Yeah. I'll be the first to call shens on this. I know this isn't true, but i'll go ahead and ask: link a citation with to a specific intel document with a specific intel passage outlining such - specifically pertaining to the IVB or Haswell. I want a link to an intel document at intel.com, and I know you won't find it. By the way, do you even realize the issue at hand is the GAP between the IHS and die? The TIM used on IVB and Haswell is -extremely- high quality. They could not have used better quality TIM. But, the gap is there and that is what causes higher temperatures with over-voltage. Aside from this, the nonsense about how intel has engineering meetings to conspire of ways to screw overclockers is getting old and tiring. This is not how engineering problems are solved.
But, I suppose some take more comfort in complaining about desktop doom and gloom - and how intel is trying to screw us all. *Yawn*
Im not a fanboy of any manufacturer, so I dont get emotionally involved.
I have linked multiple white papers for intel solder in realtemp thread on xtreme, feel free to read them, and no they dont mention ivy or haswell regarding solder costs, but I didnt say they mentioned them regarding costs, you said that so maybe you should look for them...I just stated solder is higher cost in materials and manufacturing in general. You can also look at cost for die attach, ihs interface of solder vs other from those that manufacture.
Also, if I were intel, I would use paste on haswell, ivy as well, since 99.9% users are stock, and stock specs dont warrant solder, hence dont warrant cost. So I dont blame intel at all. Cost vs need is not bashing intel...just a fact of companies for profit.
While I would like intel to use solder for overclocking cpus, it just unlikely to happen, unless stock specs warrant it.
As for gap, solder at 87 w/mk is going to have lower thermal gradient through that gap, than intels paste, since best pastes measured are 5-8w/mk, ie 10x lower.
But then again, I didnt state their paste was bad....again you supplied that argument, then refuted.
Also, I didnt mention intel was trying to screw anyone...again that was you.
But since you can supply arguments, and refute them all by yourself, I will leave you to yourself.
Intel indium supplies intel solder, if you want costs go here, compare solder vs other die attach. You can also get a quote for large batches if you dont like high prices on smaller ones. If you want proof of obvious cost differences between solder and tim interface, email them. But my guess is you dont really want to know.
http://buy.solder.com/
here is one of white papers I linked, good read if you can find it, whenever linking intel technical journals, they usually get removed quickly thereafter, but quoted a portion of it here, page 4:
http://www.xtremesystems.org/forums...M-Inside-Integrated-Heatspreader-Report/page4
http://download.intel.com/technolog...ials_Technology_for_Environmentally_Green.pdf (this is the 2008 journal article from intel, link no longer works, since I put this up a while back).
quote from technical journal regarding solder tim development, I believe this is same article that describes cost, etc...cant be sure unless can find it up somewhere, old link is dead.
Intel introduced polymer thermal interface
materials (PTIM) initially with 3-4 W/moK bulk thermal
conductivity and then successfully transitioned to Pb-free
solder-based thermal interface material to meet the ever
increasing demand for thermal cooling capability as
shown in Figure 16 [5].
Figure 16: Improvement in thermal cooling capability
with TIM materials (Polymer vs. Solder)
The introduction of Pb-free solder-based TIM materials
posed significant integration challenges. The STIM
needed to relieve the mechanical stress caused by CTE
mismatch of the integrated heat spreader lid and the
silicon die and to minimize stress transfer to the silicon
die during thermal cycling [6]. The thermal conductivity
and the mechanical compliance requirements resulted in
the development and qualification of low melting
temperatures (157oC Tm), low mechanical yield strength
(4-6 MPa), and relatively high thermal conductivity (~87
W/moK) pure Indium (In) metal for STIM applications. In
order to use In for STIM applications, appropriate
But if your arguing there is no difference between intels paste tim (quoted in 2008 per intel at 3-4 w/mk in above linked intel tech journal) and solder 87w/mk filling the gap between die and ihs...then read below:
quote from slide 15 below:
At 100 W/cm2 heat dissipation in the die, the maximum junction temperature (TJ,max) decreases by 16°C when TIM resistance decreases from 100 to 8 mm2K/W
http://www1.eere.energy.gov/vehicle...anced_power_electronics/ape_10_narumanchi.pdf