But I think MoP will be avoided to keep partners happy, MALL is a thing for good reason, as is CAMM.
There is a third dimension in play.
Large MALL on stacked die would be another option. which could be sufficient until LPDDR6.
But if AMD switched to MoP, and defined a form factor of the mobile package, which would be a black box as far as what memory it uses internally, it could offer potentially even more flexibility to OEMs - to just swap the whole CPU package, without having to do any engineering. / testing / memory procurement.