Discussion Leading Edge Foundry Node advances (TSMC, Samsung Foundry, Intel) - [2020 - 2025]

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DisEnchantment

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Mar 3, 2017
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TSMC's N7 EUV is now in its second year of production and N5 is contributing to revenue for TSMC this quarter. N3 is scheduled for 2022 and I believe they have a good chance to reach that target.


N7 performance is more or less understood.


This year and next year TSMC is mainly increasing capacity to meet demands.

For Samsung the nodes are basically the same from 7LPP to 4 LPE, they just add incremental scaling boosters while the bulk of the tech is the same.

Samsung is already shipping 7LPP and will ship 6LPP in H2. Hopefully they fix any issues if at all.
They have two more intermediate nodes in between before going to 3GAE, most likely 5LPE will ship next year but for 4LPE it will probably be back to back with 3GAA since 3GAA is a parallel development with 7LPP enhancements.




Samsung's 3GAA will go for HVM in 2022 most likely, similar timeframe to TSMC's N3.
There are major differences in how the transistor will be fabricated due to the GAA but density for sure Samsung will be behind N3.
But there might be advantages for Samsung with regards to power and performance, so it may be better suited for some applications.
But for now we don't know how much of this is true and we can only rely on the marketing material.

This year there should be a lot more available wafers due to lack of demand from Smartphone vendors and increased capacity from TSMC and Samsung.
Lots of SoCs which dont need to be top end will be fabbed with N7 or 7LPP/6LPP instead of N5, so there will be lots of wafers around.

Most of the current 7nm designs are far from the advertized density from TSMC and Samsung. There is still potential for density increase compared to currently shipping products.
N5 is going to be the leading foundry node for the next couple of years.

For a lot of fabless companies out there, the processes and capacity available are quite good.

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FEEL FREE TO CREATE A NEW THREAD FOR 2025+ OUTLOOK, I WILL LINK IT HERE
 
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moinmoin

Diamond Member
Jun 1, 2017
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Direct link to the article at SemiWiki:
 

Gideon

Golden Member
Nov 27, 2007
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Direct link to the article at SemiWiki:

They have more data behind paywall (apparently with more details) but from the public bersion TL;DR basically is this:
Note: the 3nm paper reference suggests this is in comparison to N3E, not N3.


Power:

At 10nm TSMC provided a larger power reduction than Samsung and maintained that lead until 3nm where Samsung Gate All Around (GAA) provided a large enough improvement to mostly close the gap to TSMC’s 3nm FinFET process in power (GAA versus FinFET is expected to provide a greater power improvement). TSMC 2nm announced power improvement of 30% versus 3nm is greater than Samsung’s 25% improvement and TSMC once again maintains a lead.

...
Just the N3 to N2 bars on the graph show a 55% improvements versus the announced 30% improvement.

Performance:
Based on this analysis it is our belief that Intel 18A has the highest performance for a 2nm class process with TSMC in second place and Samsung in third place.


Area:

For high density logic cells TSMC is well ahead of Samsung and Intel on density, Intel is second, and Samsung is third.

As previously mentioned, the TSMC paper does not include SRAM cell sizes, however there is a graph of SRAM density versus node, see figure 3.


The rest we know. no Backside Power Delivery, and lots of rumors about yields and price

And here's another comment on reddit (why I linked to it in the first place):
Just to add, Scott has HD cell at 313 mm2 for N2. 238 mm2 for 18A, and 231 mm2 for SF2
No power figures for 18A, but N2 was 0.14, SF2 was 0.17
Performance he had 18A at 2.53, 2.27 for N2, 2.19 for SF2. He believes 18A will lead vs A16 and SF1.4 for performance
(No reason listed as how it's achieved)


Intel's 18A looks quite nice for HPC applications, but I find it doubtful it can compete in <25W mobile parts if the 30-55% power reduction from N3E (not N3 !!) is correct, particularily as the density also seems to be better
 

511

Golden Member
Jul 12, 2024
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Prediction for IFS node perf/w:
18A is N4P +-5%, N3 series advantage will be most pronounced at low voltage
18AP is then somewhere in N3B to N3P range
14A(official number +15% over 18A) ≈ N3P to N2 range

Won't rule out even lower numbers but It seems unlikely. Would be curious If 14A somehow regained some of the lost ground on 18A regression
Nice prediction 🙂 I would take TechInsights Prediction than this one though as for low power characteristics even Intel 4(RWC) matches N3B (LNC)
 
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cannedlake240

Senior member
Jul 4, 2024
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Nice prediction 🙂 I would take TechInsights Prediction than this one though as for low power characteristics even Intel 4(RWC) matches N3B (LNC)
View attachment 116851
I'm aware of this and it does raise some questions. If this is really the case how is IFS not getting fab contracts worth 10s of billions already? PDK quality issues? Is there some industry wide conspiracy against Intel? Or maybe ParametricYield bros are right? Maybe 18A not yielding chips that meet PnP standards(like Icelake)
 

511

Golden Member
Jul 12, 2024
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I'm aware of this and it does raise some questions. If this is really the case how is IFS not getting fab contracts worth 10s of billions already? PDK quality issues? Is there some industry wide conspiracy against Intel? Or maybe ParametricYield bros are right? Maybe 18A not yielding chips that meet PnP standards(like Icelake)
If it had parametric yield issues we won't be having GNR/SRF/ARL-U/MTL on Intel 3/4 so no.

The only possible issue is Trust and risk the only big customers that doesn't have Trust issues going with Intel is Hyperscaler like Googl/MSFT/Amazon. Customes like AMD/Nvidia/Qualcomm just fear for design leaking to Intel Products

As for 18A PnP issues it's mostly FUD some can be genuine also Morris Chang is saying Intel to stop it's foundry efforts that only means one thing he is afraid of the progress.
 

cannedlake240

Senior member
Jul 4, 2024
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If it had parametric yield issues we won't be having GNR/SRF/ARL-U/MTL on Intel 3/4 so no.

The only possible issue is Trust and risk the only big customers that doesn't have Trust issues going with Intel is Hyperscaler like Googl/MSFT/Amazon. Customes like AMD/Nvidia/Qualcomm just fear for design leaking to Intel Products

As for 18A PnP issues it's mostly FUD some can be genuine also Morris Chang is saying Intel to stop it's foundry efforts that only means one thing he is afraid of the progress.
But i4/3 and i18A are completely different nodes... Just because the former is ok doesn't mean 18A has to be as well. 14nm had major issues, was delayed 1.5 years even though 22nm went relatively ok(to outsiders), and theyre both finfet nodes.
 

511

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Jul 12, 2024
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But i4/3 and i18A are completely different nodes... Just because the former is ok doesn't mean 18A has to be as well. 14nm had major issues, was delayed 1.5 years even though 22nm went relatively ok(to outsiders), and theyre both finfet nodes.
22nm didn't had issues iirc but yes after 22nm they have been downhill 14nm was delayed and 10nm was delayed for like 4 or maybe 5 years.

7nm got delayed and when pat came only than it was fixed and it was not the original 7nm which was scrapped we got 7nm+(Intel 4) and 7nm++ (Intel 3) but if 18A had issues we should have known by now.

As for 18A Ian cutress Tech insights Scotten Johnes has info regarding Yield and node data
 
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Hesperax

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Nov 13, 2023
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Article from Digitimes on TSMC and Intel:

Summary of the Article since it has a Paywall:
 

511

Golden Member
Jul 12, 2024
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Article from Digitimes on TSMC and Intel:

Summary of the Article since it has a Paywall:
LMFAO AI generated?
 

DavidC1

Golden Member
Dec 29, 2023
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but if 18A had issues we should have known by now.
Going from +15% and +10% to just +15% could be called an issue.
The only possible issue is Trust and risk
That's possible, but the other part is a) Arrowlake has uarch changes so it's not an ISO-comparison and b) Some of David Huang's and Geekerwan's results are questionable.

Ian Cuttress, David Huang, Chips & Cheese, and Geekerwan tests are a grade lower in quality than what Anandtech of old used to put out. The move to the simplified Smartphone era didn't just simply UI, but websites and even information as well, often to the reduction of detail.

Videos for example is like moving from L3 cache to system memory. Yea it's fast enough, but it's much much slower. Videos are NOT for quickly looking up information. Website is.

A picture may be worth a thousand words, but a video is maybe worth 50 words.
I'm aware of this and it does raise some questions. If this is really the case how is IFS not getting fab contracts worth 10s of billions already?
10-15% differences for a new foundry is nowhere near enough to be worth switching a supplier, tools, and relations, especially one that struggled immensely and treated customers like second class.

Think about why YOU buy stuff. For such small "performance" differences everything else matters.
Not saying you are wrong here, but where did you get the 55mm2? It does wash on casual inspection though since current N3B Skymont is ~ 1.73mm2 with cache. Darkmont is likely to have more complexity and more cache.
1.73 x 24 cores on a similar density is about 42mm2. If you add required IO then 55mm2 makes perfect sense. I don't know why you think it would be lot bigger. And yes Darkmont has very minor changes. It probably won't increase it's size by more than 5%. All the L3 cache is all on the Base Foveros tiles too.
 
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maddie

Diamond Member
Jul 18, 2010
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Videos for example is like moving from L3 cache to system memory. Yea it's fast enough, but it's much much slower. Videos are NOT for quickly looking up information. Website is.

A picture may be worth a thousand words, but a video is maybe worth 50 words.
Spot on.

Youtube and similar might have destroyed decades of productivity improvement.
 

511

Golden Member
Jul 12, 2024
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Going from +15% and +10% to just +15% could be called an issue.
Could be could be not we will have 18A presentation in like 5-6 days at ISSCC.
That's possible, but the other part is a) Arrowlake has uarch changes so it's not an ISO-comparison and b) Some of David Huang's and Geekerwan's results are questionable.
Maybe but they are the only 3rd party data points that are reliable as for ISO-Comparison I agree but that's about as close we can get we won't have PDKs lying around to simulate the difference.We will have Intel 3 vs 4 data points soon with the same uArch cause I had a chat with David Huang and he said he is also interested in ARL-U RWC vs MTL-U RWC comparison so he will be buying the device and test it soon.
Ian Cuttress, David Huang, Chips & Cheese, and Geekerwan tests are a grade lower in quality than what Anandtech of old used to put out. The move to the simplified Smartphone era didn't just simply UI, but websites and even information as well, often to the reduction of detail.

Videos for example is like moving from L3 cache to system memory. Yea it's fast enough, but it's much much slower. Videos are NOT for quickly looking up information. Website is.

A picture may be worth a thousand words, but a video is maybe worth 50 words.
Yes I agree with you here
10-15% differences for a new foundry is nowhere near enough to be worth switching a supplier, tools, and relations, especially one that struggled immensely and treated customers like second class.
Sure but switching to a different foundry is a good way for negotiation. On Intel's struggle j would like to applaud Intel's Management they had the combined Moat of TSMC + Nvidia and they managed to shoot themselves in the foot that is something else
Think about why YOU buy stuff. For such small "performance" differences everything else matters.

1.73 x 24 cores on a similar density is about 42mm2. If you add required IO then 55mm2 makes perfect sense. I don't know why you think it would be lot bigger. And yes Darkmont has very minor changes. It probably won't increase it's size by more than 5%. All the L3 cache is all on the Base Foveros tiles too.
True too bad they delayed Clearwater Forest DCAI is such a mess that is hilarious.
 
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DavidC1

Golden Member
Dec 29, 2023
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We will have Intel 3 vs 4 data points soon with the same uArch cause I had a chat with David Huang and he said he is also interested in ARL-U RWC vs MTL-U RWC comparison so he will be buying the device and test it soon.
Intel 3 is a nice improvement over Intel 4. You can tell just by the spec sheets. The greatly increased base frequency is usually indicative of improved power profile. One example of that was from Arrandale to Sandy Bridge transition. The -U parts and the subportables were thought as almost Celerons because of how behind they were. Arrandale with Turbo closed some of the gap but it was Sandy Bridge that really made the idea of Ultrabooks viable.

Of course in this context that doesn't tell us anything since we're trying to see how it compares with N3.
Sure but switching to a different foundry is a good way for negotiation. On Intel's struggle j would like to applaud Intel's Management they had the combined Moat of TSMC + Nvidia and they managed to shoot themselves in the foot that is something else
You can also abandon them shortly after the desired company does well again. The joke about Nvidia could be applied here as well.

"People want AMD to be competitive so they can buy cheaper Nviida cards"

to

"People want Intel to be competitive so they can buy better TSMC nodes"
 
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lightisgood

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May 27, 2022
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Geddagod

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Dec 28, 2021
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Nice prediction 🙂 I would take TechInsights Prediction than this one though as for low power characteristics even Intel 4(RWC) matches N3B (LNC)
View attachment 116851
Tock cores decrease or keep perf/watt at the low end of the curve usually. Knowing Intel, perf/watt prob decreased with LNC even iso node at the low end of the curve lol. Plus all that core private cache has to be pretty expensive to power on and take up a disproportionate percent of total core power at that end of the curve...
Intel themselves claims that Intel 3 is ~ TSMC N3E?P? in perf/watt.

I dislike Scotten Jones' method of calculating perf/watt. He assumes that 10 ESF is ~N7 perf/watt, inflating the perf/watt calculations of Intel's future nodes.
I had a chat with David Huang and he said he is also interested in ARL-U RWC vs MTL-U RWC comparison so he will be buying the device and test it soon.
I thought he said it would be a couple of months
 

511

Golden Member
Jul 12, 2024
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Tock cores decrease or keep perf/watt at the low end of the curve usually. Knowing Intel, perf/watt prob decreased with LNC even iso node at the low end of the curve lol. Plus all that core private cache has to be pretty expensive to power on and take up a disproportionate percent of total core power at that end of the curve...
Intel themselves claims that Intel 3 is ~ TSMC N3E?P? in perf/watt.
View attachment 117369
I dislike Scotten Jones' method of calculating perf/watt. He assumes that 10 ESF is ~N7 perf/watt, inflating the perf/watt calculations of Intel's future nodes.
Same someone asked Scot he said he doesn't have a good reference for Performance/Watt in the semiwiki comment section
I thought he said it would be a couple of months
Yes
 

adamge

Member
Aug 15, 2022
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195
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This is simply good news...
The i18A customers are not only x86, but also GPU (probably include AI).

Celestial is a myth. The guy on youtube said ARC is cancelled. How could a cancelled business team produce new technology so many years later.

Edit: Wow, just wow at the comments section of that link.
 

511

Golden Member
Jul 12, 2024
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Celestial is a myth. The guy on youtube said ARC is cancelled. How could a cancelled business team produce new technology so many years later.
Raichu and couple of reliable leakers have said celestial is alive the only guy that said arc is dead is the clown MLID.
Edit: Wow, just wow at the comments section of that link.
Yeah the wccftech section is horrible
 
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