The difference is that the AirJet has a gazillion times the pressure of a fan.Which is marketing nonsense. I can reverse a fan and it doesn't "blast out the dust".
Actual quote from the AirJet white paper.a gazillion times the pressure of a fan
Fan motion doesn't really stop the dust collecting on heatsink fins in the first place given build up seems inevitable in all fan based systems I have seen.Which is marketing nonsense. I can reverse a fan and it doesn't "blast out the dust"
All the deeper to suck the dust IN, then once it has deposited, all the more it impedes blowing it OUT. This rate of clogging can of course be mitigated by ample filter area, but that takes up space, and still aligns with the idea of disposable hardware which combined with the marketing about losing performance, seems the best fit for high end phones with huge/heavy batteries to support this higher performance (heat=battery drain).The difference is that the AirJet has a gazillion times the pressure of a fan.
“at heart the reality is that cooling technology has not changed in 40+ years”
The same basic reliance on rotating fans with an electromagnetic motor to spin them for air cooling solutions is probably what they mean even if they are being disingenuous about the heat transfer mechanisms from the processors to the fans.“at heart the reality is that cooling technology has not changed in 40+ years”
Sure I remember using a phase change vapor-chamber based heatsink with 6 heat pipes, and quad 140 mm silent brushless pulse-width modulated Noctua fans on my 80286, wasn’t everyone?
So is that approach better than Frore's AirJets?
Possibly. It can scale up to 30W heat dissipation while AirJet is limited to about 5W (would need 6 of them stacked to match). They don't claim to be dustproof like Airjet though.So is that approach better than Frore's AirJets?
Another possibility is creating a heatpipe with microchannels that allows heat dissipation at a molecular level.It feels like if every heat pipe could end in a separate super flat vapor chamber instead of fins then the entire solution could be more efficient.
Ok, so is Ventiva's time to market and cost, better than AirJet?Possibly. It can scale up to 30W heat dissipation while AirJet is limited to about 5W (would need 6 of them stacked to match). They don't claim to be dustproof like Airjet though.
How It Works - Ventiva
ventiva.com
Question only they can answerOk, so is Ventiva's time to market and cost, better than AirJet?
Ionic propulsion and jet impingement cooling are tech that has been around a very long time too in aerospace. Just no one ever decided to create cool marketing buzzwords and stick it in a smartphone.The same basic reliance on rotating fans with an electromagnetic motor to spin them for air cooling solutions is probably what they mean even if they are being disingenuous about the heat transfer mechanisms from the processors to the fans.
Still a fundamental flaw in the whole heat pipe paradigm is how little surface area actually comes into contact with the fins they are threaded through.
It feels like if every heat pipe could end in a separate super flat vapor chamber instead of fins then the entire solution could be more efficient.
Create cool marketing buzzwords =/= non sensor type MEMS tech maturity (for AirJet), something that wasn't possible until much more recently for these use cases, as backed up by the recent surge in MEMS speakers also.Just no one ever decided to create cool marketing buzzwords and stick it in a smartphone
Environmental protective coating on the PCB could prevent that, do you think?I also remember the IT world being abuzz about ionic cooling years ago, and then it sank without a trace, possibly because it runs too high a risk of static damage to the PCB and silicon.
Not a point I was getting at - I meant the way of producing the airflow hadn't changed much in terms of mainstream use beyond the humble fan.Heat pipes weren’t seeing widespread use in consumer electronics until the mid to late 1990s when they started popping up in laptops. So it’s totally disingenuous to say the tech hasn’t changed
Search me.Environmental protective coating on the PCB could prevent that, do you think?
At MEMS scale I wonder if they could just push the frequency range up outside of human hearing range. Would be interesting. Don’t worry about your pets going crazy everytime your phone warms upCreate cool marketing buzzwords =/= non sensor type MEMS tech maturity (for AirJet), something that wasn't possible until much more recently for these use cases, as backed up by the recent surge in MEMS speakers also.
I'm plenty dubious about Frore's claims though given both LTT and others have noted AirJet is in fact fairly audible already even in its 1st gen form.
We'll have to see if future iterations can lower the noise, or at least not make it worse while increasing the cooling effect.
My guess would be not - or at least perhaps requiring acoustic metamaterials to mask the noise (something I find a more interesting subject area for PC cooling anyway).
I also remember the IT world being abuzz about ionic cooling years ago, and then it sank without a trace, possibly because it runs too high a risk of static damage to the PCB and silicon.
Looks like Frore has attracted some competition from the MEMS speaker crowd....
xMEMS "fan-on-a-chip" could bring solid-state cooling to smartphones and tablets - Liliputing
xMEMS "fan-on-a-chip" could bring solid-state cooling to smartphones and tabletsliliputing.com
For reference, it is IP-58 rated for dust and water ingress. https://en.wikipedia.org/wiki/IP_codeSmartphones? They'd need to have places for air to enter and exit to make it actually cool the device, and I can't see that being viable.
The openings would have to be pretty small for the surface tension of water to keep it out. but such a small opening isn't going to allow for enough airflow to any real amount of cooling. Who's going to redesign a phone to get it 0.5C cooler?
Plus it's liable to get clogged up pretty easily. Lightning ports get a lot of lint if you keep your phone in your pocket often - it is amazing how much lint you can pull out of there if you dig in with a pin. Those much tinier air inlets would clog up with pocket lint before long, then those MEMs fans are useless. Dust is often statically charged so it'll get in there and stick even with an exit available. Or worse, if you were around some conductive dust (fine metal dust from an angle grinder perhaps) who knows what that does to your phone?
This is a stupid idea, at least as far as smartphones and tablets go.
wutMEMS is built more on fluid dynamics than what you think of as a fan.