Originally posted by: cmdrdredd
Originally posted by: hags2k
I originally posted this in another thread on a similar topic, but that thread seems to be dead.
So, from what I've read (http://www.silentpcreview.com/article191-page1.html a good article for example) the readings your motherboard gives can be pretty inaccurate.
Mine are
Idle: 43C
Load: 63C
System/Motherboard: 43C
E6600 stock speeds, stock voltage, stock HSF, 120mm case fan, 21C ambient (according to the thermometer in my room).
I know something is up, because even at full load I can touch the heatsink and it's barely warm to the touch. I also know it's seated well and I'm using Artic Silver 5 thermal compound. I reseated the fan several times, and one time I did NOT get it reseated well and my temps spiked about 15 degrees higher idle. Also, when I ramp up the cpu usage while touching the heatsink, I can feel it getting warmer, but at idle it's practically cold to the touch, and simply gets warm under load, not hot by any means.
The northbridge chipset heatsink next to the processor, in contrast, is VERY hot to the touch. I'm not sure if that's the other temp my bios (and speedfan, which always matches the bios) is giving me, but I'm just guessing.
Also, my system, even with a bit of overcocking (from 2.4 to 2.53 Ghz) continues to be rock-solid stable, using prime95, cpustress test, folding@home, and also when running seti@home and einstein@home simultaneously (which actually gets my cpu hotter than any of the other programs I've used)
So, what do you guys think? Inaccuracies, or perhaps some conroes just like to run hotter than others?
I know the P5B Deluxe reads wrong, and I believe other apps are still wrong too. With that beuing said I've noticed that some people have a concave IHS on their C2D which prevents a good physical contact between the Heatsink and CPU. The only way to fix it is send it in for RMA and hope the next one is good, or lap it and make it flat yourself.
That's a really interesting point. Would that be rectified to a certain extent by putting more thermal compount on the heat spreader (to fill in the concave hole, so to speak), or are you saying that the IHS is DOMED so that the cpu core underneath isn't contacting the spreader well?