Lapping Retail P4 HSF

[SkuLLyRT]

Hey,

Just recently picked up another cpu to replace one that died on me, and I realized that I definately don't have 40$+ to spend on a Alpha/Swiftech HSF combo to cool it. So I was looking at the retail hsf that came with my old cpu, and noticed that there were quite a few abrasions on the bottom of it from removal of the thermal pad that it comes with. So I figured that it would be cheaper to spend 3$ on sandpaper to lap the hsf, than to spend 40$+ that I don't have on a new hsf combo.

I've found quite a few 'how to' guides on the net, but I wanted to know what your personal opinions were. Is there anything that I should know before I lap away? Is there any possibility that after lapping my hsf that the lockdown brackets won't function correctly anymore?

Thanks for all of your help!

- Hip

 

[Jeff H]

SkuLLyRT, have you used an Intel retail HSF for P4 before? If anything positive would come out of it (and lapping won't make a difference in base thickness), it would remove enough of the base to reduce the tendancy of the heatsink to warp the mainboard. It would be nice if it would do that, but realistically you're not removing enough of the heatsink base to make a difference in how the heatsink torques down on the processor slug.

 

[mrman3k]

I hav enever heard of the board having problems from warping. It only becomes a problem if you keep taking the HS off and on often.

 

[OulOat]

Look at the old thread

 

[Jeff H]

mrman3k, by warping I meant that the Intel retail HSF applies so much force to the board that it literally bends the board, albeit slightlty, when it's cranked down. Both Intel and the board mfgrs. indicate this is a normal situation. This was discussed rather widely early in the P4 product cycle.

 

[XMan]

Originally posted by: Jeff H
mrman3k, by warping I meant that the Intel retail HSF applies so much force to the board that it literally bends the board, albeit slightlty, when it's cranked down. Both Intel and the board mfgrs. indicate this is a normal situation. This was discussed rather widely early in the P4 product cycle.

Don't they design the boards to handle some amount of warpage?

 

[Jeff H]

X-Man, that's the position Intel and the board mfgr's put forth. I'm sure it's OK, but nevertheless it's a bit disconcerting IMHO to see the force required to lock down an Intel retail HSF and the resultant bend it puts on the board.

 

[Supradude]

hm... the retail sink bends the board? interesting... i just applied artic silver to my 2.4b today and replaced the HSF... the retail locking mechanism is so easy to use it doesn't even feel like it's applying enough pressure at all...the board seems fine, although i suppose anyway you look at it having stresses on the board mounts would cause some bending... as for lapping, i doubt it will do much good... AS v.s. the stock thermal film/paste didn't really make much of a diff, say a degree or two...

 

[Antoneo]

I agree with SupraDude, the retail P4 heatsink for by 1.6A required very little force. Put heatsink on, push down one lever, push down the next, all done. No warpage at all of the motherboard (EPoX 4G4a+) as far as I can tell.

 

[Jayczar]

I have a Gigabyte board here in the shop that is
badly warped from the strain of the retail fan
it still works though, for how long who knows.