blckgrffn
Diamond Member
In laments terms this is "Cheaper" then using intel's specialized solder. This is the reason why IB temps are higher. By using TIM, they have effectively turned the "heatspreader" into a heat barrier.
Lots of info over here
http://www.overclockers.com/forums/showthread.php?t=705620&page=9
That's hilarious! :thumbsup: Intel!
Jeeze, save a few bucks on each CPU and punish us (here) all... Too bad they didn't go with the premium stuff with at least the K CPUs where it makes sense too. I suppose that would have really been asking a lot, given how tight their production process is.
Perhaps they'll spend the coin on IVB-E, which would make it pretty phenomenal chip if the thread @ overclockers is true.
It looks like BFG was right to insist on an extra factor changing how things were working vs SB.
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