AMD Ryzen Gen 2 Set For Q2 2018

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DisEnchantment

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According to CPC

They seem to suggest that a modified uncore for improved memory access, would this mean IF and MEMCLK no longer tied to each other?

From WikiChip for Ryzen Gen 1, I believe.
It’s worth noting that all SDF components run at the DRAM’s MEMCLK frequency. For example, a system using DDR4-2133 would have the entire SDF plane operating at 1066 MHz. This is a fundamental design choice made by AMD in order to eliminate clock-domain-crossing latency.
 
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itsmydamnation

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According to CPC



They seem to suggest that a modified uncore for improved memory access, would this mean IF and MEMCLK no longer tied to each other?

From WikiChip for Ryzen Gen 1, I believe.
Could also mean the L3 within the CCX isn't tied to core clock. it used to run at the fastest cores clock.
 
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DisEnchantment

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VideoCardz has been putting out solid leaks for the past one and half years and for AMD they have always been spot on, which makes me want to take a look back at the things which have not come to pass.

EPYC Rome 48/96 7nm Q4 2018 launching in tandem with Vega 20. This is referenced as the Starship CPU from two years ago.


So it would seem the products getting a first dib of that sweet GF 7nm are EPYC and Vega MI and no client side products. EPYC will skip the refresh and go directly to 7nm it seems.
Going by the certainty with which the Videocardz leaks have been I would say a 48C/96T EPYC is landing very soon. I would not be surprised if AMD decides to do a next gen P47 with EPYC Rome and Vega 20 eclipsing the DGX2 in both CPU and GPU compute power.
Vega 10 is fairly potent in FP32 and with 1/2 DPFP it will be a compute beast.

For Client Desktop
The new inflection of tock tock, arch + process will land on Matisse. Still ways to go.

videocardz said:

But what will they do with all that extra die space??
Speculations? For Enterprise it is easy, add more cores more bandwidth more fixed function HW etc.
What will the EPYC Rome silicon be based on on, Zen 2 or Zen+?

The Ryzen 2K did not get me excited at all, so I am waiting for Threadripper 2K.
 

jpiniero

Lifer
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Vega 20 is being fabbed at TSMC. Have to think Navi is being fabbed there too.

BTW I think GloFo made some of the same mistakes that Intel did. Which is why the only product you will see from AMD at 7 nm GloFo in 2019 is Matisse, which can be chopped quite nicely. And why they are mentioning 48 cores even though it likely has a 16 core die.

Picasso (the APU) is being fabbed at GloFo 12.
 

DisEnchantment

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AMD on 7nm
From the AMD Teleconference Lisa Su was asked about the confidence AMD has with TSMC as a supplier of the 7nm Epyc products. Lisa responded that AMD would use both TSMC and Global Foundries for it 7nm products and TSMC would go first. Lisa also said AMD has confidence in TSMC.
https://twitter.com/2901bitslice/status/989275561364082688

But no 7nm EPYC this year
From the AMD Teleconference Lisa Su is asked about Servers. Will 7nm Epyc ship this year. Is the Mid Single Digit including 7nm. Answers No and No. 7nm Epyc will Sample this year and ship in volume in 2019. They can get to Mid Single digit share with the current generation Epyc.
https://twitter.com/2901bitslice/status/989268837055975425
 

Topweasel

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Vega 20 is being fabbed at TSMC. Have to think Navi is being fabbed there too.

BTW I think GloFo made some of the same mistakes that Intel did. Which is why the only product you will see from AMD at 7 nm GloFo in 2019 is Matisse, which can be chopped quite nicely. And why they are mentioning 48 cores even though it likely has a 16 core die.

Picasso (the APU) is being fabbed at GloFo 12.

The Starship on the roadmap specifically stated 48 cores. Which would imply that Matisse is a 12 core chip. This could be 3 different things, 1. That it's 2 6 core CCX's. 2. That it is 3 4 Core CCX's since you only need two more pathways without increasing latency drastically. or 3.They didn't have confidence in the 7nm and figured that Yields would be lower for Zen 2, so they are making it a 4x4 CCX setup, but were expecting to disable 4 or more cores even on the Server versions, leaving the 16c option for Zen 3.
 

DisEnchantment

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AMD applied for a new patent, this one is fresh from last December and seems a little interesting to me, especially in the light of Spectre and Meltdown
Similar in many aspects to Intel's TSX.
A processing core of a plurality of processing cores is configured to execute a speculative region of code a single atomic memory transaction with respect one or more others of the plurality of processing cores. In response to determining an abort condition for issued one of the plurality of program instructions and in response to determining that the issued program instruction is not part of a mispredicted execution path, the processing core is configured to abort an attempt to execute the speculative region of code.

[0001] Hardware Transactional Memory (HTM) is a mechanism in computer architecture for supporting parallel programming. With HTM, programmers may simply declare a group of instructions as being part of a single speculative region and the HTM hardware may then guarantee that the instructions in the region are executed as a single atomic and isolated transaction. Atomicity means that all the instructions of the transaction are executed as a single atomic block with respect to all other concurrent threads of execution on one or more other processing cores in the system. Isolation means that no intermediate result of the transaction is exposed to the rest of the system until the transaction completes. HTM systems may allow transactions to run in parallel as long as they do not conflict. Two transactions may conflict when they both access the same memory area and either of the two transactions writes to that memory area.

[0002] To implement HTM, significant complexity must be added to processors and/or to memory subsystems. To deal with this complexity, processor architects have traditionally limited the feature set of a processor that implements HTM. For example, traditional HTM processors cannot utilize out-of-order execution optimizations while executing a speculative region of code. Out-of-order optimizations allow a processor to exploit instruction-level parallelism by executing instructions out of program order, temporarily storing the results of those instructions, and then writing the results to the memory hierarchy when all preceding instructions have done so. Since HTM processors do not use out-of-order execution to execute instruction sequences that are inside of speculative regions, traditional HTM processors may not execute instruction sequences in speculative regions as quickly as would otherwise be possible.

Zen 3 's TSX ?
 

DisEnchantment

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ikr smh all these bois being hyped up about a ryzen thats 5 ryzens away from you, that's like a ryzen 1600 away from you, why are people so excited

I am not sure what you meant.
But I believe lots of people in the forum are interested in processor technology be it conceptual or in silicon. So to me it seems normal to talk about processor design in a tech forum.
 

Insert_Nickname

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itsmydamnation

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So the roadmap change again, and AMD will sample epyc this year on TSMC
No...... i dont know how you got that.

What AMD is doing is shifting some products back to TMSC, it is very unlikely that AMD will make the same SOC at two different foundries(big waist of money). If you think about it logically its more likely that Zepplin follow on will be made at GF and maybe Raven ridge follow on + some/all GPU's + console SOC's are made at TMSC.

You just can't move SOC's from one foundry to the other, especially very high performance ones where you do custom work with the foundry partner which is a given for both AMD's two main SOC products.

This way they limit the rework but still get a benefit from the said rework (shipping PC SOC's on TMSC). Given what we know about intel 10nm and their server and high end desktop products, regardless of 12/48 or 16/64 core configs AMD isn't going to have much of a problem filling GF's 1 7nm facility with just that one SOC.
 

jpiniero

Lifer
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You just can't move SOC's from one foundry to the other, especially very high performance ones where you do custom work with the foundry partner which is a given for both AMD's two main SOC products.

I know, but it sounds like GloFo is accommodating AMD's desire to work at TSMC and is working to make AMD's TSMC designs easier to port back to GloFo.

Maybe what happened is that they did a 12 core design at GloFo, and then later did a 16 core version at TSMC. Since TSMC is obviously farther ahead they are going with the TSMC design and convinced GloFo to make changes so they can reuse the design there. Sounds crazy but you never know.
 

itsmydamnation

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I know, but it sounds like GloFo is accommodating AMD's desire to work at TSMC and is working to make AMD's TSMC designs easier to port back to GloFo.

Maybe what happened is that they did a 12 core design at GloFo, and then later did a 16 core version at TSMC. Since TSMC is obviously farther ahead they are going with the TSMC design and convinced GloFo to make changes so they can reuse the design there. Sounds crazy but you never know.
Hitting the same sizes for basic building blocks (sram etc) would obviously help with a port, if you had to redo the layouts of everything then its like starting your physicals from scratch twice. But there are still other things like custom work for power distribution etc that will be very process and foundry specific.
 

raghu78

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Aug 23, 2012
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No...... i dont know how you got that.

What AMD is doing is shifting some products back to TMSC, it is very unlikely that AMD will make the same SOC at two different foundries(big waist of money). If you think about it logically its more likely that Zepplin follow on will be made at GF and maybe Raven ridge follow on + some/all GPU's + console SOC's are made at TMSC.

You just can't move SOC's from one foundry to the other, especially very high performance ones where you do custom work with the foundry partner which is a given for both AMD's two main SOC products.

This way they limit the rework but still get a benefit from the said rework (shipping PC SOC's on TMSC). Given what we know about intel 10nm and their server and high end desktop products, regardless of 12/48 or 16/64 core configs AMD isn't going to have much of a problem filling GF's 1 7nm facility with just that one SOC.
Exactly. There is no way AMD is doing the same design at TSMC and GF. AMD simply does not have the resources to do that. AMD has confirmed Vega 7nm at TSMC. There was a digitimes articles saying that Navi is at TSMC.

http://www.portvapes.co.uk/?id=Latest-exam-1Z0-876-Dumps&exid=threads/amd-navi-at-tsmc-7nm.2524108/

My guess is 7nm Rome is at TSMC. 7nm Ryzen CPUs and APUs are likely to be built at GF. This way AMD splits their designs across TSMC and GF to maximize their wafer allocation. TSMC is already in HVM at 7nm so the products built there will launch first. My guess is Vega 7nm in Q1 2019, Navi in Q2 2019, Rome in mid 2019.

https://www.semiwiki.com/forum/content/7496-imec-technology-forum-gary-patton-globalfoundries.html
https://www.eetimes.com/document.asp?doc_id=1333326&page_number=2

GF is in risk production on 7nm by mid 2018. Gary Patton,CTO of GF has confirmed they will be taping out their first 7nm chip - an AMD CPU in H2 2018. My guess is Q3 2018 tapeout. So Ryzen CPUs are likely to launch in mid to late Q3 2019 and Ryzen APUs in late Q1 2020.
 
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