They could have had a seperate die for the igpu, then use that spare space for two more cores and maybe a bit more pcie lanes/ddr4 channels. I wonder why they did not do that...
I think a concern may be that manufacturing at TSMC would lead to problems with being competitive with other companies that manufature on the exact same node (how do you differentiate the products if they perform the same? e.g. Altera, nVidia). If Intel does choose TSMC as external foundries...
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