The differences are rather stark, and specific. One gives you lower performance but higher density, the other gives you higher performance but lower density. Literally everyone who does this for a living in the industry understands the basic tradeoff that goes into the decision table.
The only folks who seemed to not understand that AMD was not going to have its cake and be able to eat it too was the PR machine that spit out all those nice GloFo pdf files touting gate-first superiority.
I know and i perfectly understand the general differences between those two processes. But you clearly cannot take Llano or Bulldozer and compare them to SandyBridge because the architectures are different.
We cannot even compare Llano and Bulldozer although they both are manufactured with the same 32nm process.
Whether you look at Llano's or Bulldozer's performance/watt, either chip paints the same story, as expected, when comparing to GloFo's non-HKMG 45nm or Intel's HKMG 32nm - it delivered on areal density entitlement and not much else.
It reduces production costs but does not enable higher ASP because it does not enable higher performance. And AMD's numbers prove this out, to the surprise of no one.
Although Llano is a Deneb derivative design we really dont know what type of transistors they used for the CPU cores. Did they used bigger but faster transistors or smaller for greater density ?? Remember that Llano is an APU with a large iGPU, they may needed to keep the die as small as possible and they may sacrificed CPU performance in order to make the die smaller. Does the Llano CPU core architecture allows it to operate in higher frequencies or was it designed for up to 3-3.5GHz.
On the other hand Bulldozer was designed for higher operational frequencies and if you compare it to 6 Core Deneb you will see that AMD was able to double the Cache, put extra logic and at the end they managed to have the same Performance per watt.
Now, PileDriver (32nm SOI HKMG Gate First) will have 15% more performance per watt than Bulldozer and that means better performance per watt than Deneb (45nm SOI Gate Last).
So it seams that GloFos 32nm SOI HKMG Gate First gave them both area density AND lower power usage. You see what i did here, i used the same logic you and others have and came to a conclusion that GloFos 32nm gave them both. But because Bulldozer and PileDriver are different microarchitectures than Deneb, we cant be 100% sure if the better performance per watt came from the microarchitectural design or it came from the manufacturing process. I believe both contributed.
If we had 6 Core Deneb manufactured at GloFos 32nm process then we would be able to see how much area density and power usage they gained from 45nm.
ASPs will go higher, starting with Trinity. A10 APUs will go against the Core i5 in the Mobile.
If you fundamentally understand the cause then you can project the effects in a relatively straightforward fashion. This is the difference between guessing, and being surprised when your guess is wrong, versus making an educated estimate. It is the difference between the doctor who can tell you the difference between one type of cough and another versus your mom who says everything will be better if you eat chicken soup.
Sometimes mom is right, other times you have cancer and that cough just isn't going to get better with a little soup, and the doctor is probably the one you want to be seeking an educated opinion from.
Because my mother is a doctor (Pneumonologist : doctor specializing in lung care) I can tell you that she would need a lot of exams (Blood exams, x-rays etc) to diagnose a cancer. She will not be able to tell you only by hearing you cough if you have a Cancer or a cold.
Same with Litho process, we need to know all the technical specs to say with certainty if 32nm only gave them higher density and not performance or lower power usage.