N3B is dense than N3E by approx 5%(N3P gains the density back from N3B except for Sram) so that would mean around 61mm2 and it is 54.7 mm2 around 11% shrink on a samish node while improving PPA is good and as you said architectural improvements are unknown
Yeah their margin is the only issue cause as a product it is Good
When you in Intel's financial position, margin is the most important factor.
Intel is bleeding money like crazy and for arc to be viable in the long run, they need to make money.
Without good finances, this product cannot generate the financials to keep the driver team going and support going.
People thinking Intel is making money on this thing are delusional.
Polaris was a lower margin product and was priced at 239 dollars. But it could make money because the costs were much lower at the time.
Battlemage die is larger than polaris and using 5nm technology. Polaris was manufactured with 14nm samsung technology which was probably 4000 dollars per wafer. TSMC was 5000 dollars per wafer for 16nm and samsung was worse and cheaper. 5nm TSMC is 16,000 dollars per wafer(I don't see any reports of 5nm decreasing in price really and mostly the opposite).
Add in inflation, cost to ship things have gotten more expensive and no way is Intel making a profit.
The reason Intel has to price this thing so low is because next gen parts are not too far off which will drive this into even lower prices. Intel needs to sell as many of these things as possible as the RTX 5060 and RX 8600 should be 20 to 30 percent faster than this chip for around 300 dollars.
Intel was left holding the bag with R and D and TSMC wafer obligations that they can't produce nothing. Gamers buying this should not complain when ARC pulls out and they are left with videocard paper weights in two years.