But there are probably good reasons for Intel to not have done that.
Arachnotronic however big a company is its basically run by very few people at the highest level, the most important of whom is the CEO. They make all the important decisions which determine the future and direction of a company. We have seen CEOs like Hector Ruiz destroy AMD due to sheer arrogance and complacency and plain bad business decisions (like overpaying for ATI). Brian Krzanich seems to be one of those kinds according to canard pc who recently wrote about the general mood and state of projects within Intel. charlie also hinted at some major problems some of which are management related.
http://www.portvapes.co.uk/?id=Latest-exam-1Z0-876-Dumps&exid=threads/semiaccurate-coffee-lake-points-to-issues-with-intel’s-10nm-process.2495934/
You might want to believe everything is fine at Intel but I think the next few years will point out how bad the problems are.
Sure they could do it... they did it with socket lga1366. Its like when I first bought into x58 / 1366 which was released years ago, they only had 4c/8t cpu's and a year later they released 6c/12t cpu's so if they could manage it back then for the same socket then for sure they could do it again for todays Z270 motherboards.The problem is Intel called AMD's bluff to many times that when AMD finally does have a killer hand Intel is blinded to past reoccurring bad hands from AMD and Intel can't see there own bad hand and is still expecting AMD to bluff.But this time its looking like AMD's the one with the killer hand..Would this even be possible without changing the socket?
Just a bit of idle speculation here, but what would stop Intel from just releasing the smallest HEDT die (with the same architecture) in an LGA-115x package? We're apparently seeing the reverse with KBL, mainstream dies in LGA-2066 package. Software and platform issues should be fixable.
Arachnotronic however big a company is its basically run by very few people at the highest level, the most important of whom is the CEO. They make all the important decisions which determine the future and direction of a company. We have seen CEOs like Hector Ruiz destroy AMD due to sheer arrogance and complacency and plain bad business decisions (like overpaying for ATI). Brian Krzanich seems to be one of those kinds according to canard pc who recently wrote about the general mood and state of projects within Intel. charlie also hinted at some major problems some of which are management related.
http://www.portvapes.co.uk/?id=Latest-exam-1Z0-876-Dumps&exid=threads/semiaccurate-coffee-lake-points-to-issues-with-intel’s-10nm-process.2495934/
You might want to believe everything is fine at Intel but I think the next few years will point out how bad the problems are.
Intel should not lift a finger until RyZen has been shown to outperform Intel for less money. And I don't think they have done a thing regarding RyZen beyond work on media responses.Just a bit of idle speculation here, but what would stop Intel from just releasing the smallest HEDT die (with the same architecture) in an LGA-115x package? We're apparently seeing the reverse with KBL, mainstream dies in LGA-2066 package. Software and platform issues should be fixable.
Intel could claim that with the KL refinement of SL, more cores are now cheaper. And we'd all believe it. Right now HEDT is still clunky old expensive Broadwell...There won't be a 10nm solution for pc for years to come, so yah, they are hopelessly stuck on 14nm. And as we saw with kabylake, they cannot squeeze additional ipc out of it either. Now clock speeds are likely maxed too.
The only trick left in the bag is more cores, and they don't want to do that because they have been grooming the consumers to accept ever higher prices. And their pricing is largely based on more cores being exponentially more expensive.
If RyZen needs a reaction, Intel could probably get 10nm on the board earlier than expected.There won't be a 10nm solution for pc for years to come, so yah, they are hopelessly stuck on 14nm. And as we saw with kabylake, they cannot squeeze additional ipc out of it either. Now clock speeds are likely maxed too.
The only trick left in the bag is more cores, and they don't want to do that because they have been grooming the consumers to accept ever higher prices. And their pricing is largely based on more cores being exponentially more expensive.
If RyZen needs a reaction, Intel could probably get 10nm on the board earlier than expected.
One thing is for certain, if RyZen requires a reaction, Intel will react.
The only uncertainty is how they will react.
Well, if they didn't have something much better than KL in the pipeline already, they can't really react any time soon, except with prices.Im also in the we need to wait and see actual real benchmarks bandwagon before getting to carried away. BUT even if only 1/10th of the leaks are accurate then its safe to say that Ryzen does require a reaction, and intel should be planning that reaction already.
Well, if they didn't have something much better than KL in the pipeline already, they can't really react any time soon, except with prices.
Unless Intel has that 10nm chip up it's sleeve and ready...
IIRC, SL-X is a 15% improvement at best, and that's what Intel says?.
If they have working ULV 10nm chips, it doesn't seem like it would take too long to turn out working DT chips.
But there's no indication that 10nm is a big ipc improvement, either.
It's possible that Intel's biggest problem with RyZen is TDP, not IPC. Energy usage is a bigger concern these days.
10nm may be the only solution for that.
Who would buy it? What's the value prop of such a product?
Their smallest HEDT die is 250mm^2. Would it properly fit in a Kaby Lake package? Is it worth the costs for Intel considering we're talking about having up to 6 cores on mainstream? (This die is 10 cores)Just a bit of idle speculation here, but what would stop Intel from just releasing the smallest HEDT die (with the same architecture) in an LGA-115x package? We're apparently seeing the reverse with KBL, mainstream dies in LGA-2066 package. Software and platform issues should be fixable.
If Intel's financial performance starts deteriorating, I'll be much more inclined to believe you that Intel is doomed.
Right now I see no financial evidence of the "doom and gloom" that you are saying (record revenue, record margins, diversifying into new businesses, etc.), but we'll just have to see how the next few years play out.
Their smallest HEDT die is 250mm^2. Would it properly fit in a Kaby Lake package? Is it worth the costs for Intel considering we're talking about having up to 6 cores on mainstream? (This die is 10 cores)
Their smallest HEDT die is 250mm^2. Would it properly fit in a Kaby Lake package? Is it worth the costs for Intel considering we're talking about having up to 6 cores on mainstream? (This die is 10 cores)
Now that's a plausible explanation for KBL-X, not the oddly shaped budget SKU for the high-end platform argument.I'd be surprised if KBL-X is a dedicated enthusiast line. Most likely it'll have a Xeon E3 variant and be far more profitable there.
Intel should not lift a finger until RyZen has been shown to outperform Intel for less money. And I don't think they have done a thing regarding RyZen beyond work on media responses.
Intel should not lift a finger until RyZen has been shown to outperform Intel for less money. And I don't think they have done a thing regarding RyZen beyond work on media responses.
Physically, there's no limitation. The desktop LGA 1151 socket is 37.5mm x 37.5mm. That's 1400mm2 of space, way beyond lithography limits. In mobile chips, dies can often be nearly 50% of the package size.
The limitation is almost always financial and market positioning. Just like we have CPUs with iGPU taking up half the space. The cost of silicon is negligible compared to everything else and how much it sells for plus you have a huge market that needs them and pays for R&D and the miniscule increase in costs brought on by a larger die.
I'd be surprised if KBL-X is a dedicated enthusiast line. Most likely it'll have a Xeon E3 variant and be far more profitable there.
People really need to get out of the PC mentality. Desktop is no longer a focus for Intel.
All this doom and gloom that AMD is going to put Intel out of business, or the fall is coming. But yet look where Intel is investing - Altera, DCG, IOT, Mobile, Deep Learning. These are all growth markets where AMD doesn't play.
If Intel's financial performance starts deteriorating, I'll be much more inclined to believe you that Intel is doomed.
Right now I see no financial evidence of the "doom and gloom" that you are saying (record revenue, record margins, diversifying into new businesses, etc.), but we'll just have to see how the next few years play out.