blackened23
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- Jul 26, 2011
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Graphene transistors will be in use by 2020, Moore's law will not die. Graphene is not financially feasible right now, but it will be a thing by the end of this decade.
FD-SOI has little to do with GloFo. It was developed entirely outside of them, and has only recently (last 12 months) been licensed to them such that GloFo could offer it to their customers.
Claiming that GloFo is trumping TSMC because STM developed FDSOI and cross-licensed it to GloFo is not the same thing, that just means STM developed a better process flow...and so did Intel, nothing new there.
GloFo itself is still stuck with the same internal R&D problems, tied to IBM and guaranteed to lag behind TSMC by a year, if not two, at 20nm and beyond.
If GloFo's future depends on STM continuing to develop FDSOI nodes for them to cross-license then that is a dim future, nobody makes money being the middle man between two other middle men.
Graphene transistors will be in use by 2020, Moore's law will not die. Graphene is not financially feasible right now, but it will be a thing by the end of this decade.
So what will graphene bring? Will it enable going to 7 nm (and how far below that going forward)? Any other advantages like lower power consumption, stackable dies, or similar?
7 nm is estimated to become available in 2020 according to this Wikipedia article by the way:
http://en.wikipedia.org/wiki/Semiconductor_device_fabrication
Here's a good overview of where the players are placing their bets (FD SOI, FinFET, III-V): http://www.eetimes.com/document.asp?doc_id=1262887&page_number=1
I wouldn't get excited about graphene just yet.
DARPA looks at future technologies more than any other company or organization. So if the director of DARPA is saying there is meaning to it. Colwell also says economics and not just physics will bring the death of Moore's law.
Intel's FinFET has already proven superior to planar in every respect thus far, I don't think that article has a basis in reality.
In that article the only one hedging anything on planar is IBM, and that's clearly for much smaller geometries. No one is saying that Intel's 22nm finFETs aren't superior to the planar processes currently out.
And Ivy Bridge was noted for its inferior overclockability, although that's a very niche segment.
And Ivy Bridge was noted for its inferior overclockability, although that's a very niche segment.
The 22nm with FinFET process is designed for low leakage and in that respect it is far better than planar. These devices are going into low power mobile devices, so low leakage (= low power consumption) is obviously the proper path forward for mobility and efficiency. This is what the market for mobile products and enterprise products demand. Efficiency. Intel's process delivers in spades in that respect thanks to the low-leakage characteristics.
Overclocking has nothing to do with, anything, really. I don't know what has to do with this. The fact of the matter is Intel's 22nm with FinFETs will still be better than TSMCs 20nm.
Source: http://www.theregister.co.uk/2013/09/10/intel_reveals_14nm_pc_declares_moores_law_alive_and_well/As anyone who has been following the chip-baking industry knows, getting down to 7nm without the advent of commercially usable extreme ultraviolet (EUV) lithography will be a daunting task – Intel CTO Justin Rattner admitted as much to The Reg just this May.
But EUV is proving to be an elusive technology, as GlobalFoundries CEO Ajit Manocha told SEMICON 2013 this July. "We all know that EUV is late," he said. "We desperately need EUV, and EUV is still not ready."
Another chip-process researcher, speaking at that same conference, has gone so far as to have given up on EUV. "I'm not working on EUV at all," said Laurent Miller, CEO of Leti, the nanotechnologies arm of the French research-and-technology organization CEA. "Absolutely not, because I don't believe in it."
Exactly what inspires James to have such faith in the continuance of Moore's Law, she didn't say.
See how many different informed opinions there are about this? If graphene is possible then there's your further die shrinks below 5 nm, and if EUV is possible there's your 7/5 nm. No one person or organization can know for sure just yet how small we can really go and what's doable.
The fact of the matter is Intel's 22nm with FinFETs will still be better than TSMCs 20nm.
Taiwan Semiconductor Manufacturing Co. has released three silicon-validated reference flows within the open innovation platform (OIP) that enable 16 FinFET systems-on-chip (SoC) designs and 3D chip stacking packages.
Others are not waiting iddling...
http://www.xbitlabs.com/news/other/...ivers_16FinFET_and_3D_IC_Reference_Flows.html
Nvidia deeply unhappy with TSMC, claims 20nm essentially worthless
I just realized...
Didn't we reach commercial 22 nm last year. Now Intel's shipping a 14 nm laptop by the end of the year?!
That was....fast.
Any source?
Yes, Intel has said that they'll be shipping their first 14 nm chips ship this year.I think he's confusing limited ES units with units available for sale :
http://www.anandtech.com/show/7309/intel-14nm-progress-update-broadwell-airmont-on-schedule
We *should* see some 14nm stuff floating around very very limited this year (most likely to see them internally at Dell/HP/etc for validation/testing) but not buyable/final until '14. Still fast, but not 1 year fast.