Feasibility of direct touch heatpipes and direct die cooling.

[chahahc]

Since ivy and haswell are deliddable, I was wondering if it would be feasible to use a direct touch heatpipe heatsink (like the h212 evo) and directly mount it onto a bare die with clu. The hyper 212 specifically because the heatpipes don't have the huge multiple gaps between them. I know there are still small grooves between the heatpipes but maybe it would be possible to lap them away or something? Maybe mounting the heatsink so that the heatpipes are orientated perpendicular to the long ivy/haswell die would make it so that all 4 pipes are able to directly contact the die? Has anyone even done this?

My reason being that since direct contact heatpipes are more efficient at absorbing heat, maybe this would work well with haswells/ivys concentrated thermal output. More of a how fast can you wick the heat away from a certain spot then how much heat can you dissipate in general... idk...just floating round ideas here. Also I'm not to keen on watercooling and the idea of mounting a killogram heatsink on a bare cpu doesn't inspire the most confidence, especially since I live around 20 miles from the san andreas fault...D:

 

[dma0991]

Mounting it perpendicularly would get the best results but direct die mounting means that you can't apply pressure to get the best contact and run into a risk of cracking the die if you aren't meticulous in regulating the mounting pressure on all four corners.

I know that direct die mounting has been done before with great results but I'd rather get the protection that the IHS provides, higher applicable mounting pressure, no fiddling with the socket mount, height adjustment and the almost similar improvement of thermal conductivity with TIM of your choice under the IHS.

 

[andg]

Didn't all processors have bare die cooler mounting back in the day? I really don't remember bare die as being a problem.

 

[dma0991]

Didn't all processors have bare die cooler mounting back in the day? I really don't remember bare die as being a problem.

That's because the heatsinks back then were made with consideration that its on a bare die. They had stock brackets which helps keep the pressure similar to a stock heatsink. Now, the stock brackets are gone and left with aftermarket brackets that gives it more rigidity to clamp down harder. Modern coolers like Prolimatech Megahalems emphasizes on mounting pressure to gain better contact and improve cooling performance.

Also, since the CPU themselves were not factory made to be used bare die, the socket has the same characteristics. Going bare die on a LGA1155/LGA1150 socket means removing the socket entirely as the height of the die is lower than the socket clamping mechanism. As the socket relied on the IHS itself to clamp down, the gap difference means that the CPU never makes good contact with the socket.