msroadkill612
Member
- Oct 28, 2009
- 38
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"RavenRidge looks to be exactly what an AMD APU was supposed to be in the first place, cheap yet powerful CPU+iGPU and now at low wattage as well.
With 40% (iGPU) higher perf than BristolRidge at 50% less power, it could easily become the best APU in 2017 for Laptops."
Yep.
Random points:
Its not just a matter of amd amd having the best apu - they have the ONLY worthy apu.
Intel dont have an inhouse gpu to partner their cpuS, even if they had the expertise.
Any decent level of graphics using a discrete nvidia gpu has too many innate power and other disadvantages.
There are very compelling arguments for APUs on the desktop and servers also, but very compelling indeed in mobile.
AMD are old hands at apuS, and they worked well for general use, using mere system memory & a dull cpu, for ~all bar gaming.
Given amd now have; advances of 14nm zen & vega, faster ddr4 ram, fabric, hbcc & its exciting memory management, fabric linked resources,...
RR will be a hell of an advance in apuS, no matter what.
Missing and/or noteworthy imo, are wild cards that could add large additional impact beyond the 50%~better than prev apu amd claims.
One feature is that vega can have its own local nvme drives on its Fabric:
I am more optimistic about bandwidth, but the jist is:
"
two 1TB Samsung 961 M.2 SSD could potentially deliver as much as 6.4 GB/s read and 3.8 GB/s write for 2TB of capacity. Physical limit of the current configuration is probably 8GB/s read and 8GB/s write."
https://vrworld.com/2016/08/05/amd-radeon-pro-ssg-support-4tb-memory/
It can use it like a giant l3 cache for HBM2, and system memory as l2 cache. It could also provide big power and heat savings over dram, & it seems likely these resources would be shared by the cpu via fabric.
I think that may be a big theme with amd - use our HBCC tech, and you need far less costly, scarce & power thirsty dram
The sum is greater than the parts. Its hard not to underestimate fabric, but its full of potential.
all zen products are multiples (double ups) of the same Zeppelin, 2x zen ccx die. ~Straightforward.
1 x zen ccx and 1 x vega gpu on a single die, is very different die, surely?
Having covered that irresistible market, imo, they will soon move to a dual gpu die, similar to the zeppelin cpu die, and continue with the same formula as they have w/ ryzen/TR/epyc/2 socket epyc.
They will simply mix and match cpu & gpu dies on the MCMs, to suit clients bias toward cpu vs gpu processing power.
With 40% (iGPU) higher perf than BristolRidge at 50% less power, it could easily become the best APU in 2017 for Laptops."
Yep.
Random points:
Its not just a matter of amd amd having the best apu - they have the ONLY worthy apu.
Intel dont have an inhouse gpu to partner their cpuS, even if they had the expertise.
Any decent level of graphics using a discrete nvidia gpu has too many innate power and other disadvantages.
There are very compelling arguments for APUs on the desktop and servers also, but very compelling indeed in mobile.
AMD are old hands at apuS, and they worked well for general use, using mere system memory & a dull cpu, for ~all bar gaming.
Given amd now have; advances of 14nm zen & vega, faster ddr4 ram, fabric, hbcc & its exciting memory management, fabric linked resources,...
RR will be a hell of an advance in apuS, no matter what.
Missing and/or noteworthy imo, are wild cards that could add large additional impact beyond the 50%~better than prev apu amd claims.
One feature is that vega can have its own local nvme drives on its Fabric:
I am more optimistic about bandwidth, but the jist is:
"
two 1TB Samsung 961 M.2 SSD could potentially deliver as much as 6.4 GB/s read and 3.8 GB/s write for 2TB of capacity. Physical limit of the current configuration is probably 8GB/s read and 8GB/s write."
https://vrworld.com/2016/08/05/amd-radeon-pro-ssg-support-4tb-memory/
It can use it like a giant l3 cache for HBM2, and system memory as l2 cache. It could also provide big power and heat savings over dram, & it seems likely these resources would be shared by the cpu via fabric.
I think that may be a big theme with amd - use our HBCC tech, and you need far less costly, scarce & power thirsty dram
The sum is greater than the parts. Its hard not to underestimate fabric, but its full of potential.
all zen products are multiples (double ups) of the same Zeppelin, 2x zen ccx die. ~Straightforward.
1 x zen ccx and 1 x vega gpu on a single die, is very different die, surely?
Having covered that irresistible market, imo, they will soon move to a dual gpu die, similar to the zeppelin cpu die, and continue with the same formula as they have w/ ryzen/TR/epyc/2 socket epyc.
They will simply mix and match cpu & gpu dies on the MCMs, to suit clients bias toward cpu vs gpu processing power.