Well, Comet Lake U 6+2 is here. And oh look, Amber Lake Y 4+2 finally turned up, but Intel wants us to call it Comet Lake Y now.
I guess this partly explains why AML-Y 2+2 was such an odd duck. It would appear that Amber Lake was supposed to be the 7W Y version of the 14nm WHL-U 4+2 die paired with the 22nm SPT-LP PCH in an FCBGA1377 package. For whatever reason (e.g. 14nm capacity constraints, difficulty binning 7W 4+2 parts, packaging issues, trying to clear out existing inventory) Intel simply released a KBL-Y 2+2 refresh with higher TDP and clocks. Now we get the real AML-Y 4+2 (including SIPP SKUs) on the SIPP release schedule, but Intel is calling it Comet Lake Y. Except CML-Y was already on the roadmaps, and ostensibly it was a similar 4+2 die and BGA1377 package but with a 14nm 400 series CMP-LP PCH. It seems like that's unlikely to see the light of day now, so this version of Comet Lake Y will just have to hang in there with nothing better than 5 Gbps USB 3.0 through most of 2020. <shakes head>
Meanwhile, Comet Lake U appears to be coming through with LPDDR4X support out of the gate, which is a pleasant surprise indeed. Also, I was expecting the base TDP to get bumped to 25W for the 6C, so kudos to Intel for even claiming 15W. Although I'm guessing we should probably expect a lot of 10th Gen 15W U-Series processors, both ICL and CML, to ship in 25W cTDP-up mode.