most likely only for cards at similar speed brackets, eg. 6870 to 7770 or something like that.Will the jump to 28nm mean less power consumption and temps? My knowledge on gpus sin't all that good.
most likely only for cards at similar speed brackets, eg. 6870 to 7770 or something like that.Will the jump to 28nm mean less power consumption and temps? My knowledge on gpus sin't all that good.
AMD is reportedly already preparing its next series of Radeon HD 7000-series GPUs, and planning to start mass production of the new chips in May this year...
http://www.bit-tech.net/news/hardware/2011/04/15/radeon-hd-7000-due-june-or-july/1
My guess on the specs
Going by the 100% jump in performance from HD4870(55nm) to HD5870(40nm) i would say the new HD7970(28nm) will be around 100% Faster then HD6970(40nm) and slightly faster than two of them in crossfire
Released befor the Nvidia GTX680
Stream Processors 3048
Texture Units 128
ROPs 64
Core Clock 1020MHz
Memory Clock 1.7GHz (6.8GHz effective) GDDR5
Memory Bus Width 256-bit
Frame Buffer 2GB
FP64 1/4
Transistor Count 3.2B
Manufacturing Process TSMC 28nm
1x6,1x8 pin power, TDP 250W
Price Point $369US
If you look at the improvement from the HD4870 to the HD6870, that's a better measure of how much a process can help, since that's 256mm^2 vs 255mm^2, pretty much exactly the same die size, and it's not a doubling in speed.
Haha we will not be seeing a 100% performance increase.
It's also a lot bigger (256mm^2 vs 334mm^2).
Not hard to make something 100% faster when you make it bigger as well, and on a smaller process.
I don't see AMD making a potentially 510mm^2 die for their top end chip to double the speed of the HD6970 (389mm^2).
This is a valid comparison IMO.. increasing performance/die space makes sense.
I am not saying that HD7970 will be 100% faster than HD6970, but there is a strong possibility that AMD left out some innovations and improvements on 40nm which they will likely incorporate into their 28nm GPU designs. There could still be some "hidden" improvements to their newest architecture. Keep in mind Kepler is going to be a Fermi II architectural design. NV has outlined that Kepler will be significantly faster than Fermi. So AMD can't just release GPUs with a mere 20% performance increase or they won't stand a chance against a new architecture from NV.
But you shouldn't be comparing a high end card of the previous generation (i.e., HD4870 was 55nm) to a mid-range card of this generation (i.e., HD6870 on 40nm). The proper comparison is to look at HD4870 to the HD5870 since HD4870 is a high end card and HD6870 is a mid-range card. 55nm to 40nm is also only half a node decrease in size. Going from 40nm to 28nm is a full node. So the performance difference compared to the HD5870 should be substantial at 2560x1600 (for lower resolutions, there is practically no reason for anything faster than an HD6970 imo).
Also, HD6870 has 2x the ROPs, 16 more TMUs, and 320 more SPs compared to the 4870, while being clocked 20% faster (and AMD achieved that on just half a node!). Remember, those ROPs are 2-4x slower than they are in the HD6970 architecture, depending on the scenario. Take a 28nm HD6970 chip, double its ROPs and shaders, increase clock speeds to 1000mhz and that thing will smoke a 40nm 6970.
I think the 7970 will be as fast as 2 6950's in crossfire and have 2816 sp's. I believe it will include some cpu/gpu like features kinda like the fermi chips and with better tessalators. Core clocks around 850.
Just out of curiosity. I read something awhile back about the technology getting close to its limits in terms of how small it could get. I believe it was something along the lines of 1Xnm would be the smallest.
My question is that seems to only be 2 years off. So what then ?
Temperature has nothing to do with process. Having a smaller process, bigger process, more, fewer transistors, higher, lower clockspeeds don't matter when it comes to temperatures. The heatsink and fan is the main determining factor.
In terms of power, it means less power use at a set level of performance.
That doesn't mean the top end GPU uses less power, it means it uses an amount of power which could be higher, lower or equal to the previous top GPU, but it runs faster.
28nm = more transistors in a given die space, more performance at a given price point.
Unless AMD makes something compelling, I am going with nVidia next round. I like to switch things up every generation.
Don't underestimate TSMC's ability to disappoint.
I think the 7970 will be as fast as 2 6950's in crossfire and have 2816 sp's. I believe it will include some cpu/gpu like features kinda like the fermi chips and with better tessalators. Core clocks around 850.
65nm to 55nm = Half Node
55nm to 40nm = Half Node
40nm to 32nm = Half Node
40nm to 28nm = Full Node
With a Full node we will have double the transistor count at the same die size of the previous node. That means we can double the HD6970 and keep the same die size.
HD5870 has double the transistor count and larger die size of the HD4890 because we had a half node shrink from 55nm to 40nm.
90, 65, 45, 32 are full nodes. At least in recent memory, you've always seen cpus on these nodes. 80, 55, 40, and 28 are 1/2 nodes. Apparently the new normal for gpus is to keep to 1/2 nodes. ATI was at 80 and 55 while NV was at 90 and 65, respectively, but nvidia finally caught up (7 mos late) at 40 nm. Now that they've bitten the bullet they should theoretically have made up the process gap, though this will in large part depend upon tsmc's and, later, GF's ability to deliver.
"Half" nodes:
55 -> 40 -> 28 -> 20
A sensible guess would be that they would aim for a similar size die to this generation, meaning a die size vs die size comparison makes a lot more sense than a high end vs high end comparison where die size has changed by 33%.
Im talking from one process to the next, from 55nm to 40nm is a half node and from 40nm to 28nm is a Full Node.
A full node shrink will allow you to ~double the transistor count and ~keep the same die size in relationship to the previous process.
GT200 at 65nm = 1.4B transistors and 575mm2
GT200B at 55nm = 1.4B transistors and 470mm2 (Half Node from 65nm)
GF100 at 40nm = 3.2B transistors and 530mm2 (Full Node from 65nm) double the transistor count same die size from 65nm. (40nm is a little bit more than full node from 65nm)
"The 32-nm process is a cost-down version of its 40-nm technology, while 28-nm is considered by TSMC as a ''full-node'' offering." - EETimes