News IBM suing GlobalFoundries

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NTMBK

Lifer
Nov 14, 2011
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One-time AMD fab limb, GlobalFoundries, is laying the litigation down on IBM to escape the $2.5 billion damages Big Blue is trying to squeeze out of it just ahead of its initial public offering (IPO). That, it states, is the prime driver behind IBM's recent demands with the company only looking for "a quick payday."

I can see IBM's side of this. They bet on GlobalFloundering for their next generation products, paid them a huge chunk of money... and then GloFo gave up on leading edge. I'd be pissed too.
 

NostaSeronx

Diamond Member
Sep 18, 2011
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Not before the deal they didn't. Power8 was built on IBM's 22nm SOI process.
Also, an extension to this.

POWER9 was built on IBM's "14SOI" node.

IBM handed off the completed/ready-for-production 14SOI node to GlobalFoundries in 2015.
While GlobalFoundries later got those nodes. Those nodes were already finished and ready for designs at IBM.
32HP (I guess that was POWER7+?)

While that is true, it doesn't invalidate my statement.
It however glosses over that P8/P9's nodes were not developed internally at GlobalFoundries. Rather they got completed versions when the transfer from IBM to GloFo was completed in 2015.

AMD/GloFo was part of the development of ISDA 45SOI/32SOI nodes. So, GlobalFoundries 32SHP node is actually internally developed. GlobalFoundries actually left that alliance later on. So, 22SOI = no equivalent development at GF, 14SOI = no equivalent development at GF.

No GlobalFoundries in 2014.

Also, while looking they are still doing research on 7LP and beyond.
"Hybrid low-k spacer scheme for advanced FinFET technology parasitic capacitance reduction"
===
Hybrid low-k spacer scheme: A fully integrated 7 nm bulk FinFET CMOS platform featuring 30 nm Fin pitch and 56 nm contacted gate pitch was used to develop the hybrid low-k spacer scheme -- That is 7LP IEDM in 2017.

Overall, the hybrid spacer scheme demonstrated significant advantages over the traditional method to enable SiOCN (k = 4.5) spacer on the 7 nm FinFET technology platform by reducing the defects associated with the spacer damage.
==> Submitted: 12 December 2019 // which is definitely post-pivot.

So, it is still there at Malta since it was used to produce a research paper. With this picture:


Still it must not be a device performance thing, as indicated by everywhere. It has to be no customer thing since:
Implies there would have been designs wins. Since, most HPC customers start at 0.5V at that period. If there was no designs wins even with the 0.5V PDK out for 1+ year. Then, it definitely indicates IBM was not going to fabricate at all at GlobalFoundries.

If GlobalFoundries had for sure any amount of customers, we would have seen Mubadala dumping cash like they did for 20LPM/14XM.

Off-topic but related to EUV portion of 7LP+/5LP/3LP.
There is also one benefit of ditching EUV insertion as early as they had planned. That is the rise of J-FIL:
NZ2C 2H'20 = ~100 wph w/ 0.2 defects per cm squared
NZ2C 1H'21 = ~110 wph w/ 0.07 defects per cm squared
 
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beginner99

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Jun 2, 2009
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If GlobalFoundries had for sure any amount of customers, we would have seen Mubadala dumping cash like they did for 20LPM/14XM.

Honestly I still suspect AMD had the balls to just go for TSMC regardless of WSA exactly with the reasoning that GF in that case would have to cancel 7nm and hence freeing AMD from the WSA for 7nm.
 

NostaSeronx

Diamond Member
Sep 18, 2011
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Honestly I still suspect AMD had the balls to just go for TSMC regardless of WSA exactly with the reasoning that GF in that case would have to cancel 7nm and hence freeing AMD from the WSA for 7nm.
I think overall it deals with AMD had TSMC as first-source and IBM had Samsung as first-source from the get-go.

7LP and 7LP+ are both largely different from 7FF and 7LPP.

Most likely if GlobalFoundries wanted to win such designs they would have to do what they did for Jaguar -> Puma.

Support a transfer of TSMC28HP -> GF28A w/ minimal mask changes:
Kabini/Temash -> Bhavani/Mullins/Beema/Carrizo-L

However on a scale of 7LP and 7LP+. To support each version would probably be costly. While GlobalFoundries expected to be first-source/only-source to maximize design choices they made.

Overall, however it seems AMD/IBM just didn't want to be on GlobalFoundries at all. GlobalFoundries simply made too many mistakes and basically tripped on a spike. Which doomed every leading edge investment after it.



Scalable for the future till it runs out of money.

Meanwhile TSMC is here with 150k wpm with three modules...


Samsung's capacity is much higher with less constraints on investment of capacity. Hence, S3 & V1 both are doing 7LPP, which is more than GlobalFoundries minuscule capacity.

"They would need another $3B to get to 12 Kwpm capacity" - Breakfastbytes-Cadence.

A customer would have to be ultra confident willing to live and die with GlobalFoundries. While, they fiscally bled out all over the place.

TSMC 150k wpm target.
Samsung 150k wpm target.
GlobalFoundries "okay everyone, give us $3B-$4B so we can get 12k-15k wpm. Then, if you want more we will talk about 50k-60k wpm with a second module for >$10B."
 
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DisEnchantment

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I think overall it deals with AMD had TSMC as first-source and IBM had Samsung as first-source from the get-go.

7LP and 7LP+ are both largely different from 7FF and 7LPP.

Most likely if GlobalFoundries wanted to win such designs they would have to do what they did for Jaguar -> Puma.

Support a transfer of TSMC28HP -> GF28A w/ minimal mask changes:
Kabini/Temash -> Bhavani/Mullins/Beema/Carrizo-L

However on a scale of 7LP and 7LP+. To support each version would probably be costly. While GlobalFoundries expected to be first-source/only-source to maximize design choices they made.

Overall, however it seems AMD/IBM just didn't want to be on GlobalFoundries at all. GlobalFoundries simply made too many mistakes and basically tripped on a spike. Which doomed every leading edge investment after it.


View attachment 45666
Scalable for the future till it runs out of money.

Meanwhile TSMC is here with 150k wpm with three modules...
View attachment 45667

Samsung's capacity is much higher with less constraints on investment of capacity. Hence, S3 & V1 both are doing 7LPP, which is more than GlobalFoundries minuscule capacity.

"They would need another $3B to get to 12 Kwpm capacity" - Breakfastbytes-Cadence.

A customer would have to be ultra confident willing to live and die with GlobalFoundries. While, they fiscally bled out all over the place.

TSMC 150k wpm target.
Samsung 150k wpm target.
GlobalFoundries "okay everyone, give us $3B-$4B so we can get 12k-15k wpm. Then, if you want more we will talk about 50k-60k wpm with a second module for >$10B."
The day the control was in the hands of the experts from Wadiya it was over.
Their process advances got aladeen-ed.
 

NostaSeronx

Diamond Member
Sep 18, 2011
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The day the control was in the hands of the experts from Wadiya it was over.
Their process advances got aladeen-ed.
I think it is the opposite. Management was to US-centric. When the market for GlobalFoundries was outside of the US.

1. They should have synced nodes internally and not synced nodes with competitors.
2. Fab7 should have never been allocated to mainstream only. Instead, should have been leading edge.
3. They shouldn't have split the fabs to different generations. Especially, with the 2011 5-year estimation that they could have increased leading edge revenue by 5x.

The only fab sync
Fab 1 & Fab 8 for 32SOI/28BLK.

It should have been
Fab 1, Fab 7, Fab 8 for 32nm SOI/BLK, 28nm BLK.

I don't think GlobalFoundries will ever be successful in leading edge if it is only one fab doing leading edge.

Currently, no one can get 22FDX from a United States source, nor can anyone get 22FDX from an Asian source.


I just don't see how anyone could see this. Then, be like well Singapore shouldn't be doing 22FDX or Malta shouldn't be doing 22FDX. The Chengdu option was an okay consideration, but it fails when Singapore is considered a cheaper/lower risk option.

Missouri GlobalWafers SOI to Malta = 22FDX US-source feasibility increased
Pasir Ris SOITEC to Singapore = 22FDX Asia-source feasibility increased

This also spreads to RFSOI/Photonics-on-SOI/etc.

I see whatever customer is on GlobalFoundries 14LPP/12LP/12LP+ ditching for Intel's IFS/IDM 2.0.

"IBM and Intel's plans to collaborate on critical, leading-edge research to advance logic and packaging technology development is an important milestone. By bringing together two of the best semiconductor research organizations, we will greatly accelerate innovations in the semiconductor industry and push the frontiers of technology for the benefit of clients and the world."
Friendship ended with GlobalFoundries. Now Intel is my best friend. (US supply of leading-edge semi for IBM)

~~~~
The general plan for GlobalFoundries is to split manufacturing capacity across the three fabs.
14LPP @ Fab8 => ~66,000 wpm
22FDX @ Fab1 => ~75,-90,000 wpm
--
If region usage is equal. 1/3 @ Americas, 1/3 @ EMEAs, 1/3 @ Asias
Fab 1/Fab 7/Fab 8 split means:
14LPP @ Fab1/Fab7/Fab8 = ~22,000 wpm per fab complex.
22FDX @ Fab1/Fab7/Fab8 = ~25,-30,000 wpm per fab complex
--
Fab 1 ~110K wpm, Fab 7 ~120K wpm, Fab 8 ~90k wpm
14LPP can be translated to 12FDX => 3x~22k wpm
22FDX => 3x~27,5k wpm per fab complex
28/32 => 3x~15k
40/45 => 3x~15k => Malta's prior reported capacity reached
55/65 => 3x~15k => ~94.5kwpm
80/90 => 3x~15k => ~109.5kwpm (Dresden's reported capacity reached)
110/130 => 3x~10k => 119.5kwpm. (Singapore's reported capacity reached)
--
Fab 1 can get one more module.
Fab 8 can get two more modules.
Fab 7 has rumored plans to build two modules/one complex.
So, even if the demand isn't the above per region they could fit more or less capacity for high demand or low demand nodes. Or, if they are crazy they can subsidize "Optimized layout migration" so 22nm FDSOI gets 28/32+40/45 designs and 45nm FDSOI gets 55/65+80/90+110/130 designs. Which is basically an advanced retapeout option to get a prior node chip to a FDSOI node chip. Which minimize the mature logic nodes they need to support.
 
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scannall

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Jan 1, 2012
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There are things we don't know about the situation as well. One possibility was when was the earliest they could actually receive EUV machines. If their spot in line was 3 years away, it wouldn't do them, AMD or IBM any good.
 

NostaSeronx

Diamond Member
Sep 18, 2011
3,705
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There are things we don't know about the situation as well. One possibility was when was the earliest they could actually receive EUV machines. If their spot in line was 3 years away, it wouldn't do them, AMD or IBM any good.
GlobalFoundries already received their EUV insertion tools. => "two massive ASML NXE:3400B tools to support the company’s future production (GF has cleared space for four machines in total)."

Which is the same machines TSMC use for their N7+ process(wikichip source) and Samsung use for their 7LPP process(anandtech).

It isn't so much the spot in the line for GlobalFoundries with EUV tools. Rather they only have one module worth of space for EUV tools.

Fab 8.1, Module 2 | Takes time to build and with money which GloFo didn't have. Rather investing on their own, GlobalFoundries is relying on potential funds from the CHIPS Act. To fund development for that fab module.

So, the fab option for GlobalFoundries increasing capacity of EUV would have taken enough time to finish. So, that ASML could even out EUV tool production before GlobalFoundries completes the new fab module for EUV nodes (7LP+/5LP/3LP).

I personally hope, they don't get funding where they will inevitable do the meme "We like to (re-)introduce ourselves [7LP+/5LP/3LP]"...
 
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RTX

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Nov 5, 2020
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GlobalFoundries already received their EUV insertion tools. => "two massive ASML NXE:3400B tools to support the company’s future production (GF has cleared space for four machines in total)."

Which is the same machines TSMC use for their N7+ process(wikichip source) and Samsung use for their 7LPP process(anandtech).

It isn't so much the spot in the line for GlobalFoundries with EUV tools. Rather they only have one module worth of space for EUV tools.

Fab 8.1, Module 2 | Takes time to build and with money which GloFo didn't have. Rather investing on their own, GlobalFoundries is relying on potential funds from the CHIPS Act. To fund development for that fab module.

So, the fab option for GlobalFoundries increasing capacity of EUV would have taken enough time to finish. So, that ASML could even out EUV tool production before GlobalFoundries completes the new fab module for EUV nodes (7LP+/5LP/3LP).
So there's still a possibility of them doing R&D on lower finfets provided the money came from the government?
 

NostaSeronx

Diamond Member
Sep 18, 2011
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So there's still a possibility of them doing R&D on lower finfets provided the money came from the government?
They have a possibility of restarting 7LP -> 7LP+ -> 5LP -> 3LP production if they get funded. If US&SGs gives significant money to GlobalFoundries, it normally gets duplicated by Mubadala(in prior setups).

However, the success of those nodes at GlobalFoundries are a pipe dream. Intel/TSMC/Samsung West USA leading edge foundries will have more capacity and maturity within the same time.

GlobalFoundries' FinFETs are not actually critical for government applications either. Sure, they use it but only for at surface applications. The real critical nodes are 45RFe/45SPCLO (45nm FDSOI), 22FDX (22nm FDSOI), 12FDX (12nm FDSOI).

14LPP/12LP is used now, but I think if Malta had 12FDX, then DMEA would opt for it instead. Especially, since DITO allows a positive bias or a negative bias on the same device. Allowing the sapping of stuck positive or negative electrons within the device area. Which is critical for non-RHBD lib leading edge nodes beyond surface applications.
 
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DrMrLordX

Lifer
Apr 27, 2000
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There are things we don't know about the situation as well. One possibility was when was the earliest they could actually receive EUV machines. If their spot in line was 3 years away, it wouldn't do them, AMD or IBM any good.

Was GF even going to use EUV for their 7nm node?
 

NostaSeronx

Diamond Member
Sep 18, 2011
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Was GF even going to use EUV for their 7nm node?
It was built for both.
7LP is DUV => "This 7nm technology is fully enabled by immersion lithography and advanced optical patterning techniques (like SAQP and SADP)."
7LP+ is EUV => "However, the technology platform is also designed to leverage EUV insertion for specific multi-patterned (MP) levels for cycle time benefit and manufacturing efficiency. ... This strategic EUV insertion lowers the overall mask count of critical layers by ~25%. No design update is required to take advantage of this EUV insertion."
From "A 7nm CMOS technology platform for mobile and high performance compute application"

7LP DUV [Gen1 with DUV] => Start 2H18
7LP EUV [Gen1 with EUV] => Start 2H19 || SAQP/SADP Crush : Same end print just with EUV.
7LP EUV [Gen2 with EUV] => Start 2H20 || Performance, Power, Area improvements (equivalent: 14LPP -> 12LP -> 12LP+, 28SHP -> 28A - -> 22FDX -> 22FDX+, etc.)

However the capacity of 2019 to 2021 = 12,000 wpm for $3B or 15,000 wpm for $4B.

So, at best they were effectively back to AMD-scale foundries:
April 04, 2006: "AMD is now manufacturing Athlon 64 and Sempron microprocessors at the new Fab 36 using a 90-nanometer production process. AMD will increase production at the plant to about 13,000 wafers a month later this year, and to 20,000 wafers a month in 2007, said Tom Sonderman, director of automated precision manufacturing technology for AMD." and the cost of that was "AMD is investing about $2.5 billion in the Fab 36."
 
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Abwx

Lifer
Apr 2, 2011
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I wonder what the actual timeline was. In October 2014 IBM gave GloFo its fabs including its staff and even paid $1.5 billion on top as well as access to IP. Only in 2018, close to when 7nm was supposed to be launched, GloFo notified both AMD and IBM that it would no longer pursue 7nm at all.

If you look at the timeline it is obvious that GF banked on AMD s Zen sales ( Zen was released in march 2017) to take off and get the necessary cash to get 7nm ready, but as everyone noticed sales were unexpectedly low and in march 2018 GF needed 2-4 billions to complete the process industrialisation.

Since Zen didnt seems to sell enough they decided to stop 7nm industrialisation.

In the meantime IBM didnt order anything at 14nm from GF, hence how could they jeopardize their dwidling financial position without any additional revenue from manufacturing IBM products ?.

Retrospectively that was a bad decision since later iterations of Zen did sell well, but it s easy to guess the race winner after the horses passed the finish line, and at the time they were quite close of bankruptcy.
 

NostaSeronx

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Sep 18, 2011
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In the meantime IBM didnt order anything at 14nm from GF, hence how could they jeopardize their dwidling financial position without any additional revenue from manufacturing IBM products ?.
GloFo converted IBM's East Fishkill to RF nodes. Then, transferred the SOI nodes to Malta which was done in 2017.

POWER9-SO Nimbus -> December 2017
POWER9-SU Cumulus -> August 2018
POWER9-Prime Axone -> August 2019

However, IBM isn't extremely high volume.

AMD's demand for chips should be 7.5x that of IBM.
~15,000 14nm Bulk wafers for AMD
~2,000 14nm SOI-FinFET wafers for IBM

17,000 wafers per month at most being sold to AMD/IBM during the Zen/P9 era.

Pre-2018 capacity was ~3x kwpm, while Post-2018 capacity was >5x kwpm. However, I don't think there was any customer need for that capacity.

Hence, why 22FDX revenues surpassed 14LPP revenues.

//For 7LP/7LP+/5LP/3LP to have a chance of success, Fab8 needs to look like this:
 
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moinmoin

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If you look at the timeline it is obvious that GF banked on AMD s Zen sales ( Zen was released in march 2017) to take off and get the necessary cash to get 7nm ready, but as everyone noticed sales were unexpectedly low and in march 2018 GF needed 2-4 billions to complete the process industrialisation.
I'm not sure about that. AMD is very conservative with its financial forecasts, by now notoriously so. AMD planned to have a steady growth of 20-30% per year. Unless AMD changed its plans to that at some point before Zen's launch I can't see how GloFo would expect significantly higher sales than AMD itself, and even in that case GloFo would have to have known better at an earlier point than 2018.
 
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Abwx

Lifer
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GloFo converted IBM's East Fishkill to RF nodes. Then, transferred the SOI nodes to Malta which was done in 2017.

SOI process was always made in their Dresden plant...


But how much money did this provide.?.
likely very merginal revenues.

I'm not sure about that. AMD is very conservative with its financial forecasts, by now notoriously so. AMD planned to have a steady growth of 20-30% per year. Unless AMD changed its plans to that at some point before Zen's launch I can't see how GloFo would expect significantly higher sales than AMD itself, and even in that case GloFo would have to have known better at an earlier point than 2018.

AMD didnt change their plans but one has to admit that they didnt get as much revenue as expected during 2017, and as said it would have required 2-4bn to get 7nm fully industrialised, to compare to AMD s sales in 2017 wich were 5bn at most.
Unless AMD renegociated the WSA agreement in a favourable direction to GF there was no chance for the latter to take such a risk, and as you pointed it since AMD were conservative in their forecasts they didnt take the risk to sign for more waffers.
 

NostaSeronx

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SOI process was always made in their Dresden plant...
Malta did SOI for a time.
However, I believe the above was dropped within the year after the press release. Hence, why there was no 32nm Oban motherboard, only Corona and Winchester. Not 100% sure but Winchester replaced Oban: https://www.xenonwiki.com/Winchester

Then, on the front of 14HP SOI FinFET front:
"What is notable here is 14HP has been moved out of East Fishkill into the Malta fab and East Fishkill is now focused on 300mm RF SOI and Silicon Photonics."
They then sold off East Fishkill and transferred RFSOI and Silicon Photonics to Malta. Then, developed 45RFe/45SPCLO which are FDSOI versions of 45RF/45CLO.
 
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moinmoin

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AMD didnt change their plans but one has to admit that they didnt get as much revenue as expected during 2017, and as said it would have required 2-4bn to get 7nm fully industrialised, to compare to AMD s sales in 2017 wich were 5bn at most.
Unless AMD renegociated the WSA agreement in a favourable direction to GF there was no chance for the latter to take such a risk, and as you pointed it since AMD were conservative in their forecasts they didnt take the risk to sign for more waffers.
Before Zen in the public eye AMD was walking the fine line of bankruptcy (and stock below $2 in Feb. 2016), and regarding that no kind of WSA would have given more security. If GloFo really planned for more sales back then even before Zen launched it must have seemed like a pipe dream to everybody.
 
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turtile

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I'm not sure about that. AMD is very conservative with its financial forecasts, by now notoriously so. AMD planned to have a steady growth of 20-30% per year. Unless AMD changed its plans to that at some point before Zen's launch I can't see how GloFo would expect significantly higher sales than AMD itself, and even in that case GloFo would have to have known better at an earlier point than 2018.

GF first announced that they could not make enough 7nm CPUs for AMD before they canceled 7nm. It seems they did not build out enough in time and because of that, could not justify the loss for the investment.
 

moinmoin

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GF first announced that they could not make enough 7nm CPUs for AMD before they canceled 7nm. It seems they did not build out enough in time and because of that, could not justify the loss for the investment.
That would make sense. But it's also the opposite of what has been stated before, GloFo supposedly citing lacking sales for not wanting to pursue 7nm. Can't be both at once, can it? When it announced the "strategy shift" GloFo mentioned none of these two reasons, though both a valid ways to save money of which GloFo was bleeding a lot before.
 
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