Intel Skylake CPUs are bending due to cooler mount pressure
Intel changed the thickness of the substrate for its Skylake (6th generation) Core processors. However the thinner, less rigid structure could lead to many well known coolers damaging the chip and/or the motherboard, says a report by PC Games Hardware in Germany.
The report says that due to the chip's weaker supporting structure, the pressure exerted by a number of well known coolers is simply too much and is causing components to bend. The mechanically weaker CPU, its pins, and the motherboard contacts can all be bent and sheared by the pressure exerted by cooler clamping mechanisms. Even if that doesn't happen straight away, as you system sits on its desk, the moving of the system anywhere, if it receives any knocks or bumps in transit, could result in the structural ill-effects.
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Intel: said that it has only been made aware of the issue in the last two days and it is therefore investigating what "could be several variables at play". Intel confirmed that Skylake uses a thinner substrate but it is rated for the same 50lb. maximum static load as prior generations.
Intel Investigates
We reached out to Intel for a comment about the situation. The company stated that it was made aware of the issue only within the last two days. Intel is currently investigating the issue, and a company representative said there could be several variables at play but noted that most vendors have relayed that they havent had any problems.
Intel did confirm that the substrate design for Skylake processors is indeed thinner than previous designs, but it is rated for the same 50lb. maximum static load as prior generations. The company stated that it doesnt test third party solutions, but it does provide detailed specifications guidelines for vendors to follow.
Until this situation has been sorted out, it may be a good idea to not travel with your Skylake-based PC unless you remove your heatsink first. If you are looking at building a new PC, stick with coolers that have been confirmed for now.
Intel has now provided an official statement:
The design specifications and guidelines for the 6th Gen Intel Core processor using the LGA 1151 socket are unchanged from previous generations and are available for partners and 3rd party manufacturers. Intel cant comment on 3rd party designs or their adherence to the recommended design specifications. For questions about a specific cooling product we must defer to the manufacturer.
Still uncertain if it's only due to some CPU aftermarket coolers or Intel going cheap on the Skylake substrate (like they did with the TIM on IB and onwards).
Maybe is to avoid more controversy.... well... is better to test instead to hear the "official" version.Arctic, Themalright, Coolermaster stated there are no issues for their coolers known.
http://www.computerbase.de/2015-12/intel-skylake-scythe-warnt-vor-schaeden-und-ruestet-kuehler-um/
Looks like Scythe screwed up.
Arctic, Themalright, Coolermaster stated there are no issues for their coolers known.
http://www.computerbase.de/2015-12/intel-skylake-scythe-warnt-vor-schaeden-und-ruestet-kuehler-um/
Looks like Scythe screwed up.
The thing won't be OC'ing the Core i3... is OC'ing the XEONS who will support. That would be X58 all again.Hands-on Review: Overclocking BCLK Core i3-6100 on SuperMicro C7H170-M
The potential here is huge.
www.jagatoc.com/2015/12/hands-on-review-overclocking-bclk-core-i3-6100-on-supermicro-c7h170-m
Nice find nvgpu.
BGA Skylake 4C/8T with GT4e (Iris Pro Graphics 580) arriving to desktops in all its glory @ early 2016. Intel finally embracing Iris Pro in their own NUCs.
Here's hoping for >50% better performance than Broadwell-K (current king of iGPUs) and reasonable pricing.
It's likely GT3e.
If they want to take down nVIDIA for good, they must subside this and not the crappy Atoms.Probably ungodly expensive.
Consequences to be the only alive.... seems that MS attempt ended really bad.... if that happens on the Surface, I can't imagine with the rest of the brands.... they are even stay on Haswell....Microsoft faces Surface tablet delays
Just when Microsoft has a product that is duffing up Apple, it is suffering from supply problems caused by Intel.
According to Digitimes, Microsoft's Surface Book and Surface Pro 4 2-in-1 are expected to see weaker-than-expected shipments in the fourth quarter because of Intel Skylake processor shortages.
The situation is so bad that some orders have been postponed to the first quarter of 2016. Redmond and its make supplier Pegatron have refused to comment on the news.
However Digitimes deep throats said that the Surface Book's monthly shipments will have a chance to surpass 100,000 units and around 200,000 units for Surface 4 in the first quarter.
BTW, not only IDC has left, but Tux Dave as well.
This forum; I haven't seen him in a while.Left the industry, or left this forum?