You're a very generous person.I am familiar w/ EMIB and it looks promising.
They claim it is cheaper than the industry standard 2.5D interposer methodology and they claim that it affords them far more flexibility with respect to connecting different process nodes on the same chip. Lots of claims about cost reductions/etc. ...............................................................................................
For advanced topologies and connecting to non-adjacent chiplets, it seems to be a horrible solution.
In & out, in & out, in & out. In other words.