Sometimes I think there should be cases with double insulation, which would act like big heatsink on its exterior side and prevent the dissipated heat to return inside the case and cause reheating components. With some bracket which alongside having a regular fan, would connect the CPU to the case walls via heatpipes to the case walls so more heat could be dissipated from the CPU and GPU, however I'm not sure if the case would be safe to touch due to high amounts of heat being transfered on its outer construction.It is not chic, so there is no market for them.
My OC'ed QX6700 @ 4GHz (vapophase cooling) consumed around 270W. The chip cost me $1.5k and the cooler cost me $1k.
Not a lot of volume at that pricepoint. Why would Intel or AMD go after it? The vaporphase cooler guys all went out of business because the demand for that kind of cooling was so low.
That said, the GPU products show us you don't need vaporphase cooling to keep a 300W product functioning. The CPU platform though is the problem, we need a reconfiguration of today's mobo and case layout so the heat from the CPU HSF is directly ejected outside the case.
Only then would it make sense.