RPL uses the lower end bins of the ADL 8+8 and 6+0 dies for its locked i5s and all i3s.
As for ARL, there is a 6+8 die made on 20A that serves the lower end skus. Launches Q1 2025.
Your research methodology training is irrelevant here. Because MLID does not have valid sources 90% of the time.
He just makes things up whenever he needs it.
Did you miss the events from few months ago when MLID was outed for his desperation, lack of vetting and outright lies ?
Couple of guys...
PTL-U is the successor to Lunar. 4P+4LPE, igpu, npu all on the 18A die with a secondary for i/o and security stuff. This is the same formula as Lunar.
I think PTL-H moves the igpu to a separate tile (N3 or 18A ?) so that they can fit more Xe cores. Then they add 8 E-cores. So we have 4P+8E+4LPE...
Go back read that thread again. Raichu said the IPC of RWC was his speculation. V/F curve was not his speculation. He said he got that info from an Intel dev board.
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