Hulk
Diamond Member
- Oct 9, 1999
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My understanding is that Zen3 and even Zen3D should still be cheaper to manufacture than a large monolithic die such as ADL-S when looking at the flagship SKUs, alas production volume vs. demand will complicate the equation quite a bit.
I don't have much insight into this and would love to know more? At the top of the stack I assume the two AMD chiplets are smaller in total area than the 8+8 ADL die? Also when there is a defect in ADL you could lose the whole die, which is less of a loss than one chiplet. But then it seems as though there might be more assembly time/cost in the chiplet approach? I know, I'm jumping the gun here but I'm curious about the economics of these approaches specifically in the case of 7nm 5950X vs 10nm 12900K production?