Doesn't intel still have to agree to give/share the licence to a second foundry or is this done with?
Doesn't intel still have to agree to give/share the licence to a second foundry or is this done with?
Not really,intel has EM64T which is pretty much the same thing,it would suck for a while until apps get patched,if there would even be any that would require one,but after that it would be business as usual.With Intel requiring an x64 license from AMD it's at the very least mutually assured destruction.
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Intel just adopted amd64 to make life easier for them.
Not really,intel has EM64T which is pretty much the same thing,it would suck for a while until apps get patched,if there would even be any that would require one,but after that it would be business as usual.
Intel just adopted amd64 to make life easier for them.
That can only be for the good. If Samsung's offerings perform better, the pressure on GloFlo to improve will be intense.
Not really,intel has EM64T which is pretty much the same thing,it would suck for a while until apps get patched,if there would even be any that would require one,but after that it would be business as usual.
Intel just adopted amd64 to make life easier for them.
Yeah. Is it possible to determine which foundry was used based on SN or some other indicator on the box or via an online store?
Not really,intel has EM64T which is pretty much the same thing,it would suck for a while until apps get patched,if there would even be any that would require one,but after that it would be business as usual.
Intel just adopted amd64 to make life easier for them.
Hopefully, because you can't go on Diffused labels alone as Samsung has a 300mm plant with 14nm capabilities in Austin Texas.
To AMD it is irrelevant if the dies are diffused in Korea or USA, if the manufacturing would be done by Samsung. The assembly is done elsewhere regardless (AMD has CPU assembly sites in China and Malaysia), so using the S2 fab in Austin shouldn't make any difference.
GLOFO has a record of messing up and will probably continue to be, otherwise they won't use samsung's 14nm tech.
GF may not be such a bum steer in the future. Remember that they are doing all the fab work for IBM, and that they have yet to fail in that capacity (granted, thus far, all they have done is continue work on 22nm SOI for POWER8; POWER9 hasn't launched yet but there is no sign that POWER9 will be late due to poor yields on 14nm HP).
The A9 thing was a black eye on GF, but their work to improve 32nm SOI and 28nm bulk/SHP and SPP was actually pretty impressive. They are at least doing well maintaining/improving on existing processes. How well they execute with Summit Ridge may tell us a lot about GF's future.
As posted by Abwx on SA: Possible new Ryzen Benchmark (Looks like another A0, June stepping)
http://ranker.sisoftware.net/show_r...d5e3d5e3d1e2d0f684b989afcaaf92a284f7cafa&l=fr
Are you able to query a register or something to get the current speed?Hard to say if that's chip has Turbo enabled, since the turbo isn't really visible to OS in Zen.
Are you able to query a register or something to get the current speed?
That 6900K reads a 4.2 GHz turbo clock?
It could be an explosive launch where the product could catch fire in the public's imagination.That can only be for the good. If Samsung's offerings perform better, the pressure on GloFlo to improve will be intense.
IBM still has a huge hand in developing their HP process at Albany. Even in the acquired departments, it's the same old IBMers having moved to GloFo. That is exactly why this is supposed to be a great move for GloFo.GF may not be such a bum steer in the future. Remember that they are doing all the fab work for IBM, and that they have yet to fail in that capacity (granted, thus far, all they have done is continue work on 22nm SOI for POWER8; POWER9 hasn't launched yet but there is no sign that POWER9 will be late due to poor yields on 14nm HP).
The A9 thing was a black eye on GF, but their work to improve 32nm SOI and 28nm bulk/SHP and SPP was actually pretty impressive. They are at least doing well maintaining/improving on existing processes. How well they execute with Summit Ridge may tell us a lot about GF's future.
http://www.electronicsweekly.com/ne...oundries-goes-for-process-leadership-2016-05/For the first time, GloFo now reckons it can take industry process leadership using a proprietary, in-house developed process technology , and this is thanks to the IBM acquisition.
“The IBM acquisition gave us people experienced in leading edge development,” said Patton, ” the people who developed 45nm, 32nm, 22nm and 14nm are the same people who are working on 7nm.”
At the last node before the IBM acquisition – 14nm – GloFo licensed its process technology from Samsung.
“Malta (one of GLoFo’s New York fabs) is high yield on 14nm, that gives me a very solid baseline to do the next node,” said Patton.
As well as IBM’s process experts GloFo is also benefiting from the Albany Nanotechnology Centre who his still run by IBM but which is currently “focussing on Malta” says Patton.
Under the terms of the IBM-GloFo deal 50% of Albany’s effort is going to support Malta with the other 50% pursuing pathfinding.
The high performance 14nm process at Malta is used for IBM server chips using partially depleted SOI wafers. There is also an LPP 14nm finfet process at Malta using bulk CMOS.
The new collaboration will leverage the companies’ worldwide leading-edge semiconductor manufacturing capabilities, with volume production at Samsung’s fabs in Hwaseong, Korea and Austin, Texas, as well as GLOBALFOUNDRIES’ fab in Saratoga, New York.
Developed by Samsung and licensed to GLOBALFOUNDRIES, the 14nm FinFET process is based on a technology platform that has already gained traction as the leading choice for high-volume, power-efficient system-on-chip (SoC) designs. The platform taps the benefits of three-dimensional, fully depleted FinFET transistors to overcome the limitations of planar transistor technology, enabling up to 20 percent higher speed, 35 percent less power and 15 percent area scaling over industry 20nm planar technology.