- Feb 2, 2008
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Intel claimed to have improved the TIM for Devil's Canyon but according to this article that didn't happen.
Another article finds a 16C bottleneck at just stock with the 6700K due to the TIM and that's not even with a high-quality solder. Since the substrate is significantly thinner the delidding thing is even riskier than before.
Skylake delidding, Does it improve Thermals?
previously:
Intel cuts corners on Ivy Bridge Thermal Interface Material (TIM)
Intel Devils Canyon chips NGPTIM is still not efficient research
The only significant cost associated with using quality thermal transfer material is that it would end the delidding practice for the most part, robbing Intel of profit from killed chips in pursuit of effective heat transfer.
Another article finds a 16C bottleneck at just stock with the 6700K due to the TIM and that's not even with a high-quality solder. Since the substrate is significantly thinner the delidding thing is even riskier than before.
Skylake delidding, Does it improve Thermals?
OC3D said:Japanese Publication PC Watch has delidded Skylake revealing a tiny CPU die and a much thinner IHS, than previous generation Broadwell and Haswell based CPUs. PC Watch has used the popular vice method for deliding their i7 6700K, but it is worth noting that this method is more dangerous than with previous generation Intel CPUs, as the substrate of the CPU is much thinner. With Skylake the IHS is only 0.8m thick, compared to Haswell which is 1.1mm thick.
With the Coollaboratory TIM we see the most significant decreased in thermals, with the CPU dropping from 74 degrees to 58 degrees at stock settings and from 88 degrees to 68 degrees at an overclock of 4.6GHz. These results are highly significant, showing again that Intel's thermal solution ... will again force professional overclockers and enthusiasts to delid their chips in order to get the best thermal performance.
previously:
Intel cuts corners on Ivy Bridge Thermal Interface Material (TIM)
Hexus said:It has since been revealed, following intense forum discussion, with a report on the matter first from overclockers and then confirmed by Japanese tech portal, PC Watch, that Intel has moved away from using the fluxless solder found in Sandy Bridge and is instead applying run-of-the-mill thermal interface material paste, to join the chip's integrated heat spreader to the CPU die.
Though exact figures remain a secret, fluxless solder generally has a much improved thermal conductivity, typically in the range of 80W/mK, whilst a standard TIM paste has only 5W/mK, making the new solution potentially 16 times less efficient. With increasing die power densities, Ivy bridge should be even more demanding on thermal dissipation per metre, yet, thanks to testing from a PC Watch investigator, where the Ivy Bridge TIM was replaced with aftermarket alternatives, it was proven that the stock-TIM was the primary culprit in increased Ivy Bridge temperatures
Intel Devils Canyon chips NGPTIM is still not efficient research
KitGuru said:Intel Corp.s NGPTIM [next-generation polymer thermal interface material], which was supposed to bring back record overclocking capabilities to the companys processors is better than its predecessor, but is significantly worse than commercially available thermal interfaces, a new research has found out.
Earlier this year Intel Corp.s promised that its Core i7-4790K and Core i7-4690K Devils Canyon microprocessors will have considerably better overclocking potential compared to the original chips based on the Haswell micro-architecture released last year thanks to improved thermal interface between the die and the heat-spreader as well as revamped power supply circuity. However, actual overclocking attempts of a Core i7-4790K central processing unit by KitGurus reviewer Luke Hill did not reveal any breakthroughs. Apparently, the reason for that is quite simple: the new thermal interface that Intel uses still has limited efficiency.
With the latest Devils Canyon central processing units Intel started to use a new substance called the NGPTIM, which is more efficient than its predecessors. However, a research conducted by 3DNews web-site has revealed that the NGPTIM is far less efficient than even affordable thermal pastes available on the market.
In both cases Intels NGPTIM could only outperform KPT-8 (an old thermal paste developed in 1974 in the USSR) paste and was less efficient than inexpensive Arctic Cooling MX-2. Highly-efficient Coollaboratory Liquid Pro compound proved to be dramatically better than Intels NGPTIM.
The only significant cost associated with using quality thermal transfer material is that it would end the delidding practice for the most part, robbing Intel of profit from killed chips in pursuit of effective heat transfer.