IVY E uses solder tim as expected, see delidded (and killed) 4960X with solder tim

[rge2]

Sorry but I don't buy it.. Please have a look at this. It's the evolution of recent chip dies. I think I've never linked something on this forum and hope it works:

http://i1-news.softpedia-static.com...3-Haswell-Processor-Reportedly-Pictured-3.png

Those images used for this post don't look like a Haswell lid. It has no lips like all others so the LGA bracket can hold on. And the chip itself, looks more like an old model which maybe someone could identify.

One pic has a blade inserted while the TIM on top of the lid is intact -yeah, try that on a Sunday morning-, fully covering every detail regarding markings, model type, etc. On other images, the info is deliberately blanked.

Haswells are like Ivys and Sandys, rectangular shaped chips. Enthusiasts are cool peeps but not cool enough for Intel to make a totally different chip, retaining system and lid.

I call it a pile of ungulate dropping. -ʇıɥsןןnq :ןɐınboןןoɔ-

You must be an AMD'er since you dont seem familiar with intel cpus.

As IDC pointed out, IVY (mobile/performance desktop) and IVY E (xeon server chip based/enthusiast cpu) are not same die. Here is chart in andantech link below, look at die size difference between Sandy and Sandy E. Enthusiast server based chips can be 2x size and 2x TDP of their mobile/performance desktop counterpart.
http://www.anandtech.com/show/7003/the-haswell-review-intel-core-i74770k-i54560k-tested/5

Also Topcc who posted that pic, has done very accurate benches of ES samples for intel chips for several years before NDA is up, and is typically quoted in several news articles because his history of giving honest information prior to NDA, and yeah hiding the serial number is a no brainer, like sushiwarrior just stated.

As an aside, before calling BS on something, I would at least spend a few minutes investigating the obvious. You showed a picture of an apple (ivy/haswell), to state the inside of an orange (xeon/extreme) was falsified.

 

[Michael Meio]

Ok, it's a Haswell with 3kg of welding material, squared shape with odd PCB layout, 4 notches instead of two, a lid that doesn't match LGA 1150 bracket, no retaining lips, no probe contacts on PCB perimeter, etc. hmm Probably not.

It's just pictures.

" ...You must be an AMD'er since you dont seem familiar with intel cpus.... " huh?.. what is AMD? .. J/K ..on the contrary dear, read on:

We'll see, but if I'm wrong, I'll send you a pizza roll.

This doesn't mean that Haswelo's Enthusiasts Uber Performing E-Class Superoverclockable Chips won't come with welded carapace. I mean, of course they could -and should- but that set of pictures show nothing about a Haswell.

It is another thing someone decided to call Haswell. Could be the peeps from Santa Clara, the spies or just someone laughing atm.

Those pictures look more like a 2011 to me.

 

[sushiwarrior]

Ok, it's a Haswell with 3kg of welding materiall

I think you're getting confused by the picture - that isn't one solid blob of solder, most of the "shiny" is the reflective surface of the CPU, with only ~1/3 of the CPU having solder still left on it (in a big blob).

 

[crashtech]

Those pictures look more like a 2011 to me.

Uh, Ivy-E IS 2011.

 

[zephyrprime]

Features are not disabled to support binning. There are hundreds and hundreds of instructions on any chip. If features were disabled to provide more bins, there would be thousands of skus. Only cache lines have redundancy that exploited for higher useful yields.

 

[rge2]

Ok, it's a Haswell with 3kg of welding material, squared shape with odd PCB layout, 4 notches instead of two, a lid that doesn't match LGA 1150 bracket, no retaining lips, no probe contacts on PCB perimeter, etc. hmm Probably not.

It's just pictures.

" ...You must be an AMD'er since you dont seem familiar with intel cpus.... " huh?.. what is AMD? .. J/K ..on the contrary dear, read on:

We'll see, but if I'm wrong, I'll send you a pizza roll.

This doesn't mean that Haswelo's Enthusiasts Uber Performing E-Class Superoverclockable Chips won't come with welded carapace. I mean, of course they could -and should- but that set of pictures show nothing about a Haswell.

It is another thing someone decided to call Haswell. Could be the peeps from Santa Clara, the spies or just someone laughing atm.

Those pictures look more like a 2011 to me.

Well we agree on something, it is not haswell. As the title of thread clearly states it is a picture of IVY E, not Haswell E. But I have read enough of Toppc posts (does a lot of benching) over years to know it is likely a legit picture. Usually dont judge others by 1 or 2 posts, though clearly exceptions exist.

 

[Michael Meio]

Sorry, got it wrong.. for some reason I confused the OP reference with the Haswell line and started looking way ahead.

Here is where I got confused:

"For those who have LGA 2011 motherboards already, however, there comes some bad news: the same unnamed source claims that the new Haswell E chips will require a brand-new chipset dubbed X99, meaning it is unlikely to be compatible with existing X79-based LGA 2011 motherboards..."

This was published on February.

There are also other sources that name the socket 2011-3, so they could not be compatible after all.

And when I said 2011, I actually meant 2011. Please be patient and have a look at this:

http://cdn2.wccftech.com/wp-content/uploads/2013/06/Haswell_E-LGA-2011-3-Socket.jpg

Ok, this is why I said it's not a Haswell-E, but a 2011. I should have looked closer on the OP references. My bad.

I was just comparing the shape of the die after checking that the lid didn't fit 1150 or 2011. You too should look at the picture I linked here: That doesn't fit the 2011-3 specs.

I apologize for not being more specific and I am more than willing to stand corrected if necessary. I will not call things that seem to me as fake any names avoiding misunderstandings.

 

[SOFTengCOMPelec]

Features are not disabled to support binning. There are hundreds and hundreds of instructions on any chip. If features were disabled to provide more bins, there would be thousands of skus. Only cache lines have redundancy that exploited for higher useful yields.

Makes sense.
What I was saying was guess work on my part, and not based on any factual reference sources.

I'm quite happy for my guesses, to be 101% wrong. (It would be better if they were right, but statistically and in real-life they will be wrong, sometimes).

Thanks for the correction.