a major problem for Intel.

Maybe we are not understanding each other on significant deals. If Intel gets $1B in wafer deals a year, I would say that's not significant when you're trying to be a leading edge foundry. Intel needs 5x that amount minimum to start to have significant volume to justify their operations.
The question was, where the 18A WSA revenue is and why they said 2027 and not earlier. I don't know about prepayments or where the $1B figure even comes from, that was besides the point. Was just curious whether TSMC generates revenue from nodes that aren't in production yet.

Intel didn't say it'll take 2 years to go from tapeout to launch. The CFO stated that they expect 'some external foundry revenue in 2026 and meaningful revenue starting 2027'. Plus Intel isn't getting iPhone size orders right from the start, the first tapeout chip is likely smaller volume
 

Hitman928

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The question was, where the 18A WSA revenue is and why they said 2027 and not earlier. I don't know about prepayments or where the $1B figure even comes from, that was besides the point. Was just curious whether TSMC generates revenue from nodes that aren't in production yet.

No, TSMC doesn't produce revenue during pre-production. They start showing significant revenue around 6 - 9 months after a node goes HVM as tapeouts are completed and sent to customers.

Intel didn't say it'll take 2 years to go from tapeout to launch.

I'm using the timeline of a customer taping out in 1H25 but not getting revenue until 2027. They did say some revenue in 2026 so I guess a year later or so which isn't too bad.

The CFO stated that they expect 'some external foundry revenue in 2026 and meaningful revenue starting 2027'. Plus Intel isn't getting iPhone size orders right from the start, the first tapeout chip is likely smaller volume

Yes, that is my point. Smaller volume = no major customer. Even if the customer is large (AWS) doesn't mean they are doing large volume through IFS. It may turn into that later, but the indications are that the initial wafer deals they have lined up for IFS are not significant volume, not for a company trying to be a leading edge fab.
 

DavidC1

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IFS has virtually no external deals. They don't have more deals than they did ten years ago. Packaging deals always existed in one form or another.

It simply is because they have not proved themselves in any way. They aren't even at the point of catching up to where Samsung is in terms of deals.

I do agree many parts of the company needs to put up or shut up. Or put up and shut up. Intel Foundry is a prime example where they talk too much because they got nothing to show for.
 

cannedlake240

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Jul 4, 2024
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IFS has virtually no external deals. They don't have more deals than they did ten years ago. Packaging deals always existed in one form or another.

It simply is because they have not proved themselves in any way. They aren't even at the point of catching up to where Samsung is in terms of deals.

I do agree many parts of the company needs to put up or shut up. Or put up and shut up. Intel Foundry is a prime example where they talk too much because they got nothing to show for.
6 customers is no deals? While they might be capacity constrained due to delayed fab expansions only coming online in 2027? 18A will span Intel's entire product stack unlike Intel 4 or 20A. Potential customers have to take that into account before committing to any wafer deals
 

Thunder 57

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6 customers is no deals? While they might be capacity constrained due to delayed fab expansions only coming online in 2027? 18A will span Intel's entire product stack unlike Intel 4 or 20A. Potential customers have to take that into account before committing to any wafer deals

I think they're more interested in a proven track record. Right now Intel CPU's (client) are all TSMC except the base tile. That's not a good look.
 

oak8292

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Sep 14, 2016
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Has TSMC talked about receiving large pre-payments? I haven't dug into TSMC's financials so maybe they have but when looking at Intel's, I don't see anywhere there is an additional $1B in pre-payment. If I understand correctly, it should show up within their liabilities until products are shipped, but I don't see anything like that amount appearing in the time frame they say this pre-payment was received.

If it takes 2 years for customers to go from tapeout to production orders, that's a major problem for Intel.

Maybe we are not understanding each other on significant deals. If Intel gets $1B in wafer deals a year, I would say that's not significant when you're trying to be a leading edge foundry. Intel needs 5x that amount minimum to start to have significant volume to justify their operations.
This is a bit tricky. TSMC does show prepayments in their annual financial report, it is under ‘Temporary Receipts from Customers’. I believe these are wafer capacity guarantees for cutting edge nodes. They have about $7 billion and some is current and some is future. There is nothing about which node these guarantees cover, it could be N3.

“The Company’s temporary receipts from customer are payments made by customers to the Company to retain the Company’s capacity. When the terms and conditions set forth in the agreements are subsequently satisfied, the treatment of temporary receipts, either by refund or by accounts receivable offsetting, will be determined by mutual consent.”

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DavidC1

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Dec 29, 2023
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6 customers is no deals? While they might be capacity constrained due to delayed fab expansions only coming online in 2027? 18A will span Intel's entire product stack unlike Intel 4 or 20A. Potential customers have to take that into account before committing to any wafer deals
When is that going to turn into material gains? When will it show in the balance sheet? They've got a whole lot of work to just catch up to Samsung, nevermind TSMC.

It's what, worth $500 million per year now? For their external deals to be valuable it needs to bring in at least $5 billion in revenue if not $10 billion to stop the bleed. This is a huge amount which will require something like a superlarge customer such as Nvidia making x60 and under line up entirely Intel.

The recent admission by the former process head that 18A gains went down to 15%, and in a misleading fashion that it only lost 5% when it's actually 10% does not bring confidence they can reverse this anytime soon.

Let me tell you, if hypothetically they gain leadership with 18A-P and you have fantastic reports coming from Reuters and such and you have multiple big partners making chip making deals not packaging(Amazon, Nvidia, AMD, Broadcom), then in few years maybe we'll see $2-3 billion. It takes a fantastic product few years just to make a real difference. Intel doesn't have a fantastic product.
 
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511

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Jul 12, 2024
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They themselves don't expect meaningful revenue till 27 so we should know there is nothing material now for external
In comparison to Samsung Intel wins easily just the fact that Intel's own volume is more than Samsung currently(samsung counts internal volume as well in their foundry) they are number 2 foundry and they don't have samsung bad yield hell Intel 3 is already at good D0 and is producing more wafers now and very large one have any of samsung recent node done that ?
It is unfair to samsung 🤣 cause intel is killing it in comparison
 

cannedlake240

Senior member
Jul 4, 2024
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When is that going to turn into material gains? When will it show in the balance sheet? They've got a whole lot of work to just catch up to Samsung, nevermind TSMC.

It's what, worth $500 million per year now? For their external deals to be valuable it needs to bring in at least $5 billion in revenue if not $10 billion to stop the bleed. This is a huge amount which will require something like a superlarge customer such as Nvidia making x60 and under line up entirely Intel.

The recent admission by the former process head that 18A gains went down to 15%, and in a misleading fashion that it only lost 5% when it's actually 10% does not bring confidence they can reverse this anytime soon.

Let me tell you, if hypothetically they gain leadership with 18A-P and you have fantastic reports coming from Reuters and such and you have multiple big partners making chip making deals not packaging(Amazon, Nvidia, AMD, Broadcom), then in few years maybe we'll see $2-3 billion. It takes a fantastic product few years just to make a real difference. Intel doesn't have a fantastic product.
They already said 2H of 26 for some external revenue, ramping going into 27. PDK was made available only recently.
 

511

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Jul 12, 2024
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The first tape out is in 1H25 only Intel product get's the first tape out like Apple does for TSMC for the first nodes now Huawei is done
 

cannedlake240

Senior member
Jul 4, 2024
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The first tape out is in 1H25 only Intel product get's the first tape out like Apple does for TSMC for the first nodes now Huawei is done
It's probably not a major product either, could be some obscure pipecleaner chip. Plus some clients might prefer 18A-P which goes into production in Q3-Q4 2026
 

511

Golden Member
Jul 12, 2024
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It's probably not a major product either, could be some obscure pipecleaner chip. Plus some clients might prefer 18A-P which goes into production in Q3-Q4 2026
We will not know until it releases we don't even know who the customer is also the pipe cleaners are Intel's product
 
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