Not sure about the cold soldering, but the thermos question is pretty straightforward. There is a parameter that dictates how rapidly energy can be transferred through a barrier: the thermal diffusivity. This is equal to the thermal conductivity divided by the product of density and heat capacity (k/rho*Cp). The process for energy transfer is the same, regardless of whether the thermos contents are hot or cold - only the direction of energy transfer is changed. So, by minimizing the thermal diffusivity, one can create the best-insulated thermos.
On a more complex level, the thermal diffusivity is a proportionality constant in the diffusion equation, the partial differential equation that describes the transient temperature profile: dT/dt=alpha*d^2T/dx^2. T = temperature, t = time, alpha = thermal diffusivity, and x = position within the wall of the thermos. Entire books have been written on the solution of this equation for all types of boundary conditions.