6700K Deliding Advice/opinions

[DaveT231]

Good day fellow Ananders! (I'm a newbie on this account after forgetting my credentials from my circa '04 profile so a fresh start was needed)

I recently built my pretty close to dream build (without having to take out a loan or start slinging dope) specs as follow;
Asus Z170 Hero ( was going to go for the Hero A but couldn't justify the extra cost for Aura lighting control (which would have been nice but I couldn't justify premium for the integrated AC wireless seeing as my router literally sits on top of my case)
6700K running a daily OC of 4.67 can't recall the voltage I'm typing this on my phone waiting for my ambien to kick in but I have had it to around 4.85 3DMark run stable.
Cooling is a Thermaltake 3x120 AIO water ultimate 3 with Corsair SP 120 fans for all 3 of my rads
G.Skill Trident Z 2x8GB DDR3400 ram
2x EVGA Hubtid GTX980Tis that I got for a total of 850 shipped so I was pretty happy haven't tried any custom Bios's yet but I can get around 1540 boost clock bench stable with precisionX alone IN SLI with temps on the hottest car Maybe hitting 50ish C in a room that was 85f ambient (my ac is 20 years old in a house built in the 1860s and in this insane 95+c temps out with at least 90% humanity really put a hurting on that rapid degrading ac unit and my office is the hottest room in the house
EVGA 1000 G2 PSU
Thermaltake Core X9 case ( I seriously underestimated the square footage of the case but am very happy with its modularity and got a a steal in for just over $100 with free prime 2nd day Shiping so I think the case is awesome for the monies. I've got it set up with 3x Thermaltake 200mm fans 2 front intake one exhaust above the GPUs but I've been thinking about switching that to intake I also have 2 120s blow out the "drivers side" door and 1 120 exhaust in the bottom rear position one of the GPU rads is in the upper back position with the other forward of the top 200mm
For a monitor I'm running an Acer XB270HU bprz 144hz 27" 1440p IPS panel that I love like crazy.

Okay on from the novella to the meat of my question I've seriously been considering popping the IHS on 67k. I definitely don't want to do the janky floating IHS like Linus did.
I'm debating on using a thermal adhesive or any better way y'all could throw my way for deliding and the lap the IHS and water block.

Or...
Go full hardcore and leave a nekid die. I know on some Intel CPUs you into problems either the retention mechanism being height than the die and having to remove it and rig up a new block mounting solution ( does anyone know how much mounting wiggle room the Thermaltake AIOs have? Now to get around some of fenagaling I was thinking of using some copper shims such as these to get my height back and make essentially a replacement IHS
https://www.amazon.com/gp/aw/d/B00KBPOLEU/ref=psd_mlt_nbc_B00E5SMY0W_pr, any know of anyone attempting such a all copper shim in place of the IHS.

I thought it might be a rather elegant solution but the again I've been up for 20 hours so it could be the delirium and ambien giving me delusions of grandeur.

Any advice from lid popping veterans would be much appreciated, thanks in advance and excuse the wall of text and any jumbled thoughts,

Dave

 

[Byte]

Its quite easy with the razor blade. I've just done 10 and it was quite fun. I even did my Celeron/Pentiums. Skylake is easiest as there are no capacitors underneath the IHS. Use liquid Ultra for best results. I didn't try other pastes to compare, but will try kyronaught, arctic ceramique, MX2, and some other random included ones on my next delid. On a 6700 stock heatsink it went from 92C max on Prime 95 to 75C. That one test was all the convincing I needed to do all my chips. To put the IHS back i just put some JB quick weld epoxy. Anything less comes off pretty easy.

 

[DaveT231]

Its quite easy with the razor blade. I've just done 10 and it was quite fun. I even did my Celeron/Pentiums. Skylake is easiest as there are no capacitors underneath the IHS. Use liquid Ultra for best results. I didn't try other pastes to compare, but will try kyronaught, arctic ceramique, MX2, and some other random included ones on my next delid. On a 6700 stock heatsink it went from 92C max on Prime 95 to 75C. That one test was all the convincing I needed to do all my chips. To put the IHS back i just put some JB quick weld epoxy. Anything less comes off pretty easy.

Do you lap the IHS after? In case it doesn't sit flat and true and for the better copper to copper heat transfer? It's not like you have to worry about voiding the warranty after deliding lol.

 

[Byte]

No lapping at all. That is just too much work. All the processor went down more than 10C. I did 4 6700K, didn't really help o/c that much, only could get them to about 4.6 fully stable with about 1.325-1.35voltage. One got to 4.7 on 1.425v and hits 84C on a hyper 212 evo on Prime95. It would hit 100C pretty fast without the delid. For the top i used kyronaught in between the heatsink and IHS. Don't wanna risk liquid ultra for that. Kryonaught is good for 2-3 degrees better than heatsink paste included with modern coolers and about 5-6C better than my old artic silver 2/ceramique.

The first one you do will be scary, but just go slow. The second ones after will be really easy.

 

[DaveT231]

I have no fears about the deliding I was just looking for some guidance on whether to go bare die and the mounting involved. Or how to best go about not being half arsked like Linus and leaving a floating IHS (I don't really have OCD but that irked me to no end.) I've done much more extreme and crazy things in my past from a bellow ambient peltier setup, to a copper pot and dry ice (never had acsess to LN2.) on my old 4800x2 (that I had I believe the second highest OC on for over a year) and then a custom built and tuned 1/3hp phase change on a Q6600 not to mention soldering in 12 turn pots for precise insane voltage and all manner of craziness this is a cake walk. I appreciate the advice so far.

One question I do have does hitting the IHS with the heat gun at a modest temp help soften the adhesive and make the cutting easier?

 

[DrMrLordX]

Lapping is easy once you pop the lid, but it may not help much.

If you want to avoid the floating IHS, be sure to leave the epoxy waste attached to the PCB of the CPU. That way you can stick the IHS back on there once you've applied your own TIM (preferably CLU) to the die. It'll still lower the IHS a wee bit since you'll be missing some of the epoxy, but you won't be missing all of it.