- Mar 10, 2011
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AMD’s code-named “Arctic Islands” family of products will include three brand-new chips – “Greenland”, “Baffin” and “Ellesmere” – a source with knowledge of AMD plans said. The “Greenland” will be the new flagship offering for performance enthusiasts, whereas the “Baffin” and “Ellesmere” will target other market segments, such as high-end and mainstream. It is unclear whether the “Arctic Islands” family will take in any existing products, but it is possible that AMD may address certain markets with previous-gen products.
The “Greenland” graphics processor will rely on the second-generation high-bandwidth memory (HBM), so expect ultra-high-end graphics cards and professional solutions with up to 32GB of DRAM onboard with bandwidth of up to 1TB/s. Consumer-class “Greenland”-based products will likely come with 8GB – 16GB of memory. Due to usage of HBM, expect the “Greenland” chip and upcoming graphics cards on its base to resemble the currently available AMD Radeon R9 Fury-series adapters.
The number of transistors inside the “Greenland” as well as its die size are unknown. Since 14nm/16nm FinFET manufacturing technologies have considerably (up to 90 per cent) higher transistor density than contemporary TSMC’s 28nm fabrication process, it is logical to expect that the new flagship product will feature 15 – 18 billion of elements if it retains around 600mm² die size from the “Fiji”.
It is believed that AMD has already taped-out its “Greenland” graphics processing unit and is about to get the first silicon in the coming weeks.
Source: http://www.kitguru.net/components/g...gpus-for-2016-greenland-baffin-and-ellesmere/