I know this is a bit off the wall for a computing forum but I know you guys and gals have wide experiences.
I am currently working on gold spit being deposited by electron beam evaporation onto a Platinum coated wafer.
What we believe the problem to be is that an organic surface is forming on the liquid gold and so occasionally causes the gold to bubble and spit at the wafer which causes problems for the electrical circuit.
Thanks in advance as I know this is a bit strange, but I wouldn?t ask you if I didn?t think you could come up with an answer.
Any ideas on what I can do or what the problem really is?
Cheers.
I am currently working on gold spit being deposited by electron beam evaporation onto a Platinum coated wafer.
What we believe the problem to be is that an organic surface is forming on the liquid gold and so occasionally causes the gold to bubble and spit at the wafer which causes problems for the electrical circuit.
Thanks in advance as I know this is a bit strange, but I wouldn?t ask you if I didn?t think you could come up with an answer.
Any ideas on what I can do or what the problem really is?
Cheers.