I think I am confused (no big surprise there ), but how does he reuse all the stock hardware (except the backplate) when it is the stock standoff pins (the height) that are the problem in the first place?
All I replaced were the stock standoff pins. I'm quite baffled to think how one would be able to salvage using the same standoff pins but not be able to use the stock backplate
What am I missing here?
Maybe I'm missing something, too, but the designs I have worked with have fasteners with a threaded portion that ends abruptly with an increase in shank diameter. The non-threaded portion acts to set the spring preload. My assumption is that the washers had an ID large enough to allow the non-threaded shank to pass through, thereby effectively shortening the shank and increasing spring preload, or in this case, bringing the water block closer to the board while maintaining acceptable preload.
...but how does he reuse all the stock hardware (except the backplate) when it is the stock standoff pins (the height) that are the problem in the first place?
This is correct. The H110 doesn't work the same as the H100. Also, I'm not really losing anything from spacing the backplate as the H110 backplate is made of super flexible plastic so its not really adding any rigidity even when up against the motherboard. I still have the CPU plate though.
The H110(and similar newer Corsair blocks) don't use standoffs like the H100.
Those posts have internal springs and thread right into the backplate 'nuts'. The posts are designed to 'bottom out' (the thread, not the spring) so you know when you're at the right tension when you can't turn them anymore. By moving the backplate and nuts 3mm further from the board, I've just added 3mm of additional preload on the springs to compensate for the 2.5mm lost to the IHS being absent. So an additional 0.5mm above factory spec which ended up being fine.
I know it isn't popular to talk about it, but that is basically what an Itanium-like microarchitecture would do. Double or quadruple the width, drop the clockspeeds so power stays reasonable, and get the compilers to do more work for you.
One is the push-pull pumping effect that comes with the mechanical expansion and contraction of the silicon, the TIM, and the overhead IHS. Eventually, given time, the TIM itself will be squeezed out of the gap that it occupies between the die and the IHS and an air gap will be left in its place. The air gap most likely forms when the CPU cools down.
Then when the CPU heats back up, the air gap prevents the IHS from heating up in concert with the die and the TIM, resulting in an IHS that is not expanding to fill in the air gap, leaving the CPU much hotter than before.
This shouldn't be a problem when delidded right? With the adhesive removed, there's a constant down pressure due to the mounting mech. Even if some of the TIM gets pushed out, the down pressure should keep any air gaps from forming and the mounting mech should 'absorb' some of the added pressure from the expansion. The TIM should get thinner and thinner until the added pressure from the expanding parts doesn't really squeeze any TIM out and the cooldown phase should suck some the TIM back in on the edges. Perhaps the edges will see the worst degradation but that shouldn't affect performance all that much.
I mean, this is probably the same reason why using overly excessive amounts of TIM doesn't really matter. It will eventually settle to the same thickness.
I never liked the old warning of use the right amount of TIM or else you'll get horrible temps even worse than using no TIM at all. Yeah its good practice but its not nearly as horrible as people made it out to be and I never believed it considering how viscous TIMs were there was no way an excessive amount could have stood up to the mounting pressure of any historical mount.
Hi All,
After viewing this forum and this other forum link, I decided to get a 4770 (VM machine) and a 4770k (gaming/PROD machine) and delid them.
The first one is the 4770.
Managed not to get a picture of temps before, and I do remember them being around 76C with the last core being around 65C.
As the images will show, it gets a lot better with a bit of CoolLaboratory Ultra and MX-4 for some direct die air cooling.
Enjoy! I will post again with 4770 k delidding etc.
I am loving it after I shut down my core 2 quad 2.83 GHz system.
Any opinions on the vice method? Anyone tried it and cant tell their experience on the subject? Plan on delidding if i see that temps are really that bad on my 212+
Any opinions on the vice method? Anyone tried it and cant tell their experience on the subject? Plan on delidding if i see that temps are really that bad on my 212+
I have seen some people put an anti static bag (those from used mobos come in handy I guess) on the other end of the table so if you overdo it when slamming the die and goes flying the bag can at least catch it without any worries.