http://www.chipworks.com/news/2006_65nmLackBalls.asp
I found it interesting.
"Copper Pillar Bumping in flip-chip assembly offers higher connection density, better electrical and heat-dissipating performance, greater mechanical strength and potentially increased reliability."
Wonder what this means for overclocking?
I found it interesting.
"Copper Pillar Bumping in flip-chip assembly offers higher connection density, better electrical and heat-dissipating performance, greater mechanical strength and potentially increased reliability."
Wonder what this means for overclocking?