One thing that will markedly reduce temperatures is the CPU voltage.
The problem here is that if you are relying on software like CPUz to tell you the CPU voltage then you are truly left blind by the mobo BIOS makers because it is complete hit and miss.
I had no idea how much the actual voltage applied to the CPU meanders as a function of BIOS rev for a given mobo until I started measuring my Vcc externally with a voltmeter while keeping track of it via CPUz.
Some BIOS revs the Vcc would be under-reported (CPUz would report 1.2V when actual was 1.25V, etc), other BIOS revs would result in Vcc being over-reported (CPUz would report 1.2V when actual was 1.15V, etc), and other BIOS revs were dead-nuts accurate to within CPUz own internal forced quantization/rounding (it rounds down in 0.008V increments).
What I learned from that was if you see big changes in your CPU temperature when you change the BIOS then it is very likely that what you aren't seeing is a huge change in the actual applied voltage to the CPU as well.
Which in the end is a good thing, don't look a gift horse in the mouth
Based on the measurements taken and reported in posts
77 and
78, the IHS metal thickness (the part that is sandwiched between the CPU die and the HSF) is 4.15-1.57=2.58mm.
So ~2.6mm thick.
From the heat-spreader angle you want the IHS to be as thin as possible. A thick IHS is no different than having a thick copper plate attached to the bottom of the HSF covering up those direct-contact pipes in the first place.
On the desktop the IHS is there to physically protect the die as well as to enable a very cheap stock HSF while still hitting the thermal targets.
That is why the IHS is not even used on mobile solutions. The environmental exposure is well controlled by the OEM that is assembling the laptop, and the cooling solution is at a premium for space and weight reasons so they don't mess around with an IHS whatsoever.