Excluisve pictures of Intel's NEW P4 (533FSB) Northwood @ 2.53Ghz

[NucleusWDS]

Check out these exclusive pictures and preliminary scores ...

HERE

 

[WilsonTung]

Nice! I have a few questions -

Is it the new stepping of Northwood derived from 300mm wafers?
Can it reach 166 MHz x4 FSB?
How high does this chip go with standard cooling?

 

[Bozo Galora]

was that 3001 overclock with factory heatsink?

 

[NucleusWDS]

I haven't pushed the system that much ...

Yes, I used a standard stock HSF

It probably can overclock above 166x4 ... I'll let you know ;-)

 

[EXman]

w00t!

the 3ghz benchies are silly fast

 

[BD231]

Wow, 3ghz. Thats one insanely fast chip!

 

[Adul]

dasm! :Q

 

[LordAccord]

wow.

 

[MadRat]

Bravo on your overclock!

Now go here and compare your 3GHz rig to thier ultra aggressive 2.8GHz rig. I'm guessing that the aggressive DDR400 setup they have will perform a smidgeon better than yours in some areas, but not many. It would be nice to see if PC1066 rigs make a difference, too, not that you should run out and buy some...

 

[jbond04]

Do all 2.53GHz P4's run off of this stepping, or is it just because you got an engineering sample? I have the funds to buy a 2.53GHz, so...

 

[MadRat]

There is a 2.2GHz version of the B-stepping - supposedly! I wish that my history wasn't cleared when I purged temporary internet files. I just saw a website earlier this week or over the weekend that had overclock results compiled on the new B-versions and some of them were toting mid-3GHz scores.

 

[jbond04]

Mid 3GHz!!! :Q Wow! I wish there was a way to validate what stepping I would be getting...

 

[BD231]

At this point it would seem reasonable for many to get to the 3ghz mark. Intel?s roadmap is pretty aggressive so working on cores that can reach 3ghz+ looks to be a #1 on their priority list.

 

[jbond04]

Here's the deal:

Over the weekend I will be buying an ASUS P4T533-C motherboard, 1GB of 32ns PC1066 RDRAM (I have a source), and a 2.53GHz P4...

I will overclock it as far as I can, but a new stepping of the P4 would be very helpful, considering my mobo/RAM combo should have quite a bit of headroom. If anyone can find a link to a site that guarantees a "B" stepping (not version) of the P4, I would be more than grateful...

 

[DAPUNISHER]

Well done! Please post more overclocking results by all means

 

[Bozo Galora]

Nucleus - I wish you could clarify a few things.


I would guess that since its a free review sample from intel that its hand selected!
I dont think there is a new "stepping" of the 2.53 - just a 478 pin cpu
officially guaranteed of its running at 133 bus at a 19X muliplier.
In other words - no new architecture.
But I'm open to input on this.

I dont understand the "exclusive" part of this, since the chip has been out for a month with 2.53 reviews all over.

Many people here are amazed at 3gig, but only because most dont spend $700 for a CPU. But its nice to know IF REPRESENTATIVE OF EVERYDAY CHIPS.

and these are COPPER 300mm P4's:
(but blurb does not say if 2.4 described is 2.4/100 or 2.4/133)

(Quote)

"CHIPWORKS INSIDE" THE INTEL® PENTIUM® 4 PROCESSOR

OTTAWA, Canada, May 23, 2002 - Chipworks, a world class leading supplier of reverse engineering services for the semiconductor, photonics and electronic systems markets, today announced that they have released their findings describing the breakthroughs in desktop processor technology discovered inside the Intel® Pentium® 4 "Northwood" processor.

"The Intel® Pentium® 4, 2.4 GHz, 1.5V microprocessor is fabricated with Intel's advanced copper metal, 130 nm process", stated Dave York, Chipworks' manager, process analysis. "Published information indicates it is designed for high performance desktops and entry-level workstations and is 9 percent faster than its predecessor at 2.2GHz. The device has 8KB of Level 1 cache (data) and 512KB of Level 2 cache (advanced transfer cache), with a total of 55 million transistors."

According to Mr. York, "the device is manufactured in a full CMP, 130 nm process (60 nm gate lengths) with six levels of damascene copper (all copper) and one level of polysilicon. It uses STI (Shallow Trench Isolation) and twin wells in a P-epi on a P substrate. Cobalt silicide is employed on the polysilicon and diffusions (salicide process). Intel® indicates that the 60 nm transistors have a gate oxide thickness of approximately 15 Angstroms."

"What makes this chip particularly interesting is the use of Low-K dielectric material between the copper conductors. Additionally, put under a microscope, the device presents unique and innovative circuitry providing its creators a strong competitive advantage." said Mr. York.

Chipworks has documented these and related findings in a newly released structural analysis report designed to provide critical inside information of leading-edge semiconductor technology products and devices. View the report overview...

link

 

[Bozo Galora]

and jbond, you aint going nowhere with that ASUS board, its top FSB in bios is 150 and you need 158 for 3 GIG. At that with no "fix", your HDD is gonna be at 39PCI - unacceptable to me.
the new Iwill 850E goes up to 156.

 

[Bozo Galora]

The Real ASUS Badass board

Quote:
ASUS: the First Mainboard Maker to Support PC4200 RDRAM

Posted 5/22/02 at 9:16 am by Rat

As we learned from our reliable source in ASUS, the company is going to release a new mainboard supporting both: PC4200 and PC3200 RDRAM.

New Rambus memory types aka PC4200 and PC3200 RDRAM are based on wider 32bit data bus. The today?s RDRAM memory used in systems based on i850 and i850E chipsets features 16bit bus and provides 3.2GB/sec bandwidth.

The mere idea of enhancing the bus this way is very simple. Look. 32bit Rambus memory modules are dual-channel devices combining two 16bit modules in one package. And taking into account that contemporary chipsets supporting RDRAM use exactly two 16bit RDRAM channels, these memory modules will work with i850 and i850E without any additional changes in the chipset architecture. Here 32bit modules working at 400MHz belong to PC3200 RDRAM spec, while those working at 533MHz ? to PC4200 RDRAM spec. Now the names of 32bit modules are built the same way as those for DDR SDRAM, when the bandwidth is mentioned in the name of the memory type. ASUS decided to take advantage of this fact when they launched their Pentium 4 solution supporting 32bit RDRAM modules. This mainboard is equipped with two 232-pin RIMM slots for 32bit modules instead of the formerly used four 144-pin RIMM slots for 16bit modules.

ASUS will very soon start shipping this mainboard supporting 32bit PC4200 and PC3200 RDRAM modules and based on i850E/ICH2 chipset to its distributors. The solution will be called ASUS P4T533. Here is a picture of this product:

P4T533 will feature an AGP Pro slot, 6 PCI slots, an optional ATA/133 RAID controller from Promise, an optional network controller from Intel and a USB 2.0 controller from NEC. Also it boasts the entire set of overclocking friendly functions and Q-Fun technology.

Since there are no PC4200 and PC3200 RDRAM modules available in retail now, ASUS will supply its P4T533 with the corresponding memory modules by Kingston.
==========================

And 3810 with 32ns single channel rambus beats nucleus in SiSoft mem by 1400 points!

here

 

[Terrapin]

Since there are no PC4200 and PC3200 RDRAM modules available in retail now, ASUS will supply its P4T533 with the corresponding memory modules by Kingston.

What exactly does that mean?

Does it mean the boards will ship when the Kingston modules ship? which is what I think it means; or

Does it mean the boards will actually ship with the Modules included?

Terrapin

 

[Bozo Galora]

it means it will ship with the modules BUNDLED
and you can bet it will be an expensive package at that

Edit: And thats the P4T533 not the "C" or "E" or whatever

I'm thinking $650 for 2.53 cpu, ~ $200 for mobo, $250 for PC4200 or
about $1100 for the three.

 

[Bozo Galora]

well, heres some info direct from intel
link

Product Change Notification
# 102322-00
Information in this document is provided in connection with Intel® products. No license, express or
implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except
as provided in Intel?s Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel®
products including liability or warranties relating to fitness for a particular purpose, merchantability, or
infringement of any patent, copyright or other intellectual property right. Intel® products are not
intended for use in medical, life saving, or life sustaining applications. Intel may make changes to
specifications and product descriptions at any time, without notice.
Copyright © Intel Corporation 2002. Third-party brands and names are the property of their respective
owners.
Change Notification #: # 102322-00
Change Title: Intel® Pentium® 4 Processor with
512KB L2 Cache on .13 Micron
Process, Optical Shrink Conversion
Date of PCN Publication: April 25, 2002
Type of Change Notification:
FYI (for-your- information)
Key Characteristics of the Change:
Process
Forecasted Key Milestones:
Date Customer Must be Ready to Receive Post-Conversion
Material for 2.53 GHz:
May 31, 2002
Date of First Availability of Post-Conversion Material for the
2.53 GHz:
May 31, 2002
Date Customer Must be Ready to Receive Post-Conversion
Material for speeds 1.60-2.40B GHz:
July 22, 2002
Date of First Availability of Post-Conversion Material for speeds
1.60-2.40B GHz:
July 22, 2002
The date of "First Availability of Post-Conversion Material" is the projected date that a
customer may expect to receive the Post-Conversion Materials. This date is determined by
the projected depletion of inventory at the time of the PCN publication. The depletion of
inventory may be impacted by fluctuating supply and demand, therefore, although
customers should be prepared to receive the Post-Converted Materials on this date, Intel
will continue to ship and customers may continue to receive the pre-converted materials
until the inventory has been depleted.
Description of Change to the Customer:
Intel® Pentium® 4 Processor with 512KB L2 Cache on .13 Micron Process will undergo
the following changes:
· 5% Linear Shrink, 10% area shrink
· New S-Specs for affected line items
· Minor visible difference on the package due to reorientationof capacitor
placement
· Capacitor count, decoupling, and electrical characteristics remain unchanged.
· No functional flash specification changes
Reference Documents / Attachments:
Intel® Pentium® 4 Processor with 512KB
L2 Cache on .13 Micron Process
Marketing Presentation
Located in FDBL/IBL under ?Northwood
B-0 shrink conversion plan?
PCN Revision History:
Date of Revision: Revision Number: Reason:
00 Originally Published PCN

Please note that, for this optical shrink conversion:
· The CPU ID will remain the same
· There are no electrical, mechanical (except minor die size decrease), or
thermal specification changes
Please refer to the latest revision of the Intel(R) Pentium(R) 4 Processor with 512KB L2 Cache on .13 Micron
Process Electrical, Mechanical, and Thermal Specifications (EMTS), and Intel® Pentium® 4 Processor
Specification Update for the latest specification information.
Customer Impact of Change and Recommended Action:
Intel anticipates no impact to customers. There is no change to the functionality of the
product and
there are no specification changes. Qualification is not necessary and samples will not be
required.
Products Affected / Intel Ordering Codes:
Intel® Pentium® 4 Processor with 512KB L2 Cache on .13 Micron Process
Pre-Conversion Product Code
B -0 Non-shrink
Pre-Conversion
Production Units
Post-Conversion
Product Code
B-0 Shrink
Post-Conversion
Production Units
Product Code Frequency S-Spec MM# Product Code S-Spec MM#
RK80532PC041512 2A SL5YR 839247 RK80532PC041512 S L66R 844541
RK80532PC049512 2.20 SL5YS 839248 RK80532PC049512 S L66S 844542
RK80532PE051512 2.26 SL67Y 845185 RK80532PE051512 SL6D6 847365
RK80532PC056512 2.40 SL65R 843946 RK80532PC056512 S L66T 844543
RK80532PE056512 2.40B SL67Z 845186 RK80532PE056512 SL6D7 847366
RK80532PE061512 2.53 SL682 845187 RK80532PE061512 SL6D8 847367
Intel® Pentium® 4 Processor with 512KB L2 Cache on .13 Micron Process, Small Form
Factor (SFF)
Pre-Conversion Product Code
B -0 Non-shrink
Pre-Conversion
Production Units
Post-Conversion
Product Code
B-0 Shrink
Post-Conversion
Production Units
Product Code Frequency S-Spec MM# Product Code S-Spec MM#
RK80534PC025512 1.60 SL62S 841426 RK80534PC025512 SL6E3 847447
RK80534PC033512 1.80 SL62R 841428 RK80534PC033512 SL6E2 847446
RK80534PC041512 2 SL62Q 841429 RK80534PC041512 SL6DZ 847442

 

[Bozo Galora]

note that nucleus has the SL682ES (engineering sample) pre - optical shrink BO stepping.

now, from todays overclockers.com:

1) What Settings? It is unclear whether a high FSB/high memory combination provides any real benefit over a medium FSB/high memory combination on the PIV platform like it does on the Athlon platform.

High FSB and memory help the Athlon because the FSB becomes a bottleneck for memory, and increasing the bandwidth eases the bottleneck.

In theory, the total PIV platform bandwidth should not create a bottleneck for memory, but we have a few doubts about this, and plan to test at 166MHz to resolve them.

Running a PIV at 166MHz will not be for the casual overclocker this summer. The only candidates for this treatment are the 1.6A now, and the 2.26 a little later. While some are getting it done with the 1.6A, that chip will be shuffling off the stage shortly. We haven't even seen a 2.26 yet; it's on the edge. Our best guess is that the first ones won't generally do it, but those 2.26s made with the optical shrink will have a fighting chance (more on this later).

In any case, we don't know yet if 166MHz FSB is worth much of a struggle to those less inclined to struggle. By this time next week, we should know if it is, or whether medium FSB/high mem speed is just as good.

Unless Intel comes up with low-speed 133MHz FSB Northwoods for OEMs, we don't expect 166MHz PIV overclocking to become routine until the fall.

2) What Stepping? Right now, we have the B0 stepping for these chips.

Probably sometime in August, PIVs made after Intel's optical shrink conversion (the link includes future sspecs for these chips) will become available. Though Intel swears it didn't tweak these chips for performance, anecdotal evidence seems to indicate such chips do perform a little better.

Intel's own actions (and lack thereof) seems to indicate the same). The optical shrink is occurring first with the fastest processors almost right away, then the rest.

The Intel dog that hasn't barked (at least not yet) is any announcement of a new stepping for the Northwoods from the B0 stepping. Normally, they do this several months ahead of time to give developers time to test these new products. They haven't done it yet.

It's conceivable that when Intel introduces the 2.6 and 2.66GHz processors, these newbies will have a more advanced stepping. New stepping or not, they'll almost certainly be made using the optical shrink from the start.

If they don't have a new stepping, though, Intel is basically saying that they can put out CPUs that can do 2.66GHz at stock voltage without a new stepping. Unless they're just skimming off the cream of the CPU crop (which Intel has done in the past on rare occasion), no new stepping would be a silent admission by Intel that the shrink does help.

Moving a little further on, Intel expects to start selling a slightly over 3GHz PIV next January, maybe a bit sooner. I don't think this optical shrink will be enough to make that possible, so I expect to see a C stepping for the PIV to become available sometime in the fall. This should make 3GHz overclocking at least reasonable feasible and probably fairly easy.

3) Double DDRing? There seems to be little performance difference between the new Intel chipsets and the forthcoming Via P4X333. The Via may rack up slightly better numbers. SiS will have its equivalent in a couple months, pulling an answer from nether regions, it will probably do a few percentage points better yet.

If you're planning on medium FSB/high memory overclocking, the best of all possible worlds would be to have a 3:4 and a 4:5 ratio setting for that. That allows the most tweaking options for your equipment. If you have to choose, if you're less confident in your memory than your PCI components/hard drives overclocking, go 4:5. If it's the other way around, go 3:4. If you're inbetween, do some math with the ratios before you buy.

Probably in the fall, we'll start seeing dual DDR PIV boards, first from Via and SiS, later from Intel. To me, "What improvement will we see from it?" is the second biggest question left in 2002 (the first being "How will Hammer do?") "How much more will such a board cost?" will be another good question.

For those who have to make their money count (or just those planning to get a Christmas computer), these are the two questions you need answers to before you can wisely buy.

P.S. Intel actually has a dual DDR board out now for Xeon processors. There's a report out which I'm sure some RDRAM retards are and will be citing as "proof" that dual DDR stinks.

Actually, it does no such thing. All the evidence shows is that if you are using a multithreaded server process for a database, you're using hyperthreading, and you're servicing 25 or more clients , RDRAM does rather better. That's hardly the desktop environment, and it would be foolish to say "dual DDR is a dud, RDRAM rules" based solely on this single, specialized example.

 

[HardWareXpert]

Whats the big deal with the 3dmark score, I get 10,046 AthlonXP@1.6Ghz/145FSB, GF4 Ti4400 stock@275/550.