*Snip*
The key thing we're looking for is any sign of a significant degradation from point of initial diamond-TIM application due to "pumping out" or "voids" and so forth. You might be able to accomplish the same thing in a couple weeks, but you'd have to keep your attention on it, going through the paces of cooling and heating several times and loading up the processor at least as many times.*SNIP*
I got everything together, but had to remove part of the loop due to a leak in my cpu block..This is the second time this has happened, and it is actually a problem with the way Enzotech designed the block..
If you use their included barbs, everything is fine, since they are the standard G 1/4 thread, but they are threaded nearly 60-70% longer then my BitsPower Compression fittings..This means that you don't get a good seal if using aftermarket barbs..It really is a shame since this is still one of the top 3 blocks on the market in relation to flow rate and cooling potential, and number one in terms of cost vs. performance!
I was able to get the leak fixed up, re-assembled the loop, and leak tested/bled it for 24hrs without an issue..I am reinstalling Windows 7 now, and will get some pictures uploaded once that is complete!..
Testing wise, I am an avid Folder B.D., so my plan was to Fold some test Work Units using a F@H stability program a friend @ [H] developed for us..F@H stresses the cpu way more then any other stability program, and generates the highest CPU temps I have ever seen vs. Prime95/IBT..
I plan on running the cpu @ 100% load for 24 hrs after I find my max stable OC. then will shut it down overnight and will resume 100% the next day..I can do this for as long as you guys wish, and since I am at home all week (I have a 100% disability so I don't "work" outside the house), I think I can generate the data you are looking for rather quickly..
Of course, if there is anything special you want me to do, feel free to chime in and I'll gladly do it..Keep in mind that I do not have any "stock" data, other then the temps I observed while using the stock Intel HSF for a short period of time to make sure I did not have any DOA parts before switching to water..
It costed me a bit moreto do mine than what you did , I had mine lid off and had it machined down so that the processor was a half a thousand taller than the lid. I mounted my waterblock directly on the die used the lid as a lock down and to stop rocking on the die only . I setting at 5.1 ghz very pleased with my temps . I can talk about it now since haswell is on the horizon . Clearly I don't tell people what I do for sometime after the fact . Why should I ?
I have read, and re-read your post, and either I am stupid or cannot seem to grasp seveal things...
1. You said you had the lid off and had it "machined" down..I assume you mean that you removed the IHS, and that is what you had "machined" down to just a hair taller then the stock retention bracket's "lid"??
2. Your second statement makes it seem like you removed the IHS, and then you state that you mounted the cpu block directly to the die
WITH the stock retention bracket
STILL in place?
I took this statement to be a contradiction of the way I interpreted your first, in that the "LID" you had "machined" was NOT the IHS, but the "LID" of the stock retention bracket..Would you mind clearing up which of these statements is the way you did in fact proceed..Also, do you have any pictures?
3."Clearly I don't tell people what I do for sometime after the fact . Why should I ?"...
I'm a bit confused as to what this statement is referring to? The reason you "should" share things is to help benefit the other members here who do not have the ability (or Guts maybe :biggrin to do the things we do in search of the highest overclocks/best cooling methods..