There are two pitfalls to watch out for when applying thermal interface material (TIM): 1) over application causing the TIM to be too thick; and 2) air bubbles and/or other non-TIM material embedded within the TIM.
With the spread method, I believe you minimize the chance of 1) but creates more opportunities for 2.
With the DAB method, you minimize the chance of 2) but creates more opportunities for 1).
Basically, both methods, if used carefully to avoid 1) and 2) above, will create the same intended result: an even, thin layer between the heatsink and the CPU that just fills the gaps between the metal without trapping any air or non TIM material in between. If you keep that in mind when you apply the TIM, you should be fine.