Haswell 4+2 at 22nm process is 170mm2
Skylake 4+2 at 14nm process is 122mm2
....
So at the end we are looking at 100-110mm2 for a 8+2 Cannonlake.
That's still pretty small, even if the cost per mm² goes up fitting 8-cores, PCH and an improved GT2 iGPU in smaller die than 4C+GT2 Skylake would be quite a feat.
Well, i dont believe Intel will bring something like that to the client market, especially not in Laptop space.
Im expecting Intel to double the iGPU with Cannonlake, especially for the mobile market.
So they will devote more and more die space for larger iGPUs, like they do 4-5 years now with every new process. Cannonlake will be their first real SoC specifically oriented for the Mobile market. You dont need 8 cores for the mobile but you need a faster iGPU.
They could very well have a native 4-core and a native 8-core die, just like they have 4-core and 2-core options right now.
Skylake-H already operates at high clocks, there's unlocked K chips and energy-efficient options starting at 25W TDP. Two years from now they might be able to offer quad-cores at U series TDPs and at least some 6C/12T 'H' models. It's the next step and the last thing they want is Apple and the ARM crowd closing the gap at lower TDPs.