Coollaboratory Liquid Pro works well but you have to be careful applying it. It is basically liquid metal and just a small, small amount is necessary. There are a few videos online that show people applying it and a thread here on the forums where someone took pictures of using it on their CPU die. The one thing you also have to be careful of when applying it is that it doesn't touch any bare copper as it can cause degradation of that copper; same with Collaboratory Liquid Ultra.
Now that I've delid my 4770k, what is the best thermal paste to use?
I've heard MX4 and some other ones. What would you guys use?
Thanks!
Now that I've delid my 4770k, what is the best thermal paste to use?
I've heard MX4 and some other ones. What would you guys use?
Thanks!
Now that I've delid my 4770k, what is the best thermal paste to use?
I've heard MX4 and some other ones. What would you guys use?
Thanks!
how much of a decrease in temps is expected when simply de-lidding and scraping the black adhesive off the PCB and putting it back together without TIM inside? (obviously TIM between the IHS and the HSF)
P.S. just asking about Haswell, i know better than to delid a 2500K.
It's funny how so many people are quick with their opinion "MX-4 is best" etc...without having a base for their claims.
I researched this very same topic the last days and the internetz are full of people who either recommend AS5 or MX4 and where it's clear they NEVER actually did it or have hard numbers to back up their claims. WITH VERY FEW exceptions.
Short: MX-4 for direct die applications is supposedly really bad. MX4 is great for normal stuff on the large lids...but it sucks for direct-die.
Which ALSO makes me question how well MX-4 actually does when used for notebook GPUs/CPUs which basically are also "direct-die".
.......
Drying up and becoming a poor tim in a few weeks is pure FUD. MX4 is quite popular for some time and if it were that terrible, the general community would've noticed it.
I use MX-4 between the IHS and CPU cooler, and it works great. The problem, or so I've read, is when applying it to a tiny area, like between the CPU die and IHS or directly between the die and cooler/water block.