Intel Skylake / Kaby Lake

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Freejack2

Diamond Member
Dec 31, 2000
7,751
8
81
Thanks! Post number 10 confirms it. Thank god!

Seeing as we can use these heatsinks, what is the best for overclocking? I've seen Noctua and Coolermaster models being rated high, but I have no idea what has the most bang for the buck.

/still running on a modified Tuniq Tower. :whiste:
 

Dave2150

Senior member
Jan 20, 2015
639
178
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What are your specs?

He has a I7 930 X58 based system, or at least he did in April:

That has only scaled in core count, but not in price.




I do not like the idea of buying old tech, the 'high end' is too far behind for me to pay any attention to it anymore. We had a tick at 14nm, and soon we will have a tock. The idea of getting a bit better IPC and only 2 extra cores is not worth buying an entirely new mobo/ram/cpu....

I think the latest rumors are the broadwell highend will be out in 2016, that is after a skylake launch...

Ideally id like to drop a good $2000 or so and not think about a PC upgrade for another 3-4 years (other then GPU upgrades). I think that is part of my problem, the mainstream intel CPU are always so disappointing, while the highend are always so behind. I never feel like there is a good time to upgrade.



I have a 930, not 970. I do have a basic understanding of CPU archictuture, but your post more or less seems to be implying the reason why things are so expensive is so Intel can spend all that money on RND... I don't buy that.

A 6700k would be a massive upgrade from a I7 930 - though if you feel it's not a large enough jump, then a x5660/x5670 Xeon would be a cheap alternative, though you'd obviously be stuck with year 2008 connectivity options.
 

Sweepr

Diamond Member
May 12, 2006
5,148
1,142
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Intel Core “Skylake-S” CPUs to sport advanced power supply circuitry





...Adding capacitors to the power supply circuit of the Core i7-4790K “Devil’s Canyon” improved its average overclocking potential compared to the Core i7-4770K “Haswell”, thus one would expect the chip giant to use something similar on other microprocessors. Based on pictures of Intel Core i7-6700K published by Expreview and PCOnline.com.cn, the unlocked “Skylake” comes with power circuit that looks to be even more sophisticated than the one found on the “Devil’s Canyon”.

The amount of capacitors on the bottom of the Core i7-6700K “Skylake” is extremely high. Moreover, there are different types of capacitors with different capacitance, which means that power supply of Intel’s “Skylake” LGA1151 processors is completely different than power supply of Intel’s “Haswell” and “Devil’s Canyon” CPUs (which is logical, given the fact that the new chip lacks integrated voltage regulator). Moreover, the amount of elements in the circuit indicates that Intel wanted to ensure maximum overclocking potential of its new central processing unit. Still, keeping in mind that internal thermal interface of “Skylake” is similar to that of “Devil’s Canyon”, there will be limitations in overclockability of the new chips.

www.kitguru.net/components/cpu/anto...sors-to-sport-advanced-power-supply-circuitry

Alos MSI's motherboards listed @ ShopBLT: www.shopblt.com/search/order_id=%21ORDERID%21&s_max=25&t_all=1&s_all=skylake
 
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mrtastee

Junior Member
May 29, 2008
10
7
81
Moreover, the amount of elements in the circuit indicates that Intel wanted to ensure maximum overclocking potential of its new central processing unit.
Yet they won't even solder the god damn IHS.
 

ClockHound

Golden Member
Nov 27, 2007
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Yet they won't even solder the god damn IHS.

Blame the god damn iGPU... There's an older thread here that talks about the issues of solder fracturing with HW/BD/Sky iGPU dies. Intel went with TIM for reliability purposes...with adverse thermal effects due to the sloppy IHS mounting tolerances.
 

PPB

Golden Member
Jul 5, 2013
1,118
168
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Overclocking potential and yet you will still need to delid it to reach that potential without going for obsene ammounts of cooling.
 

MrTeal

Diamond Member
Dec 7, 2003
3,603
1,803
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Blame the god damn iGPU... There's an older thread here that talks about the issues of solder fracturing with HW/BD/Sky iGPU dies. Intel went with TIM for reliability purposes...with adverse thermal effects due to the sloppy IHS mounting tolerances.

That's interesting if true. There's only a single die, and Intel was able to solder SB. 22nm Xeons are soldered, so it seems strange that it's a technical limitation as opposed to a cost saving one.
 

cytg111

Lifer
Mar 17, 2008
23,956
13,472
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Overclocking potential and yet you will still need to delid it to reach that potential without going for obsene ammounts of cooling.

we have no data on the thermal profile yet, as far as I know ?
 

inf64

Diamond Member
Mar 11, 2011
3,863
4,540
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Looking at those benchmarks I feel really good about my 4690K+Z97 MS gaming purchase . I'm running 4.3Ghz core/4.2Ghz uncore @ 1.2Vcore, temps don't exceed 70C under full load on all 4 cores, 1600MHz 8GB DDR3 CL9 memory and watercooled via CM Seidon 120V. All cost me much less $ than yet-to-launch locked Skylake-S that performs the same or worse than what I have now( even at stock). Plus motherboards seem overpriced at this time so Haswell was the best way for me.
 
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Abwx

Lifer
Apr 2, 2011
11,517
4,303
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Explanations are almost totaly wrong..

Those capacitors are here for power supply decoupling purpose, the electrical points being decoupled are within the die but the capacitors cant be integrated given their size.

Increasing decouplings points, and total decoupling capacitance, allow to reduce voltages drops here and there within the chip, more capacitors are rather an indication that it is basicaly less stable than Haswell, and that Intel wants eventualy to reduce the voltage margins as a mean to reach the targeted perf/Watts "improvements".
 

ClockHound

Golden Member
Nov 27, 2007
1,111
219
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That's interesting if true. There's only a single die, and Intel was able to solder SB. 22nm Xeons are soldered, so it seems strange that it's a technical limitation as opposed to a cost saving one.

I agree it does sure does look like a cost-saving, but I recall there being a 'sound technical' reason for it. It was a statement made sometime last year, I will appropriate (incorrectly) to IDC or other silicognoscenti.

I can search the archives and report back. Probably in the same century.
 

crashtech

Lifer
Jan 4, 2013
10,573
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That's interesting if true. There's only a single die, and Intel was able to solder SB. 22nm Xeons are soldered, so it seems strange that it's a technical limitation as opposed to a cost saving one.
I don't think the E3 Xeons were soldered.
 

Wall Street

Senior member
Mar 28, 2012
691
44
91
Explanations are almost totaly wrong..

Those capacitors are here for power supply decoupling purpose, the electrical points being decoupled are within the die but the capacitors cant be integrated given their size.

Increasing decouplings points, and total decoupling capacitance, allow to reduce voltages drops here and there within the chip, more capacitors are rather an indication that it is basicaly less stable than Haswell, and that Intel wants eventualy to reduce the voltage margins as a mean to reach the targeted perf/Watts "improvements".

A big part of comparing the number of caps also has to do with the lack of the FIVR relative to Haswell/Broadwell, which could switch faster to avoid droop and therefore required less capacitors.
 
Jul 26, 2006
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He has a I7 930 X58 based system, or at least he did in April:

A 6700k would be a massive upgrade from a I7 930 - though if you feel it's not a large enough jump, then a x5660/x5670 Xeon would be a cheap alternative, though you'd obviously be stuck with year 2008 connectivity options.

You are crafty, I like that

Yeah the 6700k would be a huge jump, but it's a principle thing. I cannot bring myself to 'reward' Intel for this lame improvement over the last generation.


What a ridiculous thing to say.

Are you drunk?
You never contributed anything to my post but condescending useless remarks, so why would I want to hear what you have to say?




Ahh, I didn't see that post. Off to do an edit!


Wow, classy move... People like you are why the world is in such a mess. I had an issue with one poster, and you went out of your way to create more hate. Although you are a horrible person, on the plus side im sure your original post had no value and saved me from reading it.

Insulting other members is not allowed.
Markfw900
 
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Mar 10, 2006
11,715
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You are crafty, I like that

Yeah the 6700k would be a huge jump, but it's a principle thing. I cannot bring myself to 'reward' Intel for this lame improvement over the last generation.

Chip development is hard. Making improvements gen/gen is hard. If Intel could increase performance at a more rapid clip gen/gen while keeping in mind its many other constraints, I'm sure it would do so, as the company does itself no favors by offering products that are, or are perceived to be, "lame" improvements over the prior gen.

At any rate, I'd suggest forgetting about whether you want to "reward" Intel or not. If you need/want a new system (and it seems that you do), then I recommend that you just buy the product that best fits your needs and enjoy it.

Sounds like a 6700K would be a great upgrade for you, as would a 5820K.
 
Jul 26, 2006
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I am convinced intel could release a semi decent priced hex core skylake if they wanted to.

The 5820k is too old, and the 6700k has all the aforementioned problems. So unless the skylake price and performance is better then the 'leaked' info, it looks like broadwell-e is my only hope.
 

ClockHound

Golden Member
Nov 27, 2007
1,111
219
106
That's interesting if true. There's only a single die, and Intel was able to solder SB. 22nm Xeons are soldered, so it seems strange that it's a technical limitation as opposed to a cost saving one.

Here's one of the authoritative quotes from IDC: http://forums.anandtech.com/showpost.php?p=34649505&postcount=32

He posits that:

"It is not unreasonable to suspect that Intel's engineers steered clear of the rigid solder and instead opted to adopt the more flexible thermal pad intermediate entirely out of concern over the cyclical thermomechanical stresses that are generated in heating and cooling of the CPU die."

That's what I recalled.

However, in the next paragraph he states:

"But we cannot be certain either. The mechanical forces are surely present, but they may not be large enough to be a practical concern. And the decision to avoid solder may have purely been one of cost-reduction, in which case we enthusiasts are not compromising anything in delidding as it were. "

I don't remember that part, it doesn't support my thesis, therefore isn't relevant to my point. :biggrin:
 

CHADBOGA

Platinum Member
Mar 31, 2009
2,135
832
136
You never contributed anything to my post but condescending useless remarks, so why would I want to hear what you have to say?
The only remark I made about your post was to ask what your current specs are.

You seem like a very paranoid individual.
 

escrow4

Diamond Member
Feb 4, 2013
3,339
122
106
I am convinced intel could release a semi decent priced hex core skylake if they wanted to.

The 5820k is too old, and the 6700k has all the aforementioned problems. So unless the skylake price and performance is better then the 'leaked' info, it looks like broadwell-e is my only hope.

An i7 930 has an equivalent passmark score to a 4170 which is a Haswell i3. Yes passmark is only a broad indicator and yes video encoding that 930 would excel but in single threaded tasks it would start to fall behind. The 5820K is far from old. At this point anything new would be a substantial upgrade especially regarding chipset.
 
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