Discussion Intel Meteor, Arrow, Lunar & Panther Lakes Discussion Threads

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Tigerick

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Apr 1, 2022
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As Hot Chips 34 starting this week, Intel will unveil technical information of upcoming Meteor Lake (MTL) and Arrow Lake (ARL), new generation platform after Raptor Lake. Both MTL and ARL represent new direction which Intel will move to multiple chiplets and combine as one SoC platform.

MTL also represents new compute tile that based on Intel 4 process which is based on EUV lithography, a first from Intel. Intel expects to ship MTL mobile SoC in 2023.

ARL will come after MTL so Intel should be shipping it in 2024, that is what Intel roadmap is telling us. ARL compute tile will be manufactured by Intel 20A process, a first from Intel to use GAA transistors called RibbonFET.



Comparison of upcoming Intel's U-series CPU: Core Ultra 100U, Lunar Lake and Panther Lake

ModelCode-NameDateTDPNodeTilesMain TileCPULP E-CoreLLCGPUXe-cores
Core Ultra 100UMeteor LakeQ4 202315 - 57 WIntel 4 + N5 + N64tCPU2P + 8E212 MBIntel Graphics4
?Lunar LakeQ4 202417 - 30 WN3B + N62CPU + GPU & IMC4P + 4E012 MBArc8
?Panther LakeQ1 2026 ??Intel 18A + N3E3CPU + MC4P + 8E4?Arc12



Comparison of die size of Each Tile of Meteor Lake, Arrow Lake, Lunar Lake and Panther Lake

Meteor LakeArrow Lake (N3B)Lunar LakePanther Lake
PlatformMobile H/U OnlyDesktop & Mobile H&HXMobile U OnlyMobile H
Process NodeIntel 4TSMC N3BTSMC N3BIntel 18A
DateQ4 2023Desktop-Q4-2024
H&HX-Q1-2025
Q4 2024Q1 2026 ?
Full Die6P + 8P8P + 16E4P + 4E4P + 8E
LLC24 MB36 MB ?12 MB?
tCPU66.48
tGPU44.45
SoC96.77
IOE44.45
Total252.15



Intel Core Ultra 100 - Meteor Lake



As mentioned by Tomshardware, TSMC will manufacture the I/O, SoC, and GPU tiles. That means Intel will manufacture only the CPU and Foveros tiles. (Notably, Intel calls the I/O tile an 'I/O Expander,' hence the IOE moniker.)



 

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Thunder 57

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I have lost all my respect for HWUnboxed after this "they are saying E cores are a waste of silicon" lmfao 🤣🤣

I thought it was a fair video. The TL;DW version is that Intel would be bad in productivity performance today without the E cores. Then they say that ARL would only be "pretty good" for gaming while the E cores are "a waste of silicon" in that scenario so that was taken out of context. It's at 8:30 in the video. They briefly mention Bartlett Lake to but they seem to think it may be cancelled? First I've heard of that. I don't think it will reach gamers though.
 

511

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Jul 12, 2024
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I thought it was a fair video. The TL;DW version is that Intel would be bad in productivity performance today without the E cores. Then they say that ARL would only be "pretty good" for gaming while the E cores are "a waste of silicon" in that scenario so that was taken out of context. It's at 8:30 in the video. They briefly mention Bartlett Lake to but they seem to think it may be cancelled? First I've heard of that. I don't think it will reach gamers though.
Yes but where is the proof E cores are the thing that makes ARL good as for gaming we have seen 1P+16E destroying only P yet they conclude inverse of it
 

Thunder 57

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Aug 19, 2007
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Yes but where is the proof E cores are the thing that makes ARL good as for gaming we have seen 1P+16E destroying only P yet they conclude inverse of it
View attachment 112029

Most people don't want to have to dick around with active CPU's when switching between tasks. Also those 16 E cores are seriously overclocked. They'll do well in multithreaded tasks but what does it take to achieve those clocks? This just looks like cherry picking.
 

511

Golden Member
Jul 12, 2024
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Most people don't want to have to dick around with active CPU's when switching between tasks. Also those 16 E cores are seriously overclocked. They'll do well in multithreaded tasks but what does it take to achieve those clocks? This just looks like cherry picking.
Maybe but if HWUnboxed want to proof that point they are big tech outlet they should clearly test things before making conclusion like saying these.
The power is in image they are literally pulling less power than 8P+16E while delivering higher FPS even OC
 

511

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Jul 12, 2024
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What matters more is people.
Since e-core team seemed to execute better, let e-core guys steer the development is probably better, for whatever design.
There is sufficient time to make a design from scratch.
Just fund them like they did with their foundries it will be a lot less than what the foundry took.
The US government ain't helping Intel either with the foundries it's going to be a loosing race without government support in either form in long term for Intel
Even Ireland supports Intel better than US 🤣
 
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DavidC1

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Dec 29, 2023
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What matters more is people.
Since e-core team seemed to execute better, let e-core guys steer the development is probably better, for whatever design.
There is sufficient time to make a design from scratch.
Exactly.

They said Core 2 combined Netburst and Yonah, but in reality they gave up almost everything in Netburst. Trace Cache, Hyperthreading, double pumped simple ALUs, replay, obsessive focus on clocks. They may have took some inspiration for reaching higher clocks. The faster FSB was going to be used regardless so that's a moot point.

Rather than saying Core 2 was a combo, it's more accurate to say it LEARNED from the mistakes Netburst and its philosophy.

I assume the Unified Core will show a clear sign it's a bigger brother of Arctic Wolf. Only thing it might "adopt" is private L2 caches. Wouldn't be surprised at all if the traces of the P cores go away - uop cache, hyperthreading, expansion without thought, too many fast path circuits, and focus on clocks again.
 

OneEng2

Senior member
Sep 19, 2022
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I don't really get what you're trying to say here. Yea sure Hz is not as big of a measure of performance in people's minds as it was back then but it still matters, as does IPC which also existed back then. Also ur idea about naming nodes with "model numbers", intel hasn't named their nodes based on actual realistic measures of their transistor technology since 1995:

"Intel held the line from “10 micron” in 1972 through “0.35 micron” in 1995, an impressive 23-year run where the node name matched gate length. Then, in 1997 with the “0.25 micron/250 nm” node they started over-achieving with an actual Lg of 200 nm – 20% better than the name would imply. This “sandbagging” continued through the next 12 years, with one node (130nm) having Lg of only 70nm – almost a 2x buffer. Then, in 2011, Intel jumped over to the other side of the ledger, ushering in what we might call the “overstating decade” with the “22nm” node sporting an Lg of 26 nm."

Naming nodes with numbers that don't technically mean anything is not something new within the past 20 years. Determining what process is "better" is also not related to this discussion at all. The difficulty in determining what node is better than what is because now there is actual competition where Intel isn't the unquestionable leader, and TSMC, although clearly better, is not too far ahead from intel either in terms of pure process technology. In hobbyist discussion boards like this its just conjecture based on the limited marketing materials we have from Intel and TSMC so obviously there is some difficulty in distinguishing exactly how good one process is compared to another, although arguably there is already a decent enough hierarchy established by the more educated people here. Besides it's not hard for somebody actually in the industry or with an education in this field, it is perfectly clear cut to experts in the field and especially when products release which processes are better than others.
New process generations have become exponentially more expensive to produce. Unless consumers become accepting of exponentially more expensive products, this model can't continue.
Years ago it was said that soon, we will run out of making nodes smaller when transistors became so small it was impossible, like 3 atoms make a transistor and you can't go smaller. Not being an expert here, is that type of thing that we will hit that wall soon ?
As others pointed out, the word game has been going on for some time. The metrics of a process are a better gauge, but still fairly vague in reality.

I think financial limits will stop Moores law long before quantum tunneling.
 

LightningZ71

Golden Member
Mar 10, 2017
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I think the wall is at the limits of EUV/high NA EUV production gear. Anything replacing that will be massively more expensive and so sensitive to any sort of vibration that it's doubtful it could ever repay it's development/purchase costs for anyone involved.

Even using chiplets will only take you so far.
 

511

Golden Member
Jul 12, 2024
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I think the wall is at the limits of EUV/high NA EUV production gear. Anything replacing that will be massively more expensive and so sensitive to any sort of vibration that it's doubtful it could ever repay it's development/purchase costs for anyone involved.

Even using chiplets will only take you so far.
Chiplets will help drive cost down
 

maddie

Diamond Member
Jul 18, 2010
4,932
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New process generations have become exponentially more expensive to produce. Unless consumers become accepting of exponentially more expensive products, this model can't continue.

As others pointed out, the word game has been going on for some time. The metrics of a process are a better gauge, but still fairly vague in reality.

I think financial limits will stop Moores law long before quantum tunneling.
I think the wall is at the limits of EUV/high NA EUV production gear. Anything replacing that will be massively more expensive and so sensitive to any sort of vibration that it's doubtful it could ever repay it's development/purchase costs for anyone involved.

Even using chiplets will only take you so far.
Anyone seen a discussion of the increased steps needed at the finest element level between Finfet and Ribbonfet?

It appears evident that mask, expose, etch & clean, deposit, will have to be done repeatedly for each ribbon layer versus once for a Finfet design. Costs increases rapidly for the new and future design layouts in addition to the raw node increases.

Am I wrong on this?
 
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