That Intel article is HIGHLY misleading, besides being speculative. It makes this out to be an "Intel" problem, whereas it is a problem getting equipment from a supplier. Anybody doing 0.13 right now is likely in the same boat, ie. can't get those SVG tools, unless there is an alternate supplier of the same technology. That "Geeks" article is full of mistakes - actually, it should read "SVGI" tools as that is the actual name of the company (Silicon Valley Group Inc.), they have no idea of the correct number of Intel fabs nor which are/are not moving to 300mm, and they don't even seem to know the different Intel parts that are currently shipping on 0.13 (P3's, P3 mobile, and those "super Celeries" (ie. the 1.2 and up).
Interesting to see that the SOI wafers will also come in 300mm, the previous stories had only mentioned 200mm, which seemed like a stupid move for anybody to use considering the mass transition by the entire industry to 300mm. Although the wafers shipped to AMD must be only 200mm, as the articles all say that Soitec is just now sampling the 300mm wafers. So I would hazard to guess that the wafers that AMD will be receiving will indeed be used for something before Hammer, as by the time Hammer is in production 300mm will be standard.