Isn't that a Thermalright Ultra 120? It should still work fine? That thing with a fan weighs 1 Kg.Quick and dirty 5Ghz OC @ 1.36v, RAM @ 2133 / C15 (by the way, still on the POS air cooling - https://s22.postimg.org/bicwzvzfl/POS_Air_Cooler.jpg):
yummi
Looks like intel screwed up the TIM real good again. Guess they dont think they need to learn from previous mistakes because they have such a market share advantage.
The cynic in me believes Intel purposely did this to allow them to release a Devil's Canyon version should Zen get too close performance wise.
Looking at this through a business lens, Intel can release the 7700k and cause enough Internet chatter to take the focus (somewhat) away from Zen and then once Zen lands, Intel has the option to release a Devil's Canyon type 7700k to solidify their number 1 position over Zen.
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That won't happen. i7-7700k already clocks so high that another 100 or 200 Mhz increase won't really have an impact. It's 4 cores vs 8 cores after all. Not everything can be compensated with a high clock frequency.
yummi
Fair point, though I'm guessing only a relatively small user base we really benefit from more cores (this is probably me being ignorant) and therefore the majority of consumer tasks will still perform better on a 7700k+.
The cynic in me believes Intel purposely did this to allow them to release a Devil's Canyon version should Zen get too close performance wise.
Looking at this through a business lens, Intel can release the 7700k and cause enough Internet chatter to take the focus (somewhat) away from Zen and then once Zen lands, Intel has the option to release a Devil's Canyon type 7700k to solidify their number 1 position over Zen.
Maybe, who knows.
There are loads of internet 'theories' over Intel's manufacturing process / rationale for the current TIM / IHS setup - it'd be nice to hear from an Intel engineer if there is a genuine technical reason for this.
One thing I would like to point out is it didn't appear the adhesive was raising the IHS. I should have taken some pics, but I could see a small gap between the IHS and PCB when i put the IHS on top of the naked die, so I believe this theory is false.
The "devil's canyon" of which you speak will be Kaby Lake-X on the HEDT platform. Same Kaby Lake CPU die, but likely solder instead of the weaksauce thermal paste found on the mainstream chips.
The reason that the cheap-o paste is used is that the 7700k is fundamentally the same product as the lower end, locked SKUs, just binned and unlocked. They aren't going to do an entirely separate packaging job just for one SKU.
not all, i only delid the cpus which are good with stock TIM. if a cpu need more than 1.3-1.32v for 5GHz its uninteresting for me.
Edit: same CPU before & after delidding, 30min 1344k Prime test
Edit: same CPU before & after delidding, 30min 1344k Prime test