Just FYI, since there are cringe-worthy conspiracy theories about TIM vs solder being perpetuated, it is most certainly not a cost issue. There really is not a difference between the two worth even noting. Additionally, it is not the historic norm to use TIM on mainstream processors - as many prior mainstream processors did not. However, the difference with the IVB is that it is a small and fragile part, and using solder on that type of process can potentially cause significant mechanical stress. The Haswell is even more delicate in this respect due to the integrated VR being on die - Being able to guarantee quality without issues from mechanical stress far outweigh the needs of extreme overclockers to intel, as people expect quality, stability, and longevity - especially their OEMs which sell processors/PCs in bulk.
the only cringe-worthy theory I have heard is that ivb is small and fragile and cant handle solder.
there are solder die attaches for much smaller dies than ivy/haswell.
And not a thermal difference between 150 microns of 5 w/mk paste and intel indium solder at 87 w/mk......um ok.
Funny about cost, in several intel white papers which I linked 4-5 years ago in realtemp thread on xtreme when drilling holes through IHS with thermocouples....intel seemed to think solder was more expensive, cost wise and yields because of solder failures.....but thinks for clearing intels misconceptions up.
intel in white papers specifically stated they developed and used more costly solder only to meet thermal specs under worst testing conditions of high tdp/power density cpus. IVY and haswell simply dont warrant the more costly stim, as they operated well within spec at stock...and even modest oc.
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