What makes you think Intel can't let them go for less if they need to? They charge what they do because they can, not necessarily because they need to. Sure maybe budget tablets are probably a no go but if Intel clean up in other segments then I'm pretty sure everybody else is going to feel the pinch if they're confined to dirt cheap models. Tablets could be a way to subsidize more lucrative markets, the same way a company like Nvidia fund their HPC aspirations with lower margin mainstream GPUs. The only question Intel need to ask themselves is whether or not it's worth using their limited 14nm fab capacity for. The problem isn't whether they'll make money or not, it's whether they'll make enough to justify it
True for lower-end consumer boards but not for server/HEDT and probably the higher-end Skylake DT boards. It will be possible to use several DDR4 LRDIMMs on one channel. These Load Reduced DIMMs use active buffering so that they have bus load characteristics of a single DIMM even when multiple DIMMs are present on the bus. Really no different from DDR3, where you already need RDIMMs or LRDIMMs for using many DIMMs per channel (e.g. IVB-E up to 3 DIMMs/channel, IVB-EX up to 6 DIMMs/channel).Its still a parallel bus. Point to Point limits it to 1 DIMM per channel. So a dualchannel DDR4 board will only have 2 sockets.
True for lower-end consumer boards but not for server/HEDT and probably the higher-end Skylake DT boards. It will be possible to use several DDR4 LRDIMMs on one channel. These Load Reduced DIMMs use active buffering so that they have bus load characteristics of a single DIMM even when multiple DIMMs are present on the bus. Really no different from DDR3, where you already need RDIMMs or LRDIMMs for using many DIMMs per channel (e.g. IVB-E up to 3 DIMMs/channel, IVB-EX up to 6 DIMMs/channel).
Right. LRDIMMs and digital switches, like this:True for lower-end consumer boards but not for server/HEDT and probably the higher-end Skylake DT boards. It will be possible to use several DDR4 LRDIMMs on one channel. These Load Reduced DIMMs use active buffering so that they have bus load characteristics of a single DIMM even when multiple DIMMs are present on the bus. Really no different from DDR3, where you already need RDIMMs or LRDIMMs for using many DIMMs per channel (e.g. IVB-E up to 3 DIMMs/channel, IVB-EX up to 6 DIMMs/channel).
http://translate.google.de/translate?sl=zh-CN&tl=en&js=n&prev=_t&hl=de&ie=UTF-8&u=http%3A%2F%2Fchinese.vr-zone.com%2F93079%2Fskylake-cpu-will-belong-to-braswell-platform-and-intel-x86-cpu-will-get-more-android-support-future-12032013%2F&act=urlIn the data, we also saw the first named after Intel Broadwell platform, on the same platform as the 14nm process, Intel will replace Broadwell with Braswell, and import DDR4 memory. Intel in Haswell-E / EP platform has been imported DDR4 memory, but in general Broadwell platform will remain in DDR3, Braswell platform until 2015 Skylake processor.
http://vr-zone.com/articles/intel-t...paign=intel-trying-make-android-pc-mainstreamThis document also reveals that the successor to Broadwell, on the Skylake microarchitecture, will be called Braswell. Braswell will be using the 14 nm process node and will support DDR4 RAM. Skylake and Braswell are expected out in 2015.
You mean 32GB, right? 8GB DIMMs will be fine for notebooks, but 16GB DIMMs need to be available before it will make sense to move to DDR4 on desktops, with only 2 DIMMs maximum.Buffered DIMMs are usually slower and more expensive the last time I checked (of course, that was for non-critical server DIMMs wo/ECC). I think DDR4 is going to be available with up to 8 GB DIMMs, from the start, and eventually 16 GB - so I don't think having only 2 DIMM slots is going to be a problem (especially at the low end where 2x2 or 2x4 will be the norm) - IIRC.
You mean 32GB, right? 8GB DIMMs will be fine for notebooks, but 16GB DIMMs need to be available before it will make sense to move to DDR4 on desktops, with only 2 DIMMs maximum.
There will be 32 GB DDR4 sticks from the start. Of course that kind of capacities will be targetted for server products, rather than for consumer market.Buffered DIMMs are usually slower and more expensive the last time I checked (of course, that was for non-critical server DIMMs wo/ECC). I think DDR4 is going to be available with up to 8 GB DIMMs, from the start, and eventually 16 GB - so I don't think having only 2 DIMM slots is going to be a problem (especially at the low end where 2x2 or 2x4 will be the norm) - IIRC.
There will be 32 GB DDR4 sticks from the start. Of course that kind of capacities will be targetted for server products, rather than for consumer market.
http://wccftech.com/samsung-launch-ddr4-32-gb-ram-memory-sticks/
I'll bet we'll see at least 128 GB sticks before DDR4 get replaced by newer standard.
http://vr-zone.com/articles/intel-t...paign=intel-trying-make-android-pc-mainstream
Braswell based on Skylake makes no sense. I think Braswell is Broadwell with DDR4.
Found the post I was making - it didn't post for some reason, maybe I accidentally hit "preview post" instead of submit:
I read elsewhere on vr-zone that Skylake will come out first for Workstations and Servers - though it looks like it's only for single socket quad core :| So that would make sense, as Braswell will probably still serve the mobile market (and desktop?). I would think OEMs might want LPDDR4 to be available by then, for ULV-Y based notebooks.
If these rumors are true, I wonder what's up with Skylake for the desktop and mobile? And, when will Skylake-EP be available?
Oh, here's the link.
If these rumors are true, I wonder what's up with Skylake for the desktop and mobile? And, when will Skylake-EP be available?
Oh, here's the link.
And roughly a year later for workstations and servers. (2016/2017 timeframe).
I see a desktop Roadmap with Skylake placed within 1H 2015 in your link.
Entry Xeon E3 line shouldn't come later than desktop. Skylake-E, -EP, -EX of course come way later.