I assume I'm supposed to leave the 4 rubber "feet" that came on my T-Bird 1200 (which I just received a few minutes ago) on the processor, right? Without any pressure they create an air gap between the TBird core and my Taisol HSF, but it looks like if I apply pressure (as the clips will do), that the rubber feet will compress. Have I got this right? (Don't want to fry my shinny new BLUISH purple core TBird!!!)
Also, I'm best off scrapping the sticky gunk that came on the bottom of my Taisol off, right, and instead applying a couple of drops of thermal paste (I got the Chemtronics stuff) to the core and finger smearing it???
Finally, as I understand it, all the Tbird 1200's come unlocked, right? So I don't need to do the pencil (or rear window defogger) trick first, correct?
I've got one of the NEW BXHA chips!!! Yippee! Assembled in Malaysia. Is that good or bad? Looks like it is either week 103 or it was made in the third week of '01 -- not sure how to read that.
Also, I'm best off scrapping the sticky gunk that came on the bottom of my Taisol off, right, and instead applying a couple of drops of thermal paste (I got the Chemtronics stuff) to the core and finger smearing it???
Finally, as I understand it, all the Tbird 1200's come unlocked, right? So I don't need to do the pencil (or rear window defogger) trick first, correct?
I've got one of the NEW BXHA chips!!! Yippee! Assembled in Malaysia. Is that good or bad? Looks like it is either week 103 or it was made in the third week of '01 -- not sure how to read that.