I'm reading that ASML apparently can reach 200W, but I don't see that in wafers per day processed numbers and the information from Intel/TSMC.
At the SPIE Advanced Lithography conference, Intel confirmed that there were four running EUV tools with 80 W light sources around the world as of early 2016, up from one a year ago.
ASML also said that it could operate a 200 W light source for one hour with full dose control.
So I guess that explains the "EUV isn't a matter of if anymore, but of when". They "just" need to make sure the availability becomes like 95% instead of 1 hour.
EUV is coming, but it's painstakingly slow and with lots of challenges. In hindsight they should probably have invested more and earlier in the technology. I mean, everyone knew this time (without better lithography) was coming. Without lithography, you can't really do much to advance Moore's Law.
My bet is that EUV will probably be used from the start (by Intel) at 7nm.
7nm is coming in 2019 at the earliest, so that should be long enough.
(I mean, we're hearing about steady progress here, but it suddenly seems like people are doubting EUV will come even at 7nm, while just one year ago, people were still thinking it would/could be inserted at 10nm.)