Nobody is saying anything like that.
Suggesting a company should lose money to gain market share. Giving away your products.
Potato. Potato.
Nobody is saying anything like that.
To be honest 232 is perfectly in line with what I have been writing about die size shrink between TSMC28/GloFo/Samsung14NMLPP. Shrinking die of Fury X on 14 nm, along with a little bit more dense architecture itself would get us into similar size. Not that It is the reality here, but it is a possibility.
232mm2.... There goes my hope of having a Titan X killer in 2016.
I think with 232mm2, we'll be looking at stock ~R9 390 performance, or about double Pitcairn.
232 sq mm on 14LPP with R9 390 performance would be pathetic. :thumbsdown:
That would be double Pitcairn's performance at nearly the same die size as Pitcairn. What is pathetic about that? Tahiti was 15% smaller than Cayman and didn't come anywhere remotely close to doubling performance at the time of it's release. You must be expecting miracles.
raghu78 has a history of making shall we say "optimistic" predictions about future AMD products
Remember there will also be utilization per unit improvements as well as higher clocks with A*B neither A or B have to be massive to get a good deal of C.
But 230nm sounds about right ( if a little on the low side) for a new process, rv770 256nm, cypress 330nm, Tahiti 350nm. given HBM2 throughput improvements and more memory compression technology we might see a narrower then expected HBM interface(512bits) giving more die space to ALU:MTU:ROP, would mean a smaller imposer as well.
given HBM2 throughput improvements and more memory compression technology we might see a narrower then expected HBM interface(512bits)
I wouldn't even be so sure a 232mm² die would get HBM, but if it does I could easily see it being a two stack solution. Given the larger size of HBM2 relative to HBM, a four stack solution would have an interposer basically as large as the one on Fiji.
That would be double Pitcairn's performance at nearly the same die size as Pitcairn. What is pathetic about that? Tahiti was 15% smaller than Cayman and didn't come anywhere remotely close to doubling performance at the time of it's release. You must be expecting miracles.
raghu78 has a history of making shall we say "optimistic" predictions about future AMD products
HBM comes in 1024 bit increments.
If AMD have been twiddling their thumbs for 2 GPU generations (4 years) then they deserve to go out of business.
IMHO, they are betting their company on Zen, GPU is secondary priority. You can see it in their financial analyst day when they are pumping data center/Zen while saying that dGPU is a slow-growing opportunity.
NVIDIA is 100%, all-in on GPUs, making them a very dangerous opponent. The people who are sitting there claiming that NV has its thumb up its rear-end just waiting to get railed by AMD/Polaris just don't have a clue, IMO.
That would be double Pitcairn's performance at nearly the same die size as Pitcairn. What is pathetic about that? Tahiti was 15% smaller than Cayman and didn't come anywhere remotely close to doubling performance at the time of it's release. You must be expecting miracles.
NVIDIA is 100%, all-in on GPUs, making them a very dangerous opponent. The people who are sitting there claiming that NV has its thumb up its rear-end just waiting to get railed by AMD/Polaris just don't have a clue, IMO.
Anyway I just want a close fight like the HD 7970 and GTX 680. I want AMD to show up for the fight like they did in the HD 4870 / HD 5870 generation. I believe they will compete with Polaris.
IMHO, they are betting their company on Zen, GPU is secondary priority. You can see it in their financial analyst day when they are pumping data center/Zen while saying that dGPU is a slow-growing opportunity.
NVIDIA is 100%, all-in on GPUs, making them a very dangerous opponent. The people who are sitting there claiming that NV has its thumb up its rear-end just waiting to get railed by AMD/Polaris just don't have a clue, IMO.
It would be pathetic because it would mean AMD did nothing to improve architectural efficiency beyond what the FINFET process node shrink brings.
FinFET should bring higher clocks (the FinFET A9 SoC in the iPhone 6S clocks 32% higher than the planar A8 SoC in the iPhone 6). In addition, AMD will be bringing out architectural improvements with Polaris.
Just a blind die shrink of Hawaii, run at the same clock speed, would be 199mm^2. (Hawaii is 438mm^2, Samsung/GloFo 14LPP is supposed to be 2.2x as dense as 28nm, so 438 / 2.2 ~= 199.) Add 30% for clock speed improvements, another 20%-30% for better architecture, maybe bump up the shader count from 2816 to an even 3072, and we should be expecting a 40%-50% increase in performance over Hawaii on a Pitcairn-sized FinFET GPU from AMD.