AS5 application for X2

[govtcheez75]

For the regular single core, it makes sense to put the rice grain size in the middle and let it spread since that's where the core and die is located. Is this the same for an X2 core? I haven't seen a picture of an X2 processor with the IHS removed, but I'm guessing that there are two cores under there and two dies? Would you then need two little rice grains over each of these dies?

 

[Thor86]

Nope.

 

[onn2000]

Nope X 2

 

[BonzaiDuck]

I'd have to go back and check, but I just came across an article earlier today -- I can't even remember exactly where at the moment -- about a new approach -- maybe it's called "shared-cache" -- on some forthcoming Intel processor. The Smithfield and the Athlon, on the other hand, may be -- I can't think of a better way to put it -- "a single assembly" -- whereas the new technology requires a departure from "dual-core" to the more accurate "double-core."

If they are a single assembly, it probably wouldn't matter much . . . . . Anyway, you just need enough Arctic Silver to fill in pockets on the heatsink and processor cap surfaces, and to facilitate an even contact with the silver evenly distributed over the cap.

I always think I put too much on -- sometimes justifying my excesses with the excuse that it's "long-grain rice" they're talking about in the application instructions. But even then, when removing a processor, there was not much indication of any bounteous oozing from between the cap and heatsink surfaces.

 

[JEDIYoda]

I have only used the AS5 twice so far and If I remember correctly I ended up putting more like 2 grains of rice on the CPU surface...becuase it was evident to me using my keen observational skills that one grain just would not do the job!!

 

[andrewbabcock]

Too much is very, very bad. You would rather have too little than too much trust me...

 

[JEDIYoda]

trust me...define too much?

Also I had no problems....

possibly 27c at idle might be construed as somewhat of a problem....

 

[govtcheez75]

the only time I actually noticed that I put too much on was when I did it on my Pentium M laptop. The temperatures actually went up by a degree or two from the thermal tape that was on there originally. I thought something was wrong. I re-applied it VERY thin on the core and the heatsink and it dropped the temps by 3 degrees.

 

[BonzaiDuck]

Well, let me throw in a caveat from this corner that I said it "seemed" like too much. By the time I was finished spreading it, something short of half the stuff was distributed on the spatula (credit card) and a cotton cloth.

But even on the liberal side of AS5 requirements, I never had any indication that very much of it was available to relocate somewhere else in the case. AS3 may be different, but it seems that once you lay down a wad of AS5, it pretty much stays put.

 

[davexl]

I have tried many combos with AS5 and found that a 5 point (like you see on a dice cube) works well for me.

One grain in the middle and then one smaller dab halfway to each corner - 10-15mm from the middle.

That way you get the best of both worlds - thin coverage, as well as greater total surface area.

Of course, this is only a matter of a degree or two. More significant was moving from a Zalman 7700 to a Big Typhoon - dropped 11C !